Abstract:
A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.
Abstract:
A near-field transducer or heat sink is formed via a first process. The near-field transducer or heat sink is transfer-printed to a read/write head via a second process.
Abstract:
The disclosed methods enable the production of plasmonic near-field transducers that are useful in heat-assisted magnetic recording. The plasmonic near-field transducers have an enlarged region and a peg region. The peg region includes a peg region in proximity to an air-bearing surface above a recording medium and also includes a flared region between and in contact with the enlarged region and the peg region. The flared region can act as a heat sink and can lower the thermal resistance of the peg portion of the near-field transducer, thus reducing its temperature.
Abstract:
A method fabricating a near field transducer for a heat assisted magnetic recording head including forming a peg region of a near field transducer along a first portion of a substrate of a heat assisted magnetic recording head, removing a first portion of the peg region, fabricating a barrier material along a surface of the peg region created by the removal of the first portion of the peg region; and forming an enlarged region adjacent the surface such that the barrier material is disposed at least between the surface of the peg region and the enlarged region.
Abstract:
A method fabricating a near field transducer for a heat assisted magnetic recording head including forming a peg region of a near field transducer along a first portion of a substrate of a heat assisted magnetic recording head, removing a first portion of the peg region, fabricating a barrier material along a surface of the peg region created by the removal of the first portion of the peg region; and forming an enlarged region adjacent the surface such that the barrier material is disposed at least between the surface of the peg region and the enlarged region.
Abstract:
Embodiments are directed to an apparatus having an air-bearing surface that is configured to interact with magnetic medium. The apparatus includes a waveguide and a plasmonic near-field transducer positioned at or near the air-bearing surface. The plasmonic near-field transducer is operatively coupled to the waveguide. The plasmonic near-field transducer includes an enlarged region and a peg region. The peg region extends from the enlarged region towards the air-bearing surface. The peg region has at least a portion of a periphery of its cross-sectional shape include curvature or at least one substantially obtuse angle.
Abstract:
A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.
Abstract:
An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.