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公开(公告)号:US11887870B2
公开(公告)日:2024-01-30
申请号:US17563002
申请日:2021-12-27
Applicant: SEMES CO., LTD.
Inventor: Do Gyeong Ha , Seung Tae Yang
CPC classification number: H01L21/67051 , B08B3/022 , B08B3/10 , B08B13/00 , B08B2203/007 , B08B2203/027 , H01L21/67017 , H01L21/67103 , H01L21/67248
Abstract: A liquid supply unit includes a tank having an inner space for storing the liquid, an inlet line for supplying the liquid from the liquid supply source to the inner space and having an inlet valve installed thereon, an outlet line for supplying the liquid from the tank to a nozzle or for recollecting the liquid to the tank and having an outlet valve installed thereon, a gas supply line for supplying a gas to the inner space and having a gas control valve installed thereon, an exhaust line for exhausting the inner space and having an exhaust valve installed thereon, a circulation line for circulating the liquid stored in the inner space, and a controller controlling the liquid supply unit so that the circulation line is pressurized while the liquid is supplied to the inner space.
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公开(公告)号:US20230184574A1
公开(公告)日:2023-06-15
申请号:US18063881
申请日:2022-12-09
Applicant: SEMES CO., LTD.
Inventor: Tae Suk YUN , Sang Woo Park , Do Gyeong Ha , Seung Tae Yang , Bu Young Jung , Moon Soon Choi , Chae Young Lim
CPC classification number: G01F23/02 , B05C11/1026 , B05C5/0225
Abstract: Provided is an apparatus for supplying a chemical liquid, the apparatus including: a storage tank in which a chemical liquid is stored; a discharge line through which the chemical liquid stored in the storage tank is discharged; a level tube connected to the storage tank so as to check a water level of the chemical liquid in the storage tank and receiving the chemical liquid at the same water level as the water level of the chemical liquid in the storage tank; and a controller for controlling a first valve installed in the discharge line, in which the level tube has one end connected to an upper space of the storage tank and the other end connected to the discharge line.
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公开(公告)号:US12272544B2
公开(公告)日:2025-04-08
申请号:US18145920
申请日:2022-12-23
Applicant: SEMES CO., LTD.
Inventor: Do Gyeong Ha , Moon Soon Choi , Young Joon Han , Seung Tae Yang
IPC: H01L21/02 , B08B3/02 , B08B13/00 , H01L21/67 , H01L21/687
Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.
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公开(公告)号:US12278118B2
公开(公告)日:2025-04-15
申请号:US17520588
申请日:2021-11-05
Applicant: SEMES CO., LTD.
Inventor: Seung Tae Yang , Jong Han Kim , Do Gyeong Ha
Abstract: A substrate processing apparatus a processing liquid supply unit includes a nozzle supplying a processing liquid onto the substrate, a supply line connected to the nozzle to supply the processing liquid to the nozzle, and a cooler cooling the processing liquid. A volume of the processing liquid is reduced by the cooler so that the processing liquid may be sucked.
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公开(公告)号:US20230211261A1
公开(公告)日:2023-07-06
申请号:US17941018
申请日:2022-09-09
Applicant: SEMES CO., LTD.
Inventor: Seong Hyeon KIM , Gi Hun Choi , Seung Tae Yang , So Young Park , Kyung Hwan Min
CPC classification number: B01D29/668 , B08B3/02 , B08B15/00 , B01D29/94 , B01D29/90
Abstract: The present disclosure provides a substrate processing apparatus capable of stabilizing the particle level when re-supplying a chemical solution. The substrate processing apparatus includes a circulation line connected to a chemical supply unit to circulate a chemical solution, a filter installed in the circulation line to filter particles in the chemical solution, a supply line connected to a first node of the circulation line and configured to supply the chemical solution to the chamber, and a drain line connected, in the circulation line, to a second node located between the filter and the first node, and configured to drain the chemical solution, the apparatus being configured to operate, during a first duration, from when a pump of the chemical supply unit is restarted after the pump had stopped, to drain the chemical solution that passes through the filter.
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