Apparatus and method for supplying liquid

    公开(公告)号:US11887870B2

    公开(公告)日:2024-01-30

    申请号:US17563002

    申请日:2021-12-27

    Abstract: A liquid supply unit includes a tank having an inner space for storing the liquid, an inlet line for supplying the liquid from the liquid supply source to the inner space and having an inlet valve installed thereon, an outlet line for supplying the liquid from the tank to a nozzle or for recollecting the liquid to the tank and having an outlet valve installed thereon, a gas supply line for supplying a gas to the inner space and having a gas control valve installed thereon, an exhaust line for exhausting the inner space and having an exhaust valve installed thereon, a circulation line for circulating the liquid stored in the inner space, and a controller controlling the liquid supply unit so that the circulation line is pressurized while the liquid is supplied to the inner space.

    Apparatus for treating substrate and method for treating substrate

    公开(公告)号:US12272544B2

    公开(公告)日:2025-04-08

    申请号:US18145920

    申请日:2022-12-23

    Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20230211261A1

    公开(公告)日:2023-07-06

    申请号:US17941018

    申请日:2022-09-09

    CPC classification number: B01D29/668 B08B3/02 B08B15/00 B01D29/94 B01D29/90

    Abstract: The present disclosure provides a substrate processing apparatus capable of stabilizing the particle level when re-supplying a chemical solution. The substrate processing apparatus includes a circulation line connected to a chemical supply unit to circulate a chemical solution, a filter installed in the circulation line to filter particles in the chemical solution, a supply line connected to a first node of the circulation line and configured to supply the chemical solution to the chamber, and a drain line connected, in the circulation line, to a second node located between the filter and the first node, and configured to drain the chemical solution, the apparatus being configured to operate, during a first duration, from when a pump of the chemical supply unit is restarted after the pump had stopped, to drain the chemical solution that passes through the filter.

Patent Agency Ranking