公开(公告)号：US20240399532A1

公开(公告)日：2024-12-05

申请号：US18524745

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung Choi ,  Wonuk Yoon ,  Jaemook Kang ,  Keonwoo Kim ,  Sungyong Park ,  Hoseop Choi ,  Seonmin Yun ,  Jitae Lee

IPC: B24B41/047 ,  B24B37/20

Abstract: A polishing head of a CMP apparatus may include a head block, a distribution block and a segmentation type head module. The head block may configured to be positioned over a substrate. The distribution block may be rotatably connected to a lower surface of the head block with respect to a vertical direction. A plurality of pressure lines may be connected to the distribution block and configured to flow a working fluid therethrough. The segmentation type head module may be connected to the lower surface of the distribution block. The segmentation type head module may be configured to rotate with respect to the vertical direction together with the distribution block. The segmentation type head module may be configured to locally pressurize the substrate using the working fluid provided through the pressure lines.

公开(公告)号：US20240113616A1

公开(公告)日：2024-04-04

申请号：US18244652

申请日：2023-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyung LEE ,  Wooseok Jang ,  Keonwoo Kim ,  Moonyoung Kim ,  Haedeun Kim

IPC: H02M1/42 ,  H02M1/44 ,  H02M3/158

CPC classification number: H02M1/4225 ,  H02M1/44 ,  H02M3/158

Abstract: An electronic apparatus, including an electromagnetic interference (EMI) filter; a bridge diode connected to an output terminal of the EMI filter; and a power factor correction (PFC) connected to an output terminal of the bridge diode, and including a PFC integrated circuit (IC), wherein the PFC IC is configured to control an inductor current which flows in an inductor included in the PFC is maintained to be less than or equal to a predetermined current value, and wherein the predetermined current value is smaller than a current value of a current which flows in the inductor based on a peak voltage being applied to the PFC.

公开(公告)号：US12217984B2

公开(公告)日：2025-02-04

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

公开(公告)号：US12100370B1

公开(公告)日：2024-09-24

申请号：US18120791

申请日：2023-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeeun Kim ,  Keonwoo Kim ,  Moonyoung Kim ,  Jinhyung Lee ,  Jeongil Kang

IPC: G09G5/10

CPC classification number: G09G5/10 ,  G09G2320/0626 ,  G09G2330/021 ,  G09G2330/027

Abstract: A display apparatus includes: a display, a processor configured to process image data to be displayed on the display, a transformer including a primary coil and a plurality of secondary coils, a first rectifier connected with a first coil of the plurality of secondary coils and configured to output a first output voltage corresponding to a number of turns of the first coil, a direct current-direct current (DC-DC) converter configured to receive the first output voltage from the first rectifier and output a second output voltage that is different from the first output voltage, and a second rectifier connected with a second coil of the plurality of secondary coils and configured to output a first load voltage which is a sum of the second output voltage and a third output voltage corresponding to a number of turns of the second coil to the display.

公开(公告)号：US20230080991A1

公开(公告)日：2023-03-16

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

公开(公告)号：US20210159112A1

公开(公告)日：2021-05-27

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  H01J37/20

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

公开(公告)号：US11984344B2

公开(公告)日：2024-05-14

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01J37/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68742 ,  H01J37/20 ,  H01L21/67242 ,  H01L21/6831 ,  H01J2237/334

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.