公开(公告)号：US20150116951A1

公开(公告)日：2015-04-30

申请号：US14527947

申请日：2014-10-30

Applicant: Seiko Epson Corporation

Inventor： Osamu KAWAUCHI ,  Shinya AOKI ,  Juichiro MATSUZAWA ,  Masaru MIKAMI

IPC: H05K5/06 ,  H05K5/02 ,  B23K1/00

CPC classification number: H05K5/066 ,  B23K1/0016 ,  B23K11/06 ,  B23K26/244 ,  B23K28/02 ,  B23K2101/40 ,  G01C19/5783 ,  H01L2224/16225 ,  H01L2924/16195 ,  H03H9/0552 ,  H03H9/1014 ,  H03H9/1071 ,  H05K5/0239

Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

Abstract translation: 一种电子装置的制造方法，其在作为盖体的基座和盖子形成的内部空间中容纳作为电子部件的陀螺元件，包括：准备在后表面设置有槽的盖， 与所述基座焊接，所述内侧空间侧的所述槽的开口面积大于所述盖的外周侧的开口面积; 焊接，首先，基部和盖子在不包括凹槽的至少一部分的未焊接部分的部分，基部和盖子的计划焊接部分; 并且在所述未焊接部分处焊接所述基部和所述盖，从而使所述凹槽闭合。

公开(公告)号：US20190064204A1

公开(公告)日：2019-02-28

申请号：US16114311

申请日：2018-08-28

Applicant: Seiko Epson Corporation

Inventor： Juichiro MATSUZAWA

IPC: G01P15/125 ,  G01D5/241 ,  G01L1/14 ,  G01P15/08 ,  G01P3/44 ,  B81B7/00 ,  H01L23/00

Abstract: A physical quantity sensor includes a sensor element (acceleration sensor element) and a substrate (package) to which the sensor element is attached using a bonding material (resin adhesive), in which, when an elastic modulus of the bonding material is e, 2.0 GPa

公开(公告)号：US20190049483A1

公开(公告)日：2019-02-14

申请号：US16056977

申请日：2018-08-07

Applicant: Seiko Epson Corporation

Inventor： Juichiro MATSUZAWA

IPC: G01P15/125 ,  G01D5/241 ,  G01L1/14 ,  G01P15/08 ,  G01P3/44 ,  B81B7/00 ,  H01L23/00

Abstract: A physical quantity sensor includes a sensor element, and a container (package) that stores the sensor element on a bottom plate (first base material). An outer edge of the container has a rectangular shape in a plan view. Lengths of each side of the rectangular shape are 2.0 mm or more and 7.0 mm or less, a thickness of the container is 0.50 mm or more and less than 1.85 mm, and when a thickness of the bottom plate is t, 0.4 mm≤t≤1.1 mm is satisfied.

公开(公告)号：US20150116974A1

公开(公告)日：2015-04-30

申请号：US14528094

申请日：2014-10-30

Applicant: Seiko Epson Corporation

Inventor： Juichiro MATSUZAWA ,  Osamu KAWAUCHI ,  Shinya AOKI ,  Masaru MIKAMI

IPC: H05K5/06 ,  H05K5/02 ,  B23K1/00

CPC classification number: H05K5/066 ,  B23K1/0016 ,  B23K11/061 ,  B23K11/16 ,  B23K26/206 ,  B23K26/32 ,  B23K2101/42 ,  B23K2103/05 ,  B23K2103/18 ,  B23K2103/52 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/16225 ,  H01L2924/16195 ,  H05K5/0239

Abstract: A method of manufacturing an electronic device in which a gyro element as an electronic component is accommodated in an internal space provided by a base and a lid as a lid body, includes: preparing the lid as the lid body in which a groove is provided in the surface which is a surface on the opposite side to the rear surface which is a surface on a side which is joined to the base; seam-welding the base and the lid at a site except for an unwelded site which includes a site corresponding to at least a portion of the groove, of a site planned to join the base and the lid; and welding the base and the lid at the unwelded site.

Abstract translation: 一种制造电子装置的方法，其中将作为电子部件的陀螺元件容纳在由基座和盖作为盖体提供的内部空间中，包括：准备作为设置有凹槽的盖体的盖 该表面是与背面相反侧的表面，该表面是与基底接​​合的一侧上的表面; 在除了焊接部位之外的位置对基座和盖子进行焊缝，该未焊接部位包括对应于凹槽的至少一部分的部位，计划连接基部和盖子的部位; 并在未焊接部位焊接底座和盖子。

公开(公告)号：US20140305687A1

公开(公告)日：2014-10-16

申请号：US14249707

申请日：2014-04-10

Applicant: Seiko Epson Corporation

Inventor： Juichiro MATSUZAWA ,  Masaru MIKAMI ,  Toshiya USUDA

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H03H9/0509 ,  H03H9/0542 ,  H03H9/0552 ,  H03H9/215 ,  H05K1/0268 ,  H05K2203/162 ,  Y10T29/49004

Abstract: A circuit substrate includes a base substrate provided with a first pad and a second pad which are electrically connected to an electronic component, a first lateral face and a second lateral face, a first terminal electrically connected to the first pad and a second terminal electrically connected to the second pad which are disposed on the first lateral face, and a third terminal and a fourth terminal which are disposed on the second lateral face. The first terminal and the fourth terminal are located at point-symmetric positions to a center of the base substrate. The second terminal and the third terminal are located at point-symmetric positions to the center of the base substrate. The third terminal and the fourth terminal are electrically connected to each other.

Abstract translation: 电路基板包括设置有电连接到电子部件的第一焊盘和第二焊盘的基板，第一侧面和第二侧面，电连接到第一焊盘的第一端子和电连接的第二端子 设置在第一侧面上的第二焊盘和设置在第二侧面上的第三端子和第四端子。 第一端子和第四端子位于基底基板的中心的点对称位置。 第二端子和第三端子位于基底衬底的中心的点对称位置。 第三端子和第四端子彼此电连接。

公开(公告)号：US20240297637A1

公开(公告)日：2024-09-05

申请号：US18592675

申请日：2024-03-01

Applicant: SEIKO EPSON CORPORATION

Inventor： Takashi YAMAZAKI ,  Takuro KOBAYASHI ,  Juichiro MATSUZAWA

IPC: H03H9/215 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10

CPC classification number: H03H9/215 ,  H03H9/02157 ,  H03H9/0509 ,  H03H9/105

Abstract: A resonator device includes a resonator element, and a base to which the resonator element is fixed via a conductive adhesive. The resonator element includes a base portion, a vibrating arm that is coupled to the base portion and that extends in a first direction, and a support arm that is arranged with the vibrating arm in a second direction orthogonal to the first direction, that extends in the first direction, and that is fixed to the base by the conductive adhesive. 0.2×L1≤Da≤0.4×L1, in which a position at a base end of the support arm is P0, a central position of the conductive adhesive is Pa, and a length between P0 and Pa is Da in the first direction of the support arm.

公开(公告)号：US20150130548A1

公开(公告)日：2015-05-14

申请号：US14537132

申请日：2014-11-10

Applicant: Seiko Epson Corporation

Inventor： Juichiro MATSUZAWA

IPC: H05K5/06 ,  H03B5/30 ,  H05K5/02

CPC classification number: H05K5/0239 ,  H01L21/50 ,  H01L23/04 ,  H01L23/544 ,  H01L41/053 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16225 ,  H03B5/30 ,  H03H9/10 ,  H05K5/069

Abstract: A lid body includes: a first surface; a second surface having a top-bottom relation with the first surface; an outer peripheral surface connecting the first surface and the second surface; a groove provided in the first surface from the outer peripheral surface toward an interior of the first surface; and first and second marks arranged at positions that do not overlap with an outer peripheral edge of the second surface in a plan view.

Abstract translation: 盖体包括：第一表面; 与所述第一表面具有顶部 - 底部关系的第二表面; 连接所述第一表面和所述第二表面的外周表面; 从所述外周面朝向所述第一表面的内部设置在所述第一表面中的槽; 并且布置在平面图中不与第二表面的外周边缘重叠的位置处的第一和第二标记。

公开(公告)号：US20150116915A1

公开(公告)日：2015-04-30

申请号：US14527095

申请日：2014-10-29

Applicant: Seiko Epson Corporation

Inventor： Shinya AOKI ,  Osamu KAWAUCHI ,  Juichiro MATSUZAWA ,  Masaru MIKAMI

IPC: H05K5/02 ,  H05K5/04 ,  H05K5/06 ,  H05K5/00

CPC classification number: G01C19/5769 ,  B23K2101/12 ,  G01C19/574 ,  H01L23/10 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/16195 ,  H05K5/066

Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on a surface which is welded with the base, and an opening area of the groove on the inner space side which is smaller than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.

Abstract translation: 一种电子装置的制造方法，其将作为电子部件的陀螺元件容纳在由基部和盖构成的内部空间中作为盖体，包括：准备在被焊接的表面上设置有槽的盖 与所述基部相比，以及所述内侧空间侧的所述槽的开口面积小于所述盖的外周侧的开口面积; 焊接，首先，基部和盖子在不包括凹槽的至少一部分的未焊接部分的部分，基部和盖子的计划焊接部分; 并且在所述未焊接部分处焊接所述基部和所述盖，从而使所述凹槽闭合。

公开(公告)号：US20140306582A1

公开(公告)日：2014-10-16

申请号：US14248641

申请日：2014-04-09

Applicant: SEIKO EPSON CORPORATION

Inventor： Juichiro MATSUZAWA ,  Masaru MIKAMI ,  Toshiya USUDA

IPC: H01L41/047

CPC classification number: H01L41/0475 ,  H01L2224/48091 ,  H01L2224/48227 ,  H03H9/0547 ,  H03H9/1021 ,  H01L2924/00014

Abstract: An oscillator as an electronic component includes external connection terminals as terminals disposed on a reverse side of a substrate constituting a package, and connection electrodes connected respectively to the external connection terminals, and penetrating through the substrate, and the center of the connection electrode as a second connection electrode in the three connection electrodes adjacent to each other is disposed at a position out of an imaginary line passing through the center of the connection electrode as a first connection electrode and the center of the connection electrode as a third connection electrode.

Abstract translation: 作为电子部件的振荡器包括外部连接端子，作为设置在构成封装的基板的背面的端子，以及连接电极，分别连接到外部连接端子，并穿过基板，连接电极的中心为 在彼此相邻的三个连接电极中的第二连接电极设置在通过作为第一连接电极的连接电极的中心的假想线之外的位置处，并且连接电极的中心作为第三连接电极。

公开(公告)号：US20140211384A1

公开(公告)日：2014-07-31

申请号：US14164807

申请日：2014-01-27

Applicant: Seiko Epson Corporation

Inventor： Shinya AOKI ,  Juichiro MATSUZAWA ,  Osamu KAWAUCHI ,  Masaru MIKAMI

IPC: B23K26/26 ,  B23K11/06 ,  B23K1/005 ,  H05K5/03

CPC classification number: G01C19/5783 ,  H01L2224/16225 ,  H01L2924/16195 ,  H05K5/066

Abstract: A method of manufacturing an electronic device in which an inner space for housing a gyro element is formed between a base and a lid and the base and the lid are bonded includes bonding the base and the lid in which a groove is provided on a surface to be bonded with the base so that the inner space communicates with the outside by not bonding the inner surface of the groove to the base and to position the groove around a concave portion provided on a side surface of the base, and closing a communication portion by irradiating a laser beam to the lid in the communication portion.

Abstract translation: 一种制造电子装置的方法，其中在基座和盖之间形成用于容纳陀螺元件的内部空间，并且基座和盖被粘合包括将基座和在其上设置有凹槽的盖接合到 与基部结合，使得内部空间通过不将槽的内表面接合到基座而与外部连通并且将槽定位在设置在基座的侧表面上的凹部周围，并且通过 将激光束照射到通信部中的盖上。