公开(公告)号：US11942337B2

公开(公告)日：2024-03-26

申请号：US17063820

申请日：2020-10-06

Applicant: SEMES CO., LTD.

Inventor： Eui Sang Lim ,  Young Hun Lee ,  Jinwoo Jung ,  Miso Park ,  Byongwook Ahn ,  Yong Hee Lee

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67017 ,  H01J37/32449 ,  H01J37/32467 ,  H01J37/32715 ,  H01J37/32834 ,  H01J2237/334

Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

公开(公告)号：US11923219B2

公开(公告)日：2024-03-05

申请号：US16912762

申请日：2020-06-26

Applicant: SEMES CO., LTD.

Inventor： Youngseop Choi ,  Young Hun Lee ,  Yong-Jun Seo ,  Bok Kyu Lee ,  Miso Park

IPC: H01L21/67 ,  B08B3/08 ,  B08B7/04 ,  B08B13/00

CPC classification number: H01L21/67248 ,  B08B3/08 ,  B08B7/04 ,  B08B13/00 ,  H01L21/67051 ,  H01L21/67103 ,  H01L21/6719

Abstract: The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.

公开(公告)号：US12300483B2

公开(公告)日：2025-05-13

申请号：US17370475

申请日：2021-07-08

Applicant: SEMES CO., LTD.

Inventor： Miso Park ,  Yong Hee Lee ,  Eui Sang Lim ,  Jinwoo Jung

IPC: H01L21/02 ,  B08B7/00 ,  B08B13/00 ,  H01L21/67

Abstract: An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.

公开(公告)号：US11842903B2

公开(公告)日：2023-12-12

申请号：US17061622

申请日：2020-10-02

Applicant: Semes Co., Ltd

Inventor： Miso Park ,  Yong Hee Lee

IPC: H01L21/67 ,  B08B7/00

CPC classification number: H01L21/67051 ,  B08B7/0021

Abstract: An apparatus for treating a substrate is provided. The apparatus for treating the substrate includes a high pressure chamber to provide a treatment space to perform a process of treating the substrate using a process fluid, a fluid supply source to provide the process fluid to the high pressure chamber, a fluid supply unit to supply the process fluid to the treatment space of the high pressure chamber, an exhaust unit to exhaust the process fluid in the high pressure chamber, and a pre-vent unit to vent a process fluid remaining inside a supply line.

公开(公告)号：US12300515B2

公开(公告)日：2025-05-13

申请号：US17370469

申请日：2021-07-08

Applicant: SEMES CO., LTD.

Inventor： Miso Park ,  Yong Hee Lee ,  Dohyeon Yoon

IPC: H01L21/67 ,  B08B7/00 ,  B08B7/04 ,  F27B17/00 ,  F27D5/00 ,  H05B1/02 ,  H05B3/30 ,  H01L21/687 ,  H05B3/28

Abstract: The inventive concept provides an apparatus for treating a substrate by using a supercritical fluid. In an embodiment, the apparatus may include a process chamber that provides a treatment space, and including a chamber heater that increases a temperature of an interior of the treatment space, a substrate support provided in the treatment space and that supports the substrate, and a substrate heating member that heats a lower surface of the substrate while contacting the lower surface of the substrate.

公开(公告)号：US12027381B2

公开(公告)日：2024-07-02

申请号：US17137181

申请日：2020-12-29

Applicant: SEMES CO., LTD.

Inventor： Youngseop Choi ,  Young Hun Lee ,  Jinwoo Jung ,  Miso Park

IPC: B08B3/08 ,  B08B3/10 ,  B08B7/00 ,  B08B13/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67034 ,  B08B3/08 ,  B08B3/10 ,  B08B7/0021 ,  B08B13/00 ,  H01L21/67207 ,  H01L21/67023 ,  H01L21/67167 ,  H01L21/68707

Abstract: Embodiments of the inventive concept provide an apparatus for treating a substrate. According to an exemplary embodiment, an apparatus for treating a substrate comprises a first valve and a second valve sequentially installed along a direction from a fluid supplying source to a high-pressure chamber in the supply line; a branch line branching from the supply line between the first valve and the second valve and connected to an exhaust line; a third valve installed on the branch line; an exhaust unit exhausting the process fluid inside the high-pressure chamber; and a controller, wherein the controller is configured to perform, before a transfer robot transfers the substrate to the high-pressure chamber for treating the substrate, a first operating of opening the first valve and closing the second valve and a third valve, and a second operating of closing the first valve and the second valve, and opening the third valve.