公开(公告)号：US11823927B2

公开(公告)日：2023-11-21

申请号：US17229197

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghun Han ,  Ingi Kim ,  Sangwoo Bae ,  Jungchul Lee ,  Minhwan Seo ,  Myeongock Ko ,  Youngjoo Lee ,  Taehyun Kim ,  Seulgi Lee

IPC: G01J3/14 ,  H01L21/67 ,  G02B7/02 ,  G06T5/20 ,  G06T7/00 ,  G01N21/41 ,  G01N21/95 ,  G01N21/65

CPC classification number: H01L21/67288 ,  G01N21/41 ,  G01N21/65 ,  G01N21/9505 ,  G02B7/021 ,  G06T5/20 ,  G06T7/0004 ,  G01N2021/653 ,  G01N2201/06113 ,  G06T2207/30148

Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.

公开(公告)号：US20220068681A1

公开(公告)日：2022-03-03

申请号：US17229197

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghun Han ,  Ingi Kim ,  Sangwoo Bae ,  Jungchul Lee ,  Minhwan Seo ,  Myeongock Ko ,  Youngjoo Lee ,  Taehyun Kim ,  Seulgi Lee

IPC: H01L21/67 ,  G02B7/02 ,  G06T5/20 ,  G06T7/00 ,  G01N21/65 ,  G01N21/41 ,  G01N21/95

Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.

公开(公告)号：US20240347370A1

公开(公告)日：2024-10-17

申请号：US18542172

申请日：2023-12-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongjoon Lee ,  Kyoungran Kim ,  Kwanghyeon Jeong ,  Myeongock Ko ,  Jaeuk Sim ,  Seongbeom Lee ,  Daesung Jung

IPC: H01L21/687 ,  H01L21/66 ,  H05F3/06

CPC classification number: H01L21/68742 ,  H01L22/14 ,  H05F3/06

Abstract: A carrier dechucking system includes a work carrier including a substrate having a first surface, an opposite second surface with a support film attached, and a ring frame surrounding the substrate. The work carrier is placed on a placement table having a support surface on which a lower surface of the support film is maintained, lifting pins configured to move the work carrier, an ionizer configured to eject ions to the lower surface, and a controller. The controller is configured to control the lifting pins to move the work carrier from the support surface to first and second levels, and to control the ionizer to remove static electricity charged on the support film from the support surface to the first level. At the first level, a surface voltage of the first surface of the substrate is lower than a surface voltage of the lower surface of the support film.

公开(公告)号：US12235287B2

公开(公告)日：2025-02-25

申请号：US17930819

申请日：2022-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daesung Jung ,  Myeongock Ko ,  Meehyun Lim

IPC: G01R1/07 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/20 ,  G01R31/28 ,  G02B27/28 ,  H01L21/683

Abstract: A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

公开(公告)号：US20230168278A1

公开(公告)日：2023-06-01

申请号：US17930819

申请日：2022-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daesung Jung ,  Myeongock Ko ,  Meehyun Lim

IPC: G01R1/07 ,  H01L21/683 ,  G02B27/28

CPC classification number: G01R1/071 ,  H01L21/6833 ,  G02B27/283

Abstract: A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.