公开(公告)号：US20170157814A1

公开(公告)日：2017-06-08

申请号：US15323774

申请日：2015-09-30

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Haruhiko MATSUURA ,  Hironori KOBAYASHI ,  Masahiro SHINDO ,  Tetsuro TAI

IPC: B29C44/04 ,  B32B27/00 ,  B29C47/04 ,  B32B5/18 ,  B29C49/22 ,  B29C49/48

CPC classification number: B29C44/04 ,  B29C44/507 ,  B29C44/5636 ,  B29C48/0012 ,  B29C48/0022 ,  B29C48/08 ,  B29C48/10 ,  B29C48/16 ,  B29C48/30 ,  B29C48/32 ,  B29C48/865 ,  B29C48/92 ,  B29C49/22 ,  B29C49/48 ,  B29C51/02 ,  B29K2077/00 ,  B29K2105/04 ,  B29K2105/045 ,  B29K2995/0063 ,  B29L2031/3005 ,  B29L2031/712 ,  B32B1/02 ,  B32B5/18 ,  B32B5/32 ,  B32B27/00 ,  B32B27/065 ,  B32B2250/02 ,  B32B2250/22 ,  B32B2266/0257 ,  B32B2266/06 ,  B32B2307/30 ,  B32B2307/718 ,  B32B2307/72 ,  B32B2307/734 ,  B32B2439/02 ,  B32B2439/40 ,  B32B2439/70 ,  B32B2605/003 ,  B32B2605/08 ,  C08J9/0061 ,  C08J9/0066 ,  C08J9/141 ,  C08J9/36 ,  C08J2201/03 ,  C08J2203/14 ,  C08J2205/052 ,  C08J2377/02 ,  C08J2377/06 ,  C08J2425/08 ,  C08J2467/02

Abstract: In outer shape processing of a resin expanded sheet having a resin expanded layer including a polyamide-based resin composition,the outer shape processing is carried out while allowing a specified amount or more of moisture to be contained in the resin expanded layer.