Apparatus for treating substrate and method for treating substrate

    公开(公告)号:US12272544B2

    公开(公告)日:2025-04-08

    申请号:US18145920

    申请日:2022-12-23

    Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

    Apparatus and method for supplying liquid

    公开(公告)号:US11887870B2

    公开(公告)日:2024-01-30

    申请号:US17563002

    申请日:2021-12-27

    Abstract: A liquid supply unit includes a tank having an inner space for storing the liquid, an inlet line for supplying the liquid from the liquid supply source to the inner space and having an inlet valve installed thereon, an outlet line for supplying the liquid from the tank to a nozzle or for recollecting the liquid to the tank and having an outlet valve installed thereon, a gas supply line for supplying a gas to the inner space and having a gas control valve installed thereon, an exhaust line for exhausting the inner space and having an exhaust valve installed thereon, a circulation line for circulating the liquid stored in the inner space, and a controller controlling the liquid supply unit so that the circulation line is pressurized while the liquid is supplied to the inner space.

    CHEMICAL LIQUID PROVIDING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20220297169A1

    公开(公告)日:2022-09-22

    申请号:US17694828

    申请日:2022-03-15

    Abstract: Provided are a treating liquid providing unit capable of predicting a temperature change of a substrate treating liquid by adding an inflow amount or consumption amount of the substrate treating liquid as a control factor, and a substrate treating apparatus including the same. The treating liquid providing unit includes a treating liquid storage module for storing the substrate treating liquid, a treating liquid heating module for heating the substrate treating liquid, a treating liquid discharging module for discharging the substrate treating liquid, a treating liquid supplying module for supplying the substrate treating liquid to the treating liquid storage module when the substrate treating liquid is discharged, and a control module for predicting the temperature of the substrate treating liquid remaining in the treating liquid storage module based on the inflow amount of the substrate treating liquid.

    Unit for supplying liquid, apparatus and method for treating substrate with the unit

    公开(公告)号:US12266546B2

    公开(公告)日:2025-04-01

    申请号:US17969155

    申请日:2022-10-19

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a liquid supply unit configured to supply a treating liquid onto the substrate supported on the support unit, and wherein the liquid supply unit comprises: a tank configured to have an accommodation space for storing the treating liquid therein; a circulation line configured to circulate the treating liquid stored in the accommodation space; a supplementary line configured to supply the treating liquid to the accommodation space, and at which a valve is installed; a heater installed at the circulation line, and for heating the treating liquid; and a controller is configured to control the valve and the heater.

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