公开(公告)号：US20230148026A1

公开(公告)日：2023-05-11

申请号：US17716853

申请日：2022-04-08

Applicant: SEMES CO., LTD.

Inventor： Seong Gil LEE ,  Myoung Sub NOH ,  Dong-Hun KIM ,  Young Je UM ,  Dong Sub OH ,  Jun Taek KOO ,  Wan Jae PARK

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32422 ,  H01J37/32449 ,  H01J37/32834 ,  H01J2237/334 ,  H01J2237/2007

Abstract: A substrate treating method includes a temperature stabilizing step for stabilizing a temperature of the substrate to a process temperature in a treating space for treating a substrate, a pressure stabilizing step for stabilizing a pressure of a plasma space for generating a plasma and a pressure of the treating space to a process, the plasma space fluid communicating with the treating space, and a treating step for generating the plasma at the plasma space and treating the substrate using the plasma.

公开(公告)号：US20230136707A1

公开(公告)日：2023-05-04

申请号：US17977440

申请日：2022-10-31

Applicant: SEMES CO., LTD.

Inventor： Dong-Hun KIM ,  Jun Taek KOO ,  Myoung Sub NOH ,  Dong Sub OH

IPC: H01J37/32 ,  G02B27/28

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having an inner space; a plate separating the inner space into a first space which is above and a second space which is below and having a plurality of through holes; a first gas supply unit configured to supply a first gas to the first space; a plasma source for generating a plasma at the first space or the second space; and a monitoring unit installed at the plate and configured to monitor a characteristic of the plasma generated at the first space or the second space.

公开(公告)号：US20230022720A1

公开(公告)日：2023-01-26

申请号：US17868048

申请日：2022-07-19

Applicant: SEMES CO., LTD.

Inventor： Young Je UM ,  Wan Jae PARK ,  Jun Taek KOO

IPC: H01J37/32 ,  H01L21/683

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing defining a treating space; a chuck supporting a substrate at the treating space and providing a bottom electrode for generating a plasma at the treating space; a top electrode; and an ion blocker positioned between the top electrode and the treating space.

公开(公告)号：US20190308227A1

公开(公告)日：2019-10-10

申请号：US16379294

申请日：2019-04-09

Applicant: SEMES CO., LTD.

Inventor： Mi Young JO ,  Da Jeong KIM ,  Ye Rim YEON ,  Jun Taek KOO

IPC: B08B7/00 ,  H01L21/02 ,  H01L21/67 ,  B08B3/10 ,  H01L21/324

Abstract: An embodiment of the present invention provides a substrate cleaning method including: supplying of a liquid cleaning solution containing a thermoreactive polymer resin in a solvent to a substrate; trapping of particles by gelling the liquid cleaning solution by phase transition through first heat treatment; liquefying of the gel-state cleaning solution with the particle trapped therein by phase transition through second heat treatment; and removing of the liquefied cleaning solution by supplying a rinse solution.