公开(公告)号：US20190100637A1

公开(公告)日：2019-04-04

申请号：US16086472

申请日：2016-07-07

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Yugo KATAYAMA ,  Haruhiko MATSUURA

IPC: C08J7/16 ,  C08J7/14 ,  C08J9/28 ,  C08F20/32 ,  C08F20/28 ,  C08F2/28 ,  C08G63/695 ,  C08G73/02 ,  C09D7/40 ,  C09D7/65

Abstract: Hollow particles each having a shell composed of at least one layer, wherein the at least one layer contains a nitrogen atom-containing resin having a refractive index of 1.57 or less.

公开(公告)号：US20180186958A1

公开(公告)日：2018-07-05

申请号：US15323787

申请日：2015-09-30

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Hiromaru YAMAMOTO ,  Hironori KOBAYASHI ,  Haruhiko MATSUURA

IPC: C08J9/18 ,  C08J9/228

Abstract: Provided is a bead expanded molded article comprising a plurality of resin expanded particles that are fusion-bonded with each other, in which the resin expanded particles mainly include a resin having a glass transition temperature of 180° C. or more.

公开(公告)号：US20170114243A1

公开(公告)日：2017-04-27

申请号：US15319127

申请日：2016-01-06

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Yugo KATAYAMA ,  Kengo NISHIUMI ,  Ayumi KIYOHARA ,  Shuichi SASAHARA ,  Haruhiko MATSUURA ,  Junko KUBO

IPC: C09D133/14 ,  C09D5/00 ,  G02B1/11 ,  B01J13/18 ,  C08F220/32 ,  G02B5/02 ,  C09D7/12 ,  C09K5/14

Abstract: Provided are hollow particles each having a shell including at least one layer, wherein the hollow particles have an average particle diameter of 10 to 200 nm and the at least one layer contains a vinyl-based resin.

公开(公告)号：US20220288550A1

公开(公告)日：2022-09-15

申请号：US17825251

申请日：2022-05-26

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Yugo KATAYAMA ,  Tsuyoshi SAITO ,  Haruhiko MATSUURA ,  Atsushi KOTANI ,  Momoka NODA

IPC: B01J13/18 ,  C08G59/32 ,  C08F8/00 ,  C08F20/32 ,  C09D201/00 ,  C08F2/26 ,  B01J13/20 ,  C08K5/521 ,  C08K5/5419 ,  C08L43/04

Abstract: Hollow particles having a shell including at least one layer, wherein the at least one layer contains a vinyl-based resin, and contains a phosphorus atom and/or a sulfur atom.

公开(公告)号：US20170157814A1

公开(公告)日：2017-06-08

申请号：US15323774

申请日：2015-09-30

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Haruhiko MATSUURA ,  Hironori KOBAYASHI ,  Masahiro SHINDO ,  Tetsuro TAI

IPC: B29C44/04 ,  B32B27/00 ,  B29C47/04 ,  B32B5/18 ,  B29C49/22 ,  B29C49/48

CPC classification number: B29C44/04 ,  B29C44/507 ,  B29C44/5636 ,  B29C48/0012 ,  B29C48/0022 ,  B29C48/08 ,  B29C48/10 ,  B29C48/16 ,  B29C48/30 ,  B29C48/32 ,  B29C48/865 ,  B29C48/92 ,  B29C49/22 ,  B29C49/48 ,  B29C51/02 ,  B29K2077/00 ,  B29K2105/04 ,  B29K2105/045 ,  B29K2995/0063 ,  B29L2031/3005 ,  B29L2031/712 ,  B32B1/02 ,  B32B5/18 ,  B32B5/32 ,  B32B27/00 ,  B32B27/065 ,  B32B2250/02 ,  B32B2250/22 ,  B32B2266/0257 ,  B32B2266/06 ,  B32B2307/30 ,  B32B2307/718 ,  B32B2307/72 ,  B32B2307/734 ,  B32B2439/02 ,  B32B2439/40 ,  B32B2439/70 ,  B32B2605/003 ,  B32B2605/08 ,  C08J9/0061 ,  C08J9/0066 ,  C08J9/141 ,  C08J9/36 ,  C08J2201/03 ,  C08J2203/14 ,  C08J2205/052 ,  C08J2377/02 ,  C08J2377/06 ,  C08J2425/08 ,  C08J2467/02

Abstract: In outer shape processing of a resin expanded sheet having a resin expanded layer including a polyamide-based resin composition,the outer shape processing is carried out while allowing a specified amount or more of moisture to be contained in the resin expanded layer.

公开(公告)号：US20190209994A1

公开(公告)日：2019-07-11

申请号：US16333793

申请日：2017-08-30

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Yugo KATAYAMA ,  Tsuyoshi SAITO ,  Haruhiko MATSUURA ,  Atsushi KOTANI ,  Momoka NODA

IPC: B01J13/18 ,  B01J13/20 ,  C08L43/04 ,  C08K5/5419 ,  C08K5/521

CPC classification number: B01J13/18 ,  B01J13/20 ,  C08F2/26 ,  C08F8/00 ,  C08F20/32 ,  C08G59/32 ,  C08K5/521 ,  C08K5/5419 ,  C08L43/04 ,  C08L2201/54 ,  C08L2201/56 ,  C08L2205/20 ,  C09D201/00

Abstract: Hollow particles having a shell including at least one layer, wherein the at least one layer contains a vinyl-based resin, and contains a phosphorus atom and/or a sulfur atom.

公开(公告)号：US20170217127A1

公开(公告)日：2017-08-03

申请号：US15500735

申请日：2015-09-30

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Hironori KOBAYASHI ,  Haruhiko MATSUURA ,  Yusuke KUWABARA

IPC: B32B5/18 ,  B32B5/24 ,  C08J5/24 ,  B29C43/18 ,  C08J9/36 ,  B32B27/34 ,  B29C43/12

Abstract: The resin composite of the present invention has a polyamide-based resin expanded sheet, and a fiber-reinforced resin layer integrally laminated on a surface of the polyamide-based resin expanded sheet.