公开(公告)号：US20160240510A1

公开(公告)日：2016-08-18

申请号：US15018896

申请日：2016-02-09

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Xing-Xiang HUANG ,  Hsing-Tsai HUANG ,  Jie-An ZHU ,  Hong-Zong XU ,  Yi-Wei CHEN ,  Jung-Chun CHIANG

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2225/06551 ,  H01L2924/186 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.

Abstract translation: 表面安装器件（SMD）不使用常规的引线框架，并且包含由单个管芯或两个或更多个串联，并联或串联和并联的任何组合电连接的模具形成的多功能模具模块， 与现有技术相比，提供这样的SMD具有一个或多个不同的功能，包括波滤波，整流，浪涌保护，感测，限流，电压调节或防止电压回流，所公开的SMD由较少的部件形成，更简单 制造更有效地减少布线长度和噪声。

公开(公告)号：US20160035697A1

公开(公告)日：2016-02-04

申请号：US14881558

申请日：2015-10-13

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Xing- Xiang HUANG ,  Hsing-Tsai HUANG ,  Hong-Zong XU ,  Yi-Wei CHEN

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L24/97 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/02 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/49833 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0652 ,  H01L29/861 ,  H01L2224/06181 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32168 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/186 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/403 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A process for producing a miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from the process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.

Abstract translation: 制造小型化的SMD二极管封装的方法包括使用在封装期间使用电路板代替传统引线框架的底表面具有正极和负极的二极管芯片，并且使用电荷耦合器件（CCD）图像配准 技术进行芯片焊接; 由于使用电路板代替常规使用的引线框架，从制造过程中带来的有益优点包括简化制造工艺并降低制造成本，提高生产小型化SMD二极管封装的精度和精度，并确保 生产的小型SMD二极管封装具有优异的二极管特性，无失真或缺陷。

公开(公告)号：US20170030656A1

公开(公告)日：2017-02-02

申请号：US14814644

申请日：2015-07-31

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Kuang-Hsin CHU

IPC: F28D20/02 ,  F24J2/34

CPC classification number: F28D20/021 ,  F28D9/0062 ,  F28D9/0081 ,  F28D9/0093 ,  F28D2020/0008 ,  F28D2020/0013 ,  F28D2020/0047 ,  F28D2020/0082 ,  Y02E60/145 ,  Y02E70/30

Abstract: A thermal energy storage facility for use in heat storage and heat release comprises a heat storage/release mechanism constituted by multiple heat storage/heat exchange units stacked up, each unit at least comprises a heat storage board having parallel grooves for loading phase-change material (PCM) therein and a heat exchange plate having micro-channel groups for heat transfer fluid (HTF) flowed through to exchange heat with the PCM; particularly two or more the thermal energy storage facilities can be worked together by combination in series or/and in parallel to input of thermal energy, absorption of thermal energy and both simultaneously from the PCM, and the thermal energy storage facility capably operating at a heat storage temperature higher than 1200° C. is suited for use in solar thermal power generation system to improve overall efficiency of solar thermal power to reach 35-40%.

Abstract translation: 用于蓄热和放热的热能存储设备包括由堆叠的多个蓄热/热交换单元构成的蓄热/释放机构，每个单元至少包括具有用于装载相变材料的平行槽的蓄热板 （PCM），并且具有用于传热流体（HTF）的微通道组的热交换板流过以与PCM交换热量; 特别是两个或更多个热能储存设备可以通过与PCM输入的热能，热能的吸收和两者同时串联或并联并联在一起，以及能够以热量运行的热能存储设备 储存温度高于1200°C适用于太阳能热发电系统，以提高太阳能热功率的总体效率达到35-40％。

公开(公告)号：US20180090248A1

公开(公告)日：2018-03-29

申请号：US15709606

申请日：2017-09-20

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Jie-An ZHU ,  Zhi-Xian XU ,  Ting-Yi FANG ,  Hong-Zong XU

IPC: H01C17/06 ,  H01C7/102 ,  H01C7/10 ,  H01C1/14 ,  H01C17/28

CPC classification number: H01C17/06 ,  H01C1/14 ,  H01C7/1006 ,  H01C7/102 ,  H01C7/112 ,  H01C7/18 ,  H01C17/065 ,  H01C17/06546 ,  H01C17/281

Abstract: A process for producing a multilayer varistor (MLV) if remained its size unchanged as prior arts is favorable to outstandingly increase overall current-carrying area and improve the performance of final produced MLV; and the MLV has laminated a lower cap, an inner-electrode stack formed from piling up several inner-electrode gaps (g), and an upper cap into a unity, and at least satisfies the condition that the lower cap and the upper cap has a thickness smaller than a thickness of the inner-electrode gap (g), but equal to or greater than 0.1 times of the thickness of the inner-electrode gap (g).

公开(公告)号：US20150200147A1

公开(公告)日：2015-07-16

申请号：US14585857

申请日：2014-12-30

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Xing- Xiang HUANG ,  Hsing-Tsai HUANG ,  Hong-Zong XU ,  Yi-Wei CHEN

IPC: H01L23/15 ,  H01L23/02 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L29/861

CPC classification number: H01L24/97 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/02 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/49833 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L25/0652 ,  H01L29/861 ,  H01L2224/06181 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32168 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/186 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/403 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.

Abstract translation: 小型SMD二极管封装包括使用二极管芯片，其底表面具有正极和负极，在封装期间使用电路板代替常规引线框架，并使用电荷耦合器件（CCD）图像配准技术来执行芯片 粘接; 由于使用电路板而不是常规使用的引线框架，从其制造方法带来的有益优点包括简化制造工艺并降低制造成本，提高生产小型化SMD二极管封装的精度和精度，并确保 生产的小型SMD二极管封装具有优异的二极管特性，无失真或缺陷。

公开(公告)号：US20150123254A1

公开(公告)日：2015-05-07

申请号：US14523066

申请日：2014-10-24

Applicant: SFI Electronics Technology Inc.

Inventor： Ching-Hohn LIEN ,  Xing- Xiang HUANG ,  Hsing-Tsai HUANG ,  Hong-Zong XU

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/9221 ,  H01L2224/97 ,  H01L2924/00015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/48

Abstract: A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.

Abstract translation: 由于不含外部引脚引脚的新颖的芯片尺寸二极管封装小型化，像芯片尺寸外观，以提高尺寸精度，使得二极管封装由自动化设备适当地生产以获得自动批量生产; 所生成的二极管封装可以包含一个或多个二极管芯片，以增加在应用中更有用的通用功能，例如作为SMT二极管封装或阵列型SMT二极管制造的，以及由于不含含铅材料制成的本二极管封装 符合环保要求。