公开(公告)号：US20150200147A1

公开(公告)日：2015-07-16

申请号：US14585857

申请日：2014-12-30

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Xing- Xiang HUANG ,  Hsing-Tsai HUANG ,  Hong-Zong XU ,  Yi-Wei CHEN

IPC: H01L23/15 ,  H01L23/02 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L29/861

CPC classification number: H01L24/97 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/02 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/49833 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0652 ,  H01L29/861 ,  H01L2224/06181 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32168 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/186 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/403 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.

Abstract translation: 小型SMD二极管封装包括使用二极管芯片，其底表面具有正极和负极，在封装期间使用电路板代替常规引线框架，并使用电荷耦合器件（CCD）图像配准技术来执行芯片 粘接; 由于使用电路板而不是常规使用的引线框架，从其制造方法带来的有益优点包括简化制造工艺并降低制造成本，提高生产小型化SMD二极管封装的精度和精度，并确保 生产的小型SMD二极管封装具有优异的二极管特性，无失真或缺陷。

公开(公告)号：US20160240510A1

公开(公告)日：2016-08-18

申请号：US15018896

申请日：2016-02-09

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Xing-Xiang HUANG ,  Hsing-Tsai HUANG ,  Jie-An ZHU ,  Hong-Zong XU ,  Yi-Wei CHEN ,  Jung-Chun CHIANG

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2225/06551 ,  H01L2924/186 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.

Abstract translation: 表面安装器件（SMD）不使用常规的引线框架，并且包含由单个管芯或两个或更多个串联，并联或串联和并联的任何组合电连接的模具形成的多功能模具模块， 与现有技术相比，提供这样的SMD具有一个或多个不同的功能，包括波滤波，整流，浪涌保护，感测，限流，电压调节或防止电压回流，所公开的SMD由较少的部件形成，更简单 制造更有效地减少布线长度和噪声。

公开(公告)号：US20160035697A1

公开(公告)日：2016-02-04

申请号：US14881558

申请日：2015-10-13

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Xing- Xiang HUANG ,  Hsing-Tsai HUANG ,  Hong-Zong XU ,  Yi-Wei CHEN

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L24/97 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/02 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/49833 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0652 ,  H01L29/861 ,  H01L2224/06181 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32168 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/186 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/403 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.

Abstract translation: 制造小型化的SMD二极管封装的方法包括使用在封装期间使用电路板代替传统引线框架的底表面具有正极和负极的二极管芯片，并且使用电荷耦合器件（CCD）图像配准 技术进行芯片焊接; 由于使用电路板代替常规使用的引线框架，从制造过程中带来的有益优点包括简化制造工艺并降低制造成本，提高生产小型化SMD二极管封装的精度和精度，并确保 生产的小型SMD二极管封装具有优异的二极管特性，无失真或缺陷。