公开(公告)号：US20240006167A1

公开(公告)日：2024-01-04

申请号：US18213863

申请日：2023-06-25

Applicant: SEMES CO., LTD.

Inventor： Kwang Ryul KIM ,  Yunsang KIM

IPC: H01J37/32 ,  H01J37/22 ,  H01L21/67 ,  C23C16/455 ,  C23C16/48

CPC classification number: H01J37/32724 ,  H01J37/22 ,  H01L21/67115 ,  C23C16/45544 ,  C23C16/483

Abstract: Provided is a substrate processing module including a plurality of substrate processing apparatuses each including a process chamber having a processing space therein, a support unit for supporting a substrate in the processing space, a gas supply unit for supplying a process gas into the processing space, a plasma source for forming plasma from the process gas supplied into the processing space, and a laser unit for heating the substrate by irradiating a laser beam onto the substrate, wherein the substrate processing module further includes a laser beam generator for generating a laser beam, and a laser beam distribution unit for receiving the laser beam from the laser beam generator and distributing the laser beam to the laser units of the plurality of substrate processing apparatuses at time intervals.

公开(公告)号：US20230411184A1

公开(公告)日：2023-12-21

申请号：US18105722

申请日：2023-02-03

Applicant: SEMES CO., LTD.

Inventor： Kwang Ryul KIM ,  Yun Sang Kim

IPC: H01L21/67 ,  H01L21/268 ,  H01L21/263 ,  H01J37/32 ,  H01L21/673 ,  H01L21/3065 ,  H01S3/094 ,  H01S3/0941 ,  H01S3/067

CPC classification number: H01L21/67115 ,  H01L21/268 ,  H01L21/2636 ,  H01J37/32449 ,  H01J37/32889 ,  H01L21/67386 ,  H01L21/3065 ,  H01S3/094076 ,  H01S3/0941 ,  H01S3/067 ,  H01J2237/334

Abstract: A substrate treating apparatus includes a process chamber having a processing space in which a substrate is plasma-treated and a laser irradiation unit irradiating the substrate with a plurality of lasers having different pulse widths to heat the substrate to reach a temperature at which the substrate is plasma-treated.

公开(公告)号：US20240003011A1

公开(公告)日：2024-01-04

申请号：US18092169

申请日：2022-12-30

Applicant: SEMES CO., LTD.

Inventor： Kwang Ryul KIM ,  Yun Sang KIM ,  Jin Hee HONG

IPC: C23C16/46 ,  H01J37/32 ,  C23C16/455

CPC classification number: C23C16/46 ,  H01J37/32724 ,  H01J37/3244 ,  H01J37/32458 ,  C23C16/45544 ,  H01J2237/332 ,  H01J2237/334

Abstract: A substrate processing apparatus includes a processing chamber having a processing space in which a substrate is plasma-processed, and having a transparent window; a gas flow unit supplying and discharging process gas to the processing chamber; and a laser irradiator irradiating a laser for heating the substrate to be selectively atomic layer-processed for each of a plurality of thin films formed on the substrate through the transparent window from an external space of the processing chamber.

公开(公告)号：US20230207304A1

公开(公告)日：2023-06-29

申请号：US17860084

申请日：2022-07-07

Applicant: SEMES CO., LTD.

Inventor： Kwang Ryul KIM ,  Yun Sang KIM

IPC: H01L21/02 ,  G02B27/30 ,  H01S3/00

CPC classification number: H01L21/02046 ,  G02B27/30 ,  H01S3/005 ,  H01S3/0014

Abstract: A dry-type cleaning apparatus for wafers for dry cleaning of organic residues on a wafer surface includes a laser emitting laser light, an optical collimator receiving the laser light emitted from the laser and generating a first collimated laser light, an energy spreader uniformizing an energy distribution of the first collimated light received from the optical collimator, and a beam expander adjusting a diameter of the first collimated laser light passing through the energy spreader according to a diameter of a wafer to generate second laser light.

公开(公告)号：US20220382164A1

公开(公告)日：2022-12-01

申请号：US17752721

申请日：2022-05-24

Applicant: SEMES CO., LTD.

Inventor： Kwang Ryul KIM ,  Gil Soo EUN

IPC: G03F7/20

Abstract: The inventive concept provides an edge exposure apparatus for performing an edge exposing process by irradiating a light at an edge region of a substrate. The edge exposure apparatus includes a support unit configured to support the substrate; a light irradiation unit having a light source for irradiating the light on the substrate; and a control unit configured to control an output of the light source, and wherein the control unit comprises: a measurement unit configured to measure illuminance values according to the outputs of the light source; and an output control unit configured to set a reference illuminance value among the measured illuminance values by the measurement unit and to control the output of the light source based on the set reference illuminance value.