SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE

    公开(公告)号:US20240276707A1

    公开(公告)日:2024-08-15

    申请号:US18435680

    申请日:2024-02-07

    摘要: A semiconductor device includes an active region, an isolation region on a side surface of the active region, a gate trench having a first trench portion crossing the active region and a second trench portion in the isolation region, a first gate portion within the first trench portion and a second gate portion within the second trench portion. The first gate portion and the second gate portion each includes a gate dielectric layer, a gate electrode on the gate dielectric layer, partially filling the gate trench, and having an upper surface disposed on a level lower than an upper end of the active region, and an insulative capping pattern on the gate electrode. The first gate portion includes a lower region, an intermediate region on the lower region, and an upper region on the intermediate region. A maximum width of the intermediate region is greater than a maximum width of the lower region and greater than a maximum width of the upper region.

    Active scheduling method and computing apparatus

    公开(公告)号:US12014215B2

    公开(公告)日:2024-06-18

    申请号:US17327600

    申请日:2021-05-21

    IPC分类号: G06F9/50 G06F9/38 G06F9/54

    摘要: An active scheduling method performed with a master processor and a plurality of slave processors. The method includes determining whether a job to be performed has a dependency by referencing a job queue; in a case in which it is determined that the job to be performed has a dependency, updating a state of the job to be performed in a table in which information of each of a plurality of jobs is recorded; analyzing a state of a job preceding the job to be performed based on the table; and in a case in which the job preceding the job to be performed is determined to have been completed, performing the job to be performed by retrieving the job to be performed from the job queue.

    INTEGRATED CIRCUIT DEVICE
    6.
    发明公开

    公开(公告)号:US20230200054A1

    公开(公告)日:2023-06-22

    申请号:US18084190

    申请日:2022-12-19

    摘要: An integrated circuit device includes a substrate having an active region, a conductive landing pad at a first vertical level above the substrate and connected to the active region, a capacitor including a lower electrode at a second vertical level higher than the first vertical level above the substrate, and a conductive multifunction plug including an extended landing pad portion at a third vertical level between the first vertical level and the second vertical level and contacting the conductive landing pad, and an extended lower electrode portion integrally connected to the extended landing pad portion and contacting the lower electrode. The capacitor further includes a dielectric layer covering a surface of the lower electrode and the extended lower electrode portion of the conductive multifunction plug.

    Electronic apparatus, and method for controlling same

    公开(公告)号:US11462010B2

    公开(公告)日:2022-10-04

    申请号:US16479993

    申请日:2017-12-07

    摘要: The various embodiments of the present invention relate to an electronic apparatus, and a method for controlling same. The electronic apparatus according to the present invention comprises a display, a communication module, and a processor electrically connected to the display and communication module, wherein the processor controls so that an object detected in an image displayed on the display is recognized, and one or more elements contained in the object are classified and displayed on the display, and can control so that an image similar to the detected object is searched for, by means of the communication module, and displayed on the display.

    SEMICONDUCTOR DEVICES
    9.
    发明公开

    公开(公告)号:US20240224503A1

    公开(公告)日:2024-07-04

    申请号:US18542627

    申请日:2023-12-16

    IPC分类号: H10B12/00

    CPC分类号: H10B12/315

    摘要: A semiconductor device includes a substrate, a first electrode disposed above the substrate, a multilayer dielectric structure configured to cover the first electrode, and a second electrode configured to cover the multilayer dielectric structure. The multilayer dielectric structure includes a plurality of dielectric films, a first dielectric film of the plurality of dielectric films includes crystalline TiO2 or crystalline SrTiO3, and a second dielectric film of the plurality of dielectric films is in contact with the first dielectric film and includes a high-k dielectric film having a tetragonal crystal structure.