-
公开(公告)号：US20180145237A1
公开(公告)日：2018-05-24
申请号：US15572051
申请日：2016-04-25
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jun Yong PARK , Jae Hyun PARK , Yeo Jin YOON , In Kyu PARK
IPC: H01L33/64 , H01L25/075 , H01L33/48 , H01L33/62
CPC classification number: H01L33/647 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16225
Abstract: A light-emitting device is provided. The light-emitting device comprises: a first body unit including a base part and at least three conductive patterns positioned on the base part while including a plurality of element loading areas; and a plurality of light-emitting elements positioned on the plurality of element loading areas of the first body unit, wherein at least one conductive pattern among the conductive patterns is electrically connected to at least two light-emitting elements, the at least two light-emitting elements are connected to each other in series, at least two conductive patterns among the conductive patterns include pad electrode areas, an area of the plurality of conductive patterns is 80% or more of an upper surface area of the base part, and a separation distance among the plurality of conductive patterns is 200 μm to 2,400 μm.
-
公开(公告)号：US20250006869A1
公开(公告)日：2025-01-02
申请号：US18885554
申请日：2024-09-13
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Chi Hyun IN , Jun Yong PARK , Kyu Ho LEE , Dae Woong Suh , Jong Hyeon CHAE , Chang Hoon KIM , Sung Hyun LEE
Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.
-
公开(公告)号：US20230358372A1
公开(公告)日：2023-11-09
申请号：US18223751
申请日：2023-07-19
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ki Yon PARK , Jun Yong PARK
CPC classification number: F21K9/69 , G02B19/0066 , F21Y2105/16
Abstract: A light emitting device includes a substrate, a plurality of light emitting diodes, a window, and a reflector. The substrate has a first region and a second region. The plurality of light emitting diodes are disposed on the first region of the substrate. The window has a dome shape and is disposed to cover the first region. The window is configured to control a traveling path of light emitted from the plurality of light emitting diodes. The reflector is configured to support the window and reflect the light emitted from the plurality of light emitting diodes. The reflector has an opening that exposes the plurality of light emitting diodes disposed on the substrate. A distance between two adjacent light emitting diodes of the plurality of light emitting diodes can be 500 micrometers or less.
-
公开(公告)号：US20220120388A1
公开(公告)日：2022-04-21
申请号：US17562433
申请日：2021-12-27
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ki Yon PARK , Jun Yong PARK
Abstract: A light emitting apparatus includes a substrate, a plurality of light emitting structures, a window, and a reflector. The substrate has a luminous region and a non-luminous region. The plurality of light emitting structures is disposed on the luminous region of the substrate. The window has a dome shape and is disposed to cover the luminous region. The window is configured to control a traveling path of light emitted from the a plurality of light emitting structures. The reflector is configured to support the window and reflect the light emitted from the plurality of light emitting structures. The reflector has an opening that exposes the plurality of light emitting structures mounted on the substrate. A distance between two adjacent light emitting structures of the plurality of light emitting structures is 500 micrometers or less.
-
Patent Agency Ranking
公开(公告)号：US20240344672A1
公开(公告)日：2024-10-17
申请号：US18752920
申请日：2024-06-25
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ki Yon PARK , Jun Yong PARK
IPC: F21K9/69 , F21Y105/16 , F21Y115/10 , G02B19/00
CPC classification number: F21K9/69 , G02B19/0066 , F21Y2105/16 , F21Y2115/10
Abstract: A light emitting apparatus includes a substrate, a plurality of light emitting structures, a window, and a reflector. The substrate has a luminous region and a non-luminous region. The plurality of light emitting structures is disposed on the luminous region of the substrate. The window has a dome shape and is disposed to cover the luminous region. The window is configured to control a traveling path of light emitted from the a plurality of light emitting structures. The reflector is configured to support the window and reflect the light emitted from the plurality of light emitting structures. The reflector has an opening that exposes the plurality of light emitting structures mounted on the substrate. A distance between two adjacent light emitting structures of the plurality of light emitting structures is 500 micrometers or less.
-
公开(公告)号：US20210180755A1
公开(公告)日：2021-06-17
申请号：US17170350
申请日：2021-02-08
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ki Yon PARK , Jun Yong PARK
Abstract: A light emitting apparatus comprises a substrate, a plurality of light-emitting diodes provided on the substrate and arranged in a matrix, and a dome-type window provided above the light-emitting diodes to control the path of light emitted from the light-emitting diodes. The height of the window is 70% or less of the diameter of the lower portion of the window so that the view angle of the light emitted from the light-emitting diodes is 90 degrees or less.
-
公开(公告)号：US20190019923A1
公开(公告)日：2019-01-17
申请号：US16125769
申请日：2018-09-10
Applicant: SEOUL VIOSYS CO., LTD
Inventor： Chi Hyun IN , Jun Yong PARK , Kyu Ho LEE , Dae Woong SUH , Jong Hyeon CHAE , Chang Hoon KIM , Sung Hyun LEE
CPC classification number: H01L33/486 , H01L33/20 , H01L33/44 , H01L33/505 , H01L33/62 , H01L2224/16 , H01L2933/0033
Abstract: Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
-
公开(公告)号：US20170338382A1
公开(公告)日：2017-11-23
申请号：US15673046
申请日：2017-08-09
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jun Yong PARK , Hee Cheul JUNG , In Kyu PARK , Daewoong SUH
IPC: H01L33/48 , H01L33/58 , H01L33/62 , H01L25/075
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: A light-emitting diode package includes a frame portion with a chip-mounting region defined in an upper portion thereof, and first and second frames spaced apart from each other. A light-emitting diode is mounted on at least a portion of the chip-mounting region with a bonding layer interposed therebetween. The frame portion includes a depressed portion formed on an upper surface thereof, and the depressed portion includes the chip-mounting region defined on a bottom thereof. The depressed portion also includes a step portion disposed at an outer upper end thereof.
-
公开(公告)号：US20140084322A1
公开(公告)日：2014-03-27
申请号：US14069343
申请日：2013-10-31
Applicant: SEOUL VIOSYS CO., LTD
Inventor： Jun Yong PARK , Hee Cheul JUNG , In Kyu PARK , Seung Wook LEE , Daewoong SUH
CPC classification number: H01L33/644 , H01L33/483 , H01L33/486 , H01L33/58 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2224/83192 , H01L2933/0058 , H01L2924/00014
Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to an exemplary embodiment of the present invention includes a base, a lighting element disposed on the base, the lighting element including an epitaxial layer and a substrate disposed on the epitaxial layer, a contact member disposed between the lighting element and the base, the contact member electrically connecting the lighting element and the base, and a lens disposed on the substrate.
Abstract translation: 公开了一种发光器件及其制造方法。 根据本发明的示例性实施例的发光器件包括基座，设置在基座上的发光元件，所述发光元件包括外延层和设置在所述外延层上的基板，设置在所述照明元件 并且基座，电连接照明元件和基座的接触构件和设置在基板上的透镜。
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.051 seconds)
