公开(公告)号：US20170200857A1

公开(公告)日：2017-07-13

申请号：US15469253

申请日：2017-03-24

Applicant: Seoul Viosys Co., Ltd.

Inventor： Kyung Wan KIM ,  Tae Kyoon KIM ,  Yeo Jin YOON ,  Ye Seul KIM ,  Sang Hyun OH ,  Jin Woong LEE ,  In Soo KIM

IPC: H01L33/22 ,  H01L33/32 ,  H01L33/00 ,  H01L33/06

CPC classification number: H01L33/385 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/025 ,  H01L33/06 ,  H01L33/20 ,  H01L33/22 ,  H01L33/30 ,  H01L33/32 ,  H01L2933/0016 ,  H01L2933/0058

Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.

公开(公告)号：US20150311390A1

公开(公告)日：2015-10-29

申请号：US14795167

申请日：2015-07-09

Applicant: Seoul Viosys Co., Ltd.

Inventor： Kyung Wan KIM ,  Tae Kyoon KIM ,  Yeo Jin YOON ,  Ye Seul KIM ,  Sang Hyun OH ,  Jin Woong LEE ,  In Soo KIM

IPC: H01L33/22 ,  H01L33/00

CPC classification number: H01L33/385 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/025 ,  H01L33/06 ,  H01L33/20 ,  H01L33/22 ,  H01L33/30 ,  H01L33/32 ,  H01L2933/0016 ,  H01L2933/0058

Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.

Abstract translation: 一种制造发光二极管（LED）的方法包括：在衬底上依次堆叠第一导电类型半导体层，有源层和第二导电类型半导体层; 并将基板分离为单元芯片，同时在单元芯片的侧面形成具有不规则垂直线形状的凹凸结构。

公开(公告)号：US20190123244A1

公开(公告)日：2019-04-25

申请号：US16218042

申请日：2018-12-12

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ye Seul KIM ,  Kyoung Wan KIM ,  Sang Hyun OH ,  Duk Il SUH ,  Sang Won WOO ,  Ji Hye KIM

IPC: H01L33/44 ,  H01L33/14 ,  H01L33/24 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L33/06

Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.

公开(公告)号：US20140117395A1

公开(公告)日：2014-05-01

申请号：US14067455

申请日：2013-10-30

Applicant: Seoul Viosys Co., Ltd.

Inventor： Kyung Wan KIM ,  Tae Kyoon KIM ,  Yeo Jin YOON ,  Ye Seoul KIM ,  Sang Hyun OH ,  Jin Woong LEE ,  In Soo KIM

IPC: H01L33/22 ,  H01L33/58

CPC classification number: H01L33/385 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/025 ,  H01L33/06 ,  H01L33/20 ,  H01L33/22 ,  H01L33/30 ,  H01L33/32 ,  H01L2933/0016 ,  H01L2933/0058

Abstract: Provided are a light emitting diode (LED) and a method of fabricating the same. The LED includes a unit chip. The unit chip includes a substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer which are sequentially stacked on the substrate. A concavo-convex structure having the shape of irregular vertical lines is disposed in a side surface of the unit chip.

Abstract translation: 提供一种发光二极管（LED）及其制造方法。 LED包括单元芯片。 单元芯片包括依次层叠在基板上的基板和第一导电型半导体层，有源层和第二导电型半导体层。 具有不规则垂直线形状的凹凸结构设置在单元芯片的侧表面中。