公开(公告)号：US20150307703A1

公开(公告)日：2015-10-29

申请号：US14652065

申请日：2013-02-07

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Yueshan HE ,  Shiguo SU

IPC: C08L63/00 ,  H05K1/03 ,  C08L71/00

CPC classification number: C08L63/00 ,  B32B15/092 ,  B32B15/16 ,  B32B27/20 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/50 ,  C08G59/621 ,  C08J5/24 ,  C08J2361/06 ,  C08J2363/00 ,  C08K5/357 ,  C08K5/5399 ,  C08L61/06 ,  C08L71/00 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L79/04 ,  C08L85/02

Abstract: The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.

Abstract translation: 本发明涉及无卤阻燃树脂组合物，根据重量份，树脂组合物包含：（A）具有二氢苯并恶嗪环的苯氧基磷腈化合物（A1）和化合物（A2）的混合物，该混合物包含45 -90重量份，苯氧基磷腈化合物（A1）和具有二氢苯并恶嗪环的化合物（A2）的重量比为1:25-1:2; （B）环氧当量为500-2000的环氧树脂，环氧树脂包含10-45重量份; （C）含有10-25重量份的酚醛树脂; 和（D）包含0.5-10重量份的胺固化剂。 使用无卤阻燃树脂组合物制备的印刷电路用预浸料，层压板和覆金属层压板具有玻璃化转变温度（Tg）高，耐热性高，介电损耗因数低，吸水率低等优点 以及低CTE