公开(公告)号：US20240212995A1

公开(公告)日：2024-06-27

申请号：US18390078

申请日：2023-12-20

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Yun Sang KIM ,  Sang Jeong LEE ,  Jae Won SHIN ,  Jong Won PARK

IPC: H01J37/32

CPC classification number: H01J37/32697 ,  H01J37/32522 ,  H01J37/32541 ,  H01J37/3255 ,  H01J37/32724 ,  H01J2237/2007

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; a support unit configured to support a substrate in the treating space; a window plate positioned above the treating space; and a conductive layer formed on the window plate, and wherein a bottom surface of the window plate is exposed to the treating space, and the conductive layer is formed on a top surface among a top surface and a bottom surface of the window plate.

公开(公告)号：US20230411196A1

公开(公告)日：2023-12-21

申请号：US18126974

申请日：2023-03-27

Applicant: SEMES CO., LTD.

Inventor： Jae Won SHIN

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67766 ,  H01L21/6719 ,  H01L21/67769 ,  H01L21/6831

Abstract: Proposed is a component carrier for semiconductor manufacturing and component transport system using the same and, more particularly, to a component carrier for semiconductor manufacturing and component transport system using the same with an improved structure to prevent a ring from being separated from the component carrier for semiconductor manufacturing during a ring transport process by temporarily fixing the ring using vacuum adsorption. The carrier transports components while a lower surface thereof is in contact with a transport hand and an upper surface thereof is in contact with a component for semiconductor manufacturing. The carrier includes a first vacuum hole formed through the upper surface, a second vacuum hole formed through the lower surface, and an air passage provided between the first vacuum hole and the second vacuum hole.

公开(公告)号：US20230411117A1

公开(公告)日：2023-12-21

申请号：US18097232

申请日：2023-01-14

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Sang Jeong LEE ,  Jae Won SHIN ,  Hyun Woo JO ,  Jong Won PARK

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J37/3244 ,  H01J37/32119

Abstract: An antenna member includes a first coil and a second coil that are rotationally symmetrical with each other, wherein the first coil includes a first supply terminal to which current is applied, a first ground terminal connected to a ground, and a first shunt capacitor shunted between the first supply terminal and the first ground terminal, the second coil includes a second supply terminal to which current is applied, a second ground terminal connected to the ground, and a second shunt capacitor shunted between the second supply terminal and the second ground terminal, the first coil includes an arc-shaped first portion and an arc-shaped second portion, and the first portion and the second portion form a one-turn winding as a whole, the second coil includes an arc-shaped first portion and an arc-shaped second portion, and the first portion and the second portion form a one-turn winding as a whole, the second portion has a height lower than a height of the first portion, the second portion of the second coil is disposed below the first portion of the first coil, and the second portion of the first coil is disposed below the first portion of the second coil.

公开(公告)号：US20230352335A1

公开(公告)日：2023-11-02

申请号：US18135138

申请日：2023-04-15

Applicant: SEMES CO., LTD.

Inventor： Jae Won SHIN

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/68707

Abstract: Proposed is a transport hand and a ring transport system using the same and, more particularly, to a transport hand and a ring transport system using the same with an improved structure to prevent a ring from being separated from a ring carrier during a ring transport process by temporarily fixing the ring using vacuum adsorption. The transport hand includes a support pad coupled to the upper surface to contact a wafer or ring carrier, a wafer adsorption means configured to provide adsorption force to the wafer disposed on the upper surface, and include a first upper surface hole, a first lower surface hole, and a first passage, and a ring carrier adsorption means configured to provide adsorption force to the ring carrier disposed on the upper surface, and include a second upper surface hole, a second lower surface hole, and a second passage

公开(公告)号：US20230317434A1

公开(公告)日：2023-10-05

申请号：US18092201

申请日：2022-12-30

Applicant: SEMES CO., LTD.

Inventor： Jae Won SHIN ,  Duk Hyun Son

IPC: H01J37/32

CPC classification number: H01J37/32807 ,  H01J37/32715 ,  H01J37/32642 ,  H01J37/32816 ,  H01J2237/1825 ,  H01J2237/20278 ,  H01J2237/334 ,  H01J2237/2007

Abstract: The transporting apparatus of the present invention comprises an end effector including a hand and a plurality of vacuum holes installed in the hand; and a carrier located on the hand and for supporting a consumable part, wherein the carrier comprises one side for supporting a consumable part, the other surface facing the hand of the end effector, and a plurality of support blocks installed on the other surface and corresponding to the plurality of vacuum holes, wherein an inner space communicating with the vacuum hole is installed in the plurality of support blocks, and the inner space is evacuated by negative pressure provided from the plurality of vacuum holes.

公开(公告)号：US20230113184A1

公开(公告)日：2023-04-13

申请号：US17865386

申请日：2022-07-15

Applicant: SEMES CO., LTD.

Inventor： Jae Won SHIN ,  Jae Seong LEE ,  Hae Won CHOI ,  Joon Ho WON ,  Koriakin ANTON ,  Min Woo KIM ,  Hyung Seok KANG ,  Eung Su KIM ,  Pil Kyun HEO ,  Jin Yeong SUNG

IPC: H01L21/67

Abstract: The present disclosure relates to a flow resistance generating unit that generates a flow resistance in a pipe to solve a flow imbalance problem due to a bent pipe and stabilizes an internal airflow, and a substrate treating apparatus including the same. The substrate treating apparatus comprises a fluid supply unit for supplying fluid for treating a substrate and including an upper fluid supply module for supplying the fluid to an upper portion of the substrate, a lower fluid supply module for supplying the fluid to a lower portion of the substrate, and a supply pipe connected to at least one of the upper fluid supply module and the lower fluid supply module, and a flow resistance generating unit installed in the supply pipe and for generating a flow resistance with respect to the fluid passing through the supply pipe.