公开(公告)号：US11509288B2

公开(公告)日：2022-11-22

申请号：US16839125

申请日：2020-04-03

Applicant: Seiko Epson Corporation

Inventor： Tetsuya Otsuki ,  Tsugio Ide

IPC: H03H9/05 ,  H03H9/215 ,  H03B5/32 ,  G01C19/56 ,  B81B3/00 ,  H03L1/02 ,  H03H3/007 ,  H03H9/02 ,  H03H9/17 ,  H03H9/19 ,  G01C19/5621 ,  H03H9/10 ,  B81B7/00 ,  H03L1/04

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

公开(公告)号：US11776860B2

公开(公告)日：2023-10-03

申请号：US17471577

申请日：2021-09-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Masataka Kazuno ,  Tetsuya Otsuki ,  Hitoshi Ueno

IPC: H01L23/043 ,  G01C19/5783 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/043 ,  G01C19/5783 ,  H01L23/3178 ,  H01L23/49541 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48091

Abstract: A method of manufacturing an electronic device includes a preparation step of preparing a substrate to which a lead is bonded, and a molding step of mounting a cap in a mold in a state in which the cap is disposed on the substrate and forming a mold portion by filling a mold material into the mold. The mold includes a first mold including a cap mounting portion, and a second mold including a lead pressing portion. The molding step includes a step of mounting the cap in the cap mounting portion, a step of mounting the substrate on the cap, a step of pressing the lead with the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap by a restoring force generated in the lead, and a step of filling the mold material into the mold.

公开(公告)号：US11376770B2

公开(公告)日：2022-07-05

申请号：US16783431

申请日：2020-02-06

Applicant: SEIKO EPSON CORPORATION

Inventor： Masataka Kazuno ,  Tetsuya Otsuki

IPC: B29C45/14 ,  H05K5/06 ,  G01P3/44 ,  B29L31/34 ,  B29K63/00

Abstract: A method of manufacturing an electronic device includes a step of housing an electronic component in a metal mold, then filling the metal mold with a molding material, wherein the metal mold includes a cavity having a rectangular planar shape and housing the electronic component, and a dummy cavity communicated with a side surface having the smallest gap with the electronic component out of four side surfaces included in the cavity, and in the step of filling the metal mold with the molding material, the molding material inflows into the cavity, and the molding material in the cavity inflows into the dummy cavity.

公开(公告)号：US10742169B2

公开(公告)日：2020-08-11

申请号：US16199846

申请日：2018-11-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hisahiro Ito ,  Tetsuya Otsuki ,  Shoichiro Kasahara

IPC: H03B5/32 ,  H03H9/215 ,  H01L23/495 ,  H03B5/12 ,  H01L23/00 ,  H03H9/05 ,  H03L7/099 ,  H03L7/089

Abstract: An oscillator includes a resonator and an integrated circuit element. The resonator includes a resonator element and a resonator element container accommodating the resonator element. The integrated circuit element includes an inductor. The resonator and the integrated circuit element are stacked on each other. The resonator includes a metal member, and the metal member does not overlap the inductor when viewed in a plan view.

公开(公告)号：US20220087023A1

公开(公告)日：2022-03-17

申请号：US17471570

申请日：2021-09-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Masataka Kazuno ,  Tetsuya Otsuki ,  Hitoshi Ueno

IPC: H05K1/18 ,  G01P3/44 ,  G01P15/18 ,  G01P15/125

Abstract: An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

公开(公告)号：US20220085004A1

公开(公告)日：2022-03-17

申请号：US17471580

申请日：2021-09-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Masataka Kazuno ,  Tetsuya Otsuki ,  Hitoshi Ueno

IPC: H01L25/18 ,  H01L23/053 ,  H01L23/10 ,  H01L23/31 ,  H01L23/15

Abstract: An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.

公开(公告)号：US10651819B2

公开(公告)日：2020-05-12

申请号：US15926571

申请日：2018-03-20

Applicant: Seiko Epson Corporation

Inventor： Tetsuya Otsuki ,  Tsugio Ide

IPC: H03H9/215 ,  H03B5/32 ,  G01C19/56 ,  B81B3/00 ,  H03L1/02 ,  H03H3/007 ,  H03H9/02 ,  H03H9/05 ,  H03H9/17 ,  H03H9/19 ,  G01C19/5621 ,  H03H9/10 ,  B81B7/00 ,  H03L1/04

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

公开(公告)号：US10340440B2

公开(公告)日：2019-07-02

申请号：US15086620

申请日：2016-03-31

Applicant: Seiko Epson Corporation

Inventor： Tetsuya Otsuki ,  Shiro Murakami ,  Tomohiro Arai ,  Mitsuhiro Wada ,  Hiroshi Ito ,  Manabu Shiraki ,  Manabu Kondo ,  Muneyoshi Hama

IPC: H03H9/02 ,  H01L41/29 ,  H01L41/047 ,  H01L41/08 ,  C23C14/18 ,  H03H9/215 ,  H03H9/05 ,  C23C14/00 ,  C23C14/02 ,  C23C14/06 ,  H03H9/13 ,  H03H9/17

Abstract: An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.

公开(公告)号：US09769934B2

公开(公告)日：2017-09-19

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro Miyao ,  Hideki Ishigami ,  Yukihiko Shiohara ,  Tetsuya Otsuki ,  Hidefumi Nakamura

IPC: B32B3/10 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

公开(公告)号：US09474180B2

公开(公告)日：2016-10-18

申请号：US13962428

申请日：2013-08-08

Applicant: SEIKO EPSON CORPORATION

Inventor： Tetsuya Otsuki

IPC: H05K5/02 ,  H05K7/14 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49555 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part.