公开(公告)号：US10691338B2

公开(公告)日：2020-06-23

申请号：US15147924

申请日：2016-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Sub Song ,  Chan-Ho Yoon ,  Nam-Wook Kang ,  Jung-Pil Lee ,  Tae-Young Lee

IPC: G06F3/06

Abstract: A data storage device includes a controller connected via a plurality of channels to a plurality of clusters, wherein each cluster comprises a scale-out device including a scale-out controller and a buffer. The scale-out controller is connected to a plurality of sub-channels, each one of the plurality of sub-channels connecting a group of non-volatile memory (NVM) devices, such that the scale-out controller controls execution of data processing operations directed to any one of the NVM devices and the buffer.

公开(公告)号：US09847319B2

公开(公告)日：2017-12-19

申请号：US15147925

申请日：2016-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Sub Song ,  Sung-Wook Hwang ,  Yeoung-Jun Cho ,  Ki-Hong Jeong ,  Tae-Heum Kim

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L25/16 ,  H01L23/00 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A solid state drive (SSD) package type has a lower package including a lower package substrate, a controller chip mounted on the lower package substrate, and a plurality of upper packages disposed on the lower package as spaced apart from each other. The plurality of upper packages includes at least one non-volatile memory and at least one first individual electronic component. The upper packages are electrically connected to the lower package such that the package type is a package-on-package (PoP) type. The height of the first individual electronic component is greater than the spacing between the lower package and each of the upper packages.

公开(公告)号：US10074632B2

公开(公告)日：2018-09-11

申请号：US15147922

申请日：2016-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Sub Song ,  Sang-Ho Park ,  Ki-Hong Jeong

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09227 ,  H05K2201/10159 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A solid-state drive (SSD) includes a main printed circuit board (PCB), and a first semiconductor package and a second semiconductor package respectively mounted on a top surface and a bottom surface of the main PCB. Each of the first and second semiconductor packages has a surface on which connection pads corresponding to a package ball map are disposed. The package ball map includes cells arranged in a plurality of rows and a plurality of columns, and one signal corresponds to each of the cells of the package ball map. The package ball map includes first signals corresponding to at least some of cells included in a selected reference column from among the plurality of columns, and at least one pair of second signals respectively corresponding to cells that are symmetrical to each other with respect to the reference column. The pair of second signals are swappable signals, and the first signals are not swappable signals.