公开(公告)号：US20240258178A1

公开(公告)日：2024-08-01

申请号：US18396878

申请日：2023-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsu LEE ,  Minsu KANG ,  Sangho YUN ,  Chan HWANG

IPC: H01L21/66

CPC classification number: H01L22/12

Abstract: A method of detecting overlay of patterns includes forming a lower pattern and an upper pattern on a substrate. A sample pattern is drawn that has a common tangential line with the lower pattern. A position of a real center of gravity of the lower pattern is calculated using the common tangential line.

公开(公告)号：US20200257295A1

公开(公告)日：2020-08-13

申请号：US16760168

申请日：2018-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho PARK ,  Sunggu KWON ,  Jihoon KIM ,  Kyungshik ROH ,  Minsu LEE

IPC: G05D1/02 ,  B64D47/08 ,  B64C39/02

Abstract: Various embodiments of the present invention relate to an unmanned aerial vehicle (UAV) and method for operating the same, and an automated guided vehicle (AGV) for controlling movements of the unmanned aerial vehicle. The unmanned aerial vehicle according to various embodiments of the present invention may comprise: a wireless communication circuit; at least one sensor; a processor operatively connected to the wireless communication circuit and the at least one sensor; and a memory operatively connected to the processor, wherein the memory stores instructions that, when executed, cause the processor to: receive a movement command for a movement with respect to the current location of the unmanned aerial vehicle, from an automated guided vehicle located within a predetermined distance from the unmanned aerial vehicle, by using the wireless communication circuit; acquire location-independent sensing information by using the at least one sensor, while the unmanned aerial vehicle moves according to the movement command; and transmit the location-independent sensing information to the automated guided vehicle so as to allow the automated guided vehicle to determine the location of the unmanned aerial vehicle by using the location-independent sensing information.

公开(公告)号：US20220328492A1

公开(公告)日：2022-10-13

申请号：US17847861

申请日：2022-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsu LEE ,  Kiseok LEE ,  Woobin SONG ,  Minhee CHO

IPC: H01L27/108 ,  G11C11/408 ,  G11C11/4094

Abstract: A semiconductor memory device includes a memory cell array of a three-dimensional structure including a plurality of memory cells repeatedly arranged in a first horizontal direction and a second horizontal direction that are parallel with a main surface of a substrate and cross each other on the substrate and in a vertical direction perpendicular to the main surface, wherein each of the plurality of memory cells includes three transistors. A method of manufacturing a semiconductor memory device includes forming simultaneously a plurality of memory cells arranged in a row in a vertical direction on a substrate, wherein each of the plurality of memory cells includes three transistors.

公开(公告)号：US20220302198A1

公开(公告)日：2022-09-22

申请号：US17528237

申请日：2021-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongsoon KANG ,  Mintae RYU ,  Minsu LEE ,  Wonsok LEE

IPC: H01L27/146 ,  H01L27/148

Abstract: An image sensor includes a first substrate. A photoelectric conversion region is in the first substrate. A first interlayer insulating layer is on the first substrate. A transistor includes a bonding insulating layer on the first interlayer insulating layer, a semiconductor layer on the bonding insulating layer, and a first gate on the semiconductor layer. A bias pad is spaced apart from the semiconductor layer by the bonding insulating layer. The bias pad overlaps the first gate in a planar view. A second interlayer insulating layer covers the transistor.

公开(公告)号：US20210183861A1

公开(公告)日：2021-06-17

申请号：US16930398

申请日：2020-07-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsu LEE ,  Kiseok LEE ,  Minwoo SONG ,  Hyun-Sil OH ,  Min Hee CHO

IPC: H01L27/108 ,  G11C7/18 ,  G11C8/14

Abstract: A three-dimensional semiconductor device includes a first channel pattern on and spaced apart from a substrate, the first channel pattern having a first end and a second end that are spaced apart from each other in a first direction parallel to a top surface of the substrate, and a first sidewall and a second sidewall connecting between the first end and the second end, the first and second sidewalls being spaced apart from each other in a second direction parallel to the top surface of the substrate, the second direction intersecting the first direction, a bit line in contact with the first end of the first channel pattern, the bit line extending in a third direction perpendicular to the top surface of the substrate, and a first gate electrode adjacent to the first sidewall of the first channel pattern.

公开(公告)号：US20210103296A1

公开(公告)日：2021-04-08

申请号：US17061454

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsu LEE ,  Sunggu KWON ,  Woong KWON ,  Sanghyeon KIM ,  Junho PARK ,  Jongbeom HER

IPC: G05D1/10 ,  B64C39/02 ,  B64F1/36 ,  B64D27/24 ,  G08G5/00 ,  G06Q10/08

Abstract: An embodiment disclosed herein relates to an unmanned aerial vehicle for inventory management and a method of operating the same. The unmanned aerial vehicle may include: at least one sensor configured to acquire at least one of inertia information or position information of the unmanned aerial vehicle; a communication unit configured to communicate with a control system; and a processor operably connected to the at least one sensor and the communication unit. The processor may be configured to: receive an inventory survey request from the control system; generate a route information of the unmanned aerial vehicle based on the received request and previously stored spatial information; and perform an inventory survey based on the generated route information.

公开(公告)号：US20210159231A1

公开(公告)日：2021-05-27

申请号：US16991661

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsu LEE ,  Kiseok LEE ,  Woobin SONG ,  Minhee CHO

IPC: H01L27/108 ,  G11C11/4094 ,  G11C11/408

Abstract: A semiconductor memory device includes a memory cell array of a three-dimensional structure including a plurality of memory cells repeatedly arranged in a first horizontal direction and a second horizontal direction that are parallel with a main surface of a substrate and cross each other on the substrate and in a vertical direction perpendicular to the main surface, wherein each of the plurality of memory cells includes three transistors. A method of manufacturing a semiconductor memory device includes forming simultaneously a plurality of memory cells arranged in a row in a vertical direction on a substrate, wherein each of the plurality of memory cells includes three transistors.

公开(公告)号：US20210072770A1

公开(公告)日：2021-03-11

申请号：US17013465

申请日：2020-09-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woong KWON ,  Junho PARK ,  Sunggu KWON ,  Jawon SEO ,  Kyungshik ROH ,  Minsu LEE

IPC: G05D1/10 ,  G05D1/00 ,  G05D1/04 ,  G05D1/08 ,  B64C39/02 ,  B64D47/08 ,  G06K7/14

Abstract: A multi-sensor based unmanned aerial vehicle and a method for controlling the same. The unmanned aerial vehicle may include: a sensor part configured to acquire inertia information or position information of the unmanned aerial vehicle; and a controller. The controller is configured to estimate the position of the unmanned aerial vehicle by applying the information acquired by the sensor part to an extended Kalman filter and control movement of the unmanned aerial vehicle, based on the estimated position of the unmanned aerial vehicle. The sensor part includes: an inertia sensor configured to acquire the inertia information of the unmanned aerial vehicle; a tag recognition sensor configured to recognize a tag attached to a rack and acquire absolute position information of the unmanned aerial vehicle; and an image sensor attached to the unmanned aerial vehicle so as to acquire an image of the movement environment of the unmanned aerial vehicle.