公开(公告)号：US09847319B2

公开(公告)日：2017-12-19

申请号：US15147925

申请日：2016-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Sub Song ,  Sung-Wook Hwang ,  Yeoung-Jun Cho ,  Ki-Hong Jeong ,  Tae-Heum Kim

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L25/16 ,  H01L23/00 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A solid state drive (SSD) package type has a lower package including a lower package substrate, a controller chip mounted on the lower package substrate, and a plurality of upper packages disposed on the lower package as spaced apart from each other. The plurality of upper packages includes at least one non-volatile memory and at least one first individual electronic component. The upper packages are electrically connected to the lower package such that the package type is a package-on-package (PoP) type. The height of the first individual electronic component is greater than the spacing between the lower package and each of the upper packages.