公开(公告)号：US20210269599A1

公开(公告)日：2021-09-02

申请号：US17186294

申请日：2021-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Osaka Gas Chemicals Co., Ltd.

Inventor： Nobuji SAKAI ,  Hiroko ENDO ,  Yukika YAMADA ,  Eigo MIYAZAKI

IPC: C08G75/0236

Abstract: A triazine ring-containing polymer having a high refractive index and a low birefringence, and being capable of being subjected to injection molding, wherein the polymer having a repeating unit of *-[A-B-]-*, including a structural unit A derived from a triazinedithiol compound, and a structural unit B including an aromatic hydrocarbon group; and a thermoplastic resin, a thermoplastic article, and an optical part including the polymer.

公开(公告)号：US20180223127A1

公开(公告)日：2018-08-09

申请号：US15889607

申请日：2018-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung Kun CHO ,  Mikhail KOVALEV ,  Nobuji SAKAI ,  Myung Man KIM

IPC: C09D183/04 ,  C09D171/00

CPC classification number: C09D183/04 ,  C08G77/20 ,  C08L71/02 ,  C09D171/00 ,  C09D171/02 ,  C09D183/06 ,  C08L83/04 ,  C08L33/16 ,  C08L83/06

Abstract: An anti-fingerprinting composition having a self-healing property includes a polyrotaxane, a polyhedral silsesquioxane, and a fluorinated (meth)acryl compound.

公开(公告)号：US20180030269A1

公开(公告)日：2018-02-01

申请号：US15398895

申请日：2017-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Man KIM ,  Nobuji SAKAI ,  Chung Kun CHO ,  Mikhail KOVALEV

IPC: C08L75/16 ,  C08J7/04

CPC classification number: C08L75/16 ,  C08G18/4825 ,  C08G18/672 ,  C08G18/755 ,  C08J7/047 ,  C08J2375/16 ,  C08J2475/16 ,  C08J2483/08 ,  C09D175/16 ,  C08G18/48

Abstract: A self-healing polymer formulation includes a polyurethane (meth)acrylate, a siloxane (meth)acrylate, a nanoparticle, and a hardener, a polymer film includes a cured product of the polymer formulation, and an electronic device includes the same.

公开(公告)号：US20230022002A1

公开(公告)日：2023-01-26

申请号：US17865936

申请日：2022-07-15

Applicant: Samsung Electronics Co., Ltd. ,  THE UNIVERSITY OF TOKYO

Inventor： Sayaka UCHIDA ,  Naoki OGIWARA ,  Mitsumasa HAMANO ,  Tadao YAGI ,  Nobuji SAKAI

IPC: G03F7/004 ,  C01B21/38

Abstract: An ionic salt includes a polyvalent ion (a) having a metal cluster structure or a metal oxide cluster structure and an organic ion (b), a radiation-sensitive resist composition including the ionic salt, and a pattern forming method, wherein the polyvalent ion (a) includes at least one metal atom selected from the group consisting of tin, indium, antimony, tellurium, and bismuth, and the organic ion (b) is at least one selected from the group consisting of: a carboxylate anion having 4 or more carbon atoms; a sulfonate anion having 4 or more carbon atoms; a phosphonate anion having 4 or more carbon atoms; a phenoxide anion having 6 or more carbon atoms; an iodonium cation having 4 or more carbon atoms; a sulfonium cation having 4 or more carbon atoms; an ammonium cation having 4 or more carbon atoms; and a pyridinium cation having 5 or more carbon atoms.

公开(公告)号：US20200061967A1

公开(公告)日：2020-02-27

申请号：US16544957

申请日：2019-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung Kun CHO ,  Nobuji SAKAI

IPC: B32B7/02 ,  B32B27/08 ,  B32B17/10 ,  C08J7/04 ,  C08J5/18 ,  G02B1/14 ,  G02F1/1333 ,  C08K3/36 ,  C08L83/00

Abstract: A laminate includes a substrate, a self-healing layer on the substrate and having a thickness of greater than or equal to about 50 micrometers, a protective layer between the substrate and the self-healing layer, and a surface layer on the self-healing layer and having a thickness of about 20 nanometers to about 300 nanometers, wherein the self-healing layer has a first elastic modulus and the protective layer has a second elastic modulus, wherein the second elastic modulus is about 1.2 times to about 50 times greater than the first elastic modulus, and wherein the surface layer has a friction coefficient of less than or equal to about 1.

公开(公告)号：US20210229398A1

公开(公告)日：2021-07-29

申请号：US17232234

申请日：2021-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung Kun CHO ,  Nobuji SAKAI

IPC: B32B7/02 ,  B32B27/08 ,  B32B17/10 ,  C08J7/04 ,  G02B1/14 ,  G02F1/1333 ,  C08K3/36 ,  C08L83/00 ,  C08J5/18

Abstract: A laminate includes a substrate, a self-healing layer on the substrate and having a thickness of greater than or equal to about 50 micrometers, a protective layer between the substrate and the self-healing layer, and a surface layer on the self-healing layer and having a thickness of about 20 nanometers to about 300 nanometers, wherein the self-healing layer has a first elastic modulus and the protective layer has a second elastic modulus, wherein the second elastic modulus is about 1.2 times to about 50 times greater than the first elastic modulus, and wherein the surface layer has a friction coefficient of less than or equal to about 1.

公开(公告)号：US20180112080A1

公开(公告)日：2018-04-26

申请号：US15784603

申请日：2017-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mikhail KOVALEV ,  Chung Kun CHO ,  Myung Man KIM ,  Nobuji SAKAI

IPC: C09D4/00 ,  C09D135/02 ,  C08G18/12 ,  C08G18/42 ,  C08G18/32 ,  C08G18/34 ,  C08G18/75 ,  C08G18/66

CPC classification number: C09D4/00 ,  C08F230/08 ,  C08F290/067 ,  C08F2230/085 ,  C08G18/12 ,  C08G18/3206 ,  C08G18/34 ,  C08G18/4277 ,  C08G18/4825 ,  C08G18/664 ,  C08G18/6659 ,  C08G18/6674 ,  C08G18/672 ,  C08G18/755 ,  C08K5/549 ,  C09D135/02 ,  C09D175/16 ,  C08G18/42 ,  C08K5/5435

Abstract: A self-healing composition including, urethane (meth)acrylate having two (meth)acrylate groups, six or more urethane groups, and a substituted or unsubstituted polyhedral silsesquioxane.

公开(公告)号：US20150151514A1

公开(公告)日：2015-06-04

申请号：US14550379

申请日：2014-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tomoyuki KIKUCHI ,  Kazumi NAKAYOSHI ,  Nobuji SAKAI ,  Reina IWASAKI

IPC: B32B17/06 ,  B32B38/00 ,  B32B37/12 ,  B32B37/18 ,  B32B7/12 ,  B32B27/34

CPC classification number: B32B17/064 ,  B32B7/12 ,  B32B27/281 ,  B32B27/34 ,  B32B38/0008 ,  B32B2037/1253 ,  B32B2307/306 ,  B32B2309/105 ,  B32B2310/0806 ,  B32B2457/00 ,  C08G77/045 ,  C09J183/04 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  Y10T428/265 ,  Y10T428/31663

Abstract: A laminated structure including an inorganic support; a heat resistance polymer film; and an adhesive layer disposed between the inorganic support and the heat resistance polymer film, wherein the adhesive layer includes at least one silsesquioxane polymer.

Abstract translation: 包括无机载体的叠层结构; 耐热聚合物膜; 以及设置在所述无机载体和所述耐热聚合物膜之间的粘合剂层，其中所述粘合剂层包括至少一种倍半硅氧烷聚合物。