公开(公告)号：US20180145237A1

公开(公告)日：2018-05-24

申请号：US15572051

申请日：2016-04-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jun Yong PARK ,  Jae Hyun PARK ,  Yeo Jin YOON ,  In Kyu PARK

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225

Abstract: A light-emitting device is provided. The light-emitting device comprises: a first body unit including a base part and at least three conductive patterns positioned on the base part while including a plurality of element loading areas; and a plurality of light-emitting elements positioned on the plurality of element loading areas of the first body unit, wherein at least one conductive pattern among the conductive patterns is electrically connected to at least two light-emitting elements, the at least two light-emitting elements are connected to each other in series, at least two conductive patterns among the conductive patterns include pad electrode areas, an area of the plurality of conductive patterns is 80% or more of an upper surface area of the base part, and a separation distance among the plurality of conductive patterns is 200 μm to 2,400 μm.

公开(公告)号：US20170338382A1

公开(公告)日：2017-11-23

申请号：US15673046

申请日：2017-08-09

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jun Yong PARK ,  Hee Cheul JUNG ,  In Kyu PARK ,  Daewoong SUH

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A light-emitting diode package includes a frame portion with a chip-mounting region defined in an upper portion thereof, and first and second frames spaced apart from each other. A light-emitting diode is mounted on at least a portion of the chip-mounting region with a bonding layer interposed therebetween. The frame portion includes a depressed portion formed on an upper surface thereof, and the depressed portion includes the chip-mounting region defined on a bottom thereof. The depressed portion also includes a step portion disposed at an outer upper end thereof.

公开(公告)号：US20140084322A1

公开(公告)日：2014-03-27

申请号：US14069343

申请日：2013-10-31

Applicant: SEOUL VIOSYS CO., LTD

Inventor： Jun Yong PARK ,  Hee Cheul JUNG ,  In Kyu PARK ,  Seung Wook LEE ,  Daewoong SUH

IPC: H01L33/64 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/644 ,  H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to an exemplary embodiment of the present invention includes a base, a lighting element disposed on the base, the lighting element including an epitaxial layer and a substrate disposed on the epitaxial layer, a contact member disposed between the lighting element and the base, the contact member electrically connecting the lighting element and the base, and a lens disposed on the substrate.

Abstract translation: 公开了一种发光器件及其制造方法。 根据本发明的示例性实施例的发光器件包括基座，设置在基座上的发光元件，所述发光元件包括外延层和设置在所述外延层上的基板，设置在所述照明元件 并且基座，电连接照明元件和基座的接触构件和设置在基板上的透镜。