公开(公告)号：US20160187037A1

公开(公告)日：2016-06-30

申请号：US14981017

申请日：2015-12-28

Applicant: Samsung Electronics Co., Ltd. ,  Korea University Research and Business Foundation

Inventor： Hee Moon JEONG ,  Yong Taek HONG ,  Seok Uk KIM ,  Seong Ho KIL ,  Bo Heum KIM ,  Yong Chan KIM ,  Jae Jun LEE ,  Yong Seok JEON

IPC: F25B41/06 ,  B05B7/24 ,  F25B1/06

Abstract: As an ejector of the present disclosure and a cooling apparatus having the same include a suction guide unit at least partially having a curved surface so that the ejector guides a flow of a refrigerant, a structure is improved and thus a flow loss can be reduced. Also, through the improved structure, a mixture rate between a refrigerant passing through a nozzle unit and a refrigerant passing through a suction unit is improved, so that pressure rising efficiency can be increased to reduce a compressor load, and thus energy efficiency can be increased due to an increase in efficiency of the ejector.

Abstract translation: 作为本公开的喷射器，具有该喷射器的冷却装置包括至少部分地具有弯曲表面的吸引引导单元，使得喷射器引导制冷剂的流动，结构被改善，从而可以降低流动损失。 此外，通过改善的结构，通过喷嘴单元的制冷剂和通过抽吸单元的制冷剂之间的混合比提高，从而可以提高升压效率以降低压缩机负载，从而可以提高能量效率 由于喷射器效率的提高。

公开(公告)号：US20150168024A1

公开(公告)日：2015-06-18

申请号：US14567001

申请日：2014-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung Moo LEE ,  Hee Moon JEONG ,  Seong Ho KIL

IPC: F25B5/00 ,  F25B49/02

CPC classification number: F25B49/02 ,  F25B5/04 ,  F25B41/00 ,  F25B2341/0011 ,  F25B2341/0012 ,  F25B2341/0661 ,  F25B2400/0409 ,  F25B2400/052 ,  F25B2400/054 ,  F25B2400/06 ,  F25B2400/23 ,  F25B2500/06 ,  F25B2500/14 ,  F25B2500/19 ,  F25B2500/28 ,  F25B2600/0251 ,  F25B2600/0253 ,  F25B2600/112 ,  F25B2600/23 ,  F25B2600/2507 ,  F25B2600/2519 ,  F25B2700/02 ,  F25B2700/2104 ,  F25B2700/2117 ,  F25D21/006 ,  F25D21/08 ,  Y02B30/741 ,  Y02B30/743

Abstract: A cooling cycle includes a first refrigerant circuit, a second refrigerant circuit and the third refrigerant circuit and switches the refrigerant circulation between the refrigerant circuits according to cooling modes so that a plurality of evaporators is efficiently controlled and Coefficient of Performance (COP) is improved by including an ejector.

Abstract translation: 冷却循环包括第一制冷剂回路，第二制冷剂回路和第三制冷剂回路，并且根据冷却模式切换制冷剂回路之间的制冷剂循环，从而有效地控制多个蒸发器，并通过以下方式提高性能系数（COP）： 包括喷射器。

公开(公告)号：US20170292740A1

公开(公告)日：2017-10-12

申请号：US15511851

申请日：2015-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Hee Moon JEONG ,  Seong Ho KIL ,  Seok Uk KIM ,  Keon KUK ,  Yong Chan KIM ,  Jae Jun LEE ,  Yong Seok JEON

IPC: F25B29/00 ,  F25B49/02 ,  F25D17/04 ,  F25B40/04

CPC classification number: F25B29/003 ,  F24F5/00 ,  F25B5/02 ,  F25B5/04 ,  F25B9/08 ,  F25B13/00 ,  F25B40/00 ,  F25B40/04 ,  F25B40/06 ,  F25B49/02 ,  F25B49/027 ,  F25B2400/0403 ,  F25B2400/0409 ,  F25D11/00 ,  F25D17/04

Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.

公开(公告)号：US20170016677A1

公开(公告)日：2017-01-19

申请号：US15124622

申请日：2015-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Min CHEONG ,  Soo Young LEE ,  Seong Ho KIL ,  Moon II JUNG

IPC: F28D1/053 ,  F28F9/02 ,  F28F9/16 ,  F28F1/26 ,  B23P15/26 ,  F28F1/34 ,  B29C45/26 ,  B29C45/33 ,  B29C45/14 ,  F28F21/06 ,  F28F21/08

CPC classification number: F28D1/05391 ,  B23P15/26 ,  B29C45/14598 ,  B29C45/14614 ,  B29C45/2602 ,  B29C45/261 ,  B29C45/2628 ,  B29C45/33 ,  B29K2105/258 ,  B29K2705/10 ,  B29L2031/18 ,  F28D2021/0061 ,  F28D2021/007 ,  F28D2021/0071 ,  F28F1/00 ,  F28F1/24 ,  F28F1/26 ,  F28F1/34 ,  F28F1/36 ,  F28F9/02 ,  F28F9/0224 ,  F28F9/0226 ,  F28F9/16 ,  F28F9/262 ,  F28F21/062 ,  F28F21/067 ,  F28F21/085 ,  F28F2230/00 ,  F28F2255/143 ,  F28F2265/16

Abstract: The heat exchanger includes at least one tube array in which refrigerant flows, the tube array includes a plurality of tubes each having a channel formed therein, and connection members coupled to opposite ends of the tubes so as to interconnect the tubes, and the tubes are injection molded integrally with the connection members.

Abstract translation: 所述热交换器包括至少一个制冷剂流过的管阵列，所述管阵列包括多个管，每个管具有形成在其中的通道，以及联接到所述管的相对端的连接构件，以使所述管相互连接 与连接构件一体注射成型。