公开(公告)号：US20240212637A1

公开(公告)日：2024-06-27

申请号：US18593541

申请日：2024-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunki KIM ,  Kwangmin KIM ,  Hyuntaek NA ,  Wunkil LEE ,  Hongchul LEE ,  Gucheol JEONG ,  Hyeonjin CHOI

IPC: G09G3/34

CPC classification number: G09G3/3426 ,  G09G2320/0233 ,  G09G2320/0626 ,  G09G2330/021

Abstract: A display apparatus comprising: a first power supply unit; a second power supply unit; a first switching unit; a second switching unit; a display panel; a backlight unit for providing light to the display panel by means of the first light emitting elements and second light emitting elements; a first driver for driving the first light emitting elements using the supplied power; a second driver for driving the second light emitting elements using supplied power; and at least one processor, individually and/or collectively, configured to provide power supplied from the first power supply unit and the second power supply unit to the first driver and the second driver, or provide power supplied from only the first power supply to the first driver and the second driver, by controlling the first switching unit and the second switching unit based on user input for adjusting luminance of the display panel.

公开(公告)号：US20250022866A1

公开(公告)日：2025-01-16

申请号：US18409931

申请日：2024-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghyeon JEONG ,  Hyunki KIM ,  Junga LEE

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a substrate, a passive element on the substrate, and a connection terminal connecting the substrate to the passive element. The substrate includes a base portion comprising an element pad connected to the connection terminal, and an upper insulating layer on the base portion to expose at least a portion of the base portion. The passive element is in contact with the upper insulating layer, and a thickness of the connection terminal and a thickness of the upper insulating layer are equal to each other.

公开(公告)号：US20150083969A1

公开(公告)日：2015-03-26

申请号：US14494673

申请日：2014-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunki KIM ,  Shin Ae JUN ,  Eun Joo JANG ,  Yongwook KIM ,  Tae Gon KIM ,  Yuho WON ,  Taekhoon KIM ,  Hyo Sook JANG

IPC: C09K11/88

CPC classification number: C09K11/883 ,  B82Y20/00 ,  B82Y40/00 ,  C09K11/025 ,  C09K11/565 ,  C09K11/61 ,  C09K11/612 ,  C09K11/70 ,  C09K11/705 ,  C09K11/88 ,  Y10S977/774 ,  Y10S977/892 ,  Y10S977/95

Abstract: A nanocrystal particle including at least one semiconductor material and at least one halogen element, the nanocrystal particle including: a core comprising a first semiconductor nanocrystal; and a shell surrounding the core and comprising a crystalline or amorphous material, wherein the halogen element is present as being doped therein or as a metal halide

Abstract translation: 包括至少一种半导体材料和至少一种卤素元素的纳米晶体颗粒，所述纳米晶体颗粒包括：包含第一半导体纳米晶体的芯; 以及围绕所述芯并且包含结晶或非晶材料的壳，其中所述卤素元素作为掺杂在其中或作为金属卤化物存在

公开(公告)号：US20210202352A1

公开(公告)日：2021-07-01

申请号：US17203084

申请日：2021-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunki KIM ,  Sangsoo KIM ,  Seung Hwan KIM ,  Kyung Suk OH ,  Yongkwan LEE ,  Jongho LEE

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/00 ,  H01L23/367 ,  H01L25/07

Abstract: Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.

公开(公告)号：US20230365862A1

公开(公告)日：2023-11-16

申请号：US18354182

申请日：2023-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunki KIM ,  Shin Ae JUN ,  Eun Joo JANG ,  Yongwook KIM ,  Tae Gon KIM ,  Yuho WON ,  Taekhoon KIM ,  Hyo Sook JANG

IPC: C09K11/88 ,  C09K11/72 ,  H01L29/06 ,  H01L29/22 ,  C09K11/61 ,  C09K11/02 ,  C09K11/70 ,  C09K11/56

CPC classification number: C09K11/883 ,  C09K11/025 ,  C09K11/565 ,  C09K11/61 ,  C09K11/612 ,  C09K11/70 ,  C09K11/705 ,  C09K11/72 ,  C09K11/722 ,  C09K11/88 ,  H01L29/0665 ,  H01L29/22 ,  B82Y40/00

Abstract: A nanocrystal particle including at least one semiconductor material and at least one halogen element, the nanocrystal particle including: a core comprising a first semiconductor nanocrystal; and a shell surrounding the core and comprising a crystalline or amorphous material, wherein the halogen element is present as being doped therein or as a metal halide

公开(公告)号：US20230046069A1

公开(公告)日：2023-02-16

申请号：US17713733

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changmin HAN ,  Hyunki KIM ,  Huijun SHIM ,  Jaekwang LEE

IPC: G06F3/042

Abstract: A touch display apparatus is provided. The touch display apparatus includes a display panel including a display surface, a light guide plate disposed over the display surface of the display panel and formed to emit light incident into one side surface of the light guide plate through an upper surface of the light guide plate, a first light source array disposed on one side of the light guide plate and including a plurality of infrared light sources configured to emit infrared rays to an one side surface of the light guide plate, a camera disposed on at least one side of the first light source array and configured to photograph infrared rays emitted through an entire area of the upper surface of the light guide plate, and a processor configured to recognize coordinates of an input object adjacent to the upper surface of the light guide plate using infrared rays images captured by the camera.

公开(公告)号：US20210375831A1

公开(公告)日：2021-12-02

申请号：US17399233

申请日：2021-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho PARK ,  Kyungsuk OH ,  Hyunki KIM ,  Yongkwan LEE ,  Sangsoo KIM ,  Seungkon MOK ,  Junyoung OH ,  Changyoung YOO

IPC: H01L25/065 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

公开(公告)号：US20240047411A1

公开(公告)日：2024-02-08

申请号：US18127513

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junga LEE ,  Youngja KIM ,  Hyunki KIM ,  Youngmin LEE

IPC: H01L23/00 ,  B23K1/015 ,  B23K1/00 ,  B23K3/047

CPC classification number: H01L24/75 ,  B23K1/015 ,  B23K1/0016 ,  B23K3/047 ,  B23K2101/40

Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

公开(公告)号：US20220189835A1

公开(公告)日：2022-06-16

申请号：US17376883

申请日：2021-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin YIM ,  Dongwook KIM ,  Hyunki KIM ,  Jongbo SHIM ,  Jihwang KIM ,  Sungkyu PARK ,  Yongkwan LEE ,  Byoungwook JANG

IPC: H01L23/12 ,  H01L23/538

Abstract: A semiconductor package including a first package substrate, a first semiconductor chip on the first package substrate, a first conductive connector on the first package substrate and laterally spaced apart from the first semiconductor chip, an interposer substrate on the first semiconductor chip and electrically connected to the first package substrate through the first conductive connector, the interposer substrate including a first portion overlapping the first semiconductor chip and a plurality of upper conductive pads in the first portion, a plurality of spacers on a lower surface of the first portion of the interposer substrate and positioned so as not to overlap the plurality of upper conductive pads in a plan view, and an insulating filler between the interposer substrate and the first package substrate may be provided.

公开(公告)号：US20160214862A1

公开(公告)日：2016-07-28

申请号：US14908710

申请日：2014-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taekhoon KIM ,  Eun Joo JANG ,  Hyo Sook JANG ,  Shin Ae JUN ,  Hyunki KIM

IPC: C01B19/00 ,  H01B1/02

Abstract: A process of synthesizing Mg—Se nanocrystals is provided, the process including reacting a first precursor including magnesium and a second precursor including selenium in the presence of a ligand compound in an organic solvent to form a nanocrystal of MgSe or an alloy thereof, wherein the organic solvent and the ligand compound do not include an oxygen functional group.

Abstract translation: 提供合成Mg-Se纳米晶体的方法，该方法包括在配体化合物存在下在有机溶剂中使包含镁的第一前体和包含硒的第二前体反应形成MgSe或其合金的纳米晶体，其中 有机溶剂和配体化合物不包括氧官能团。