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公开(公告)号：US20160272808A1
公开(公告)日：2016-09-22
申请号：US15035601
申请日：2014-07-17
发明人： Jiang YOU , Yueshan HE
IPC分类号： C08L63/00 , C08J5/24 , C09D163/00 , C08L79/04 , C09D179/04
CPC分类号： C08L63/00 , C08G59/4215 , C08G59/4276 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2379/04 , C08J2463/00 , C08J2479/04 , C08K5/3437 , C08K5/50 , C08L79/04 , C08L2201/02 , C08L2201/08 , C09D163/00 , C09D179/04 , C09J163/00 , C08K3/36 , C08K5/5313 , C08L67/00
摘要： Disclosed is a halogen-free resin composition. The halogen-free resin composition comprises: (A) 10-60 parts by weight of dicyclopentadiene benzoxazine resin, (B) an epoxy resin, (C) an active ester curing agent, and (D) a phosphorus-containing flame retardant, based on 100 parts by weight of the total amount of total organic solid matters of (A), (B), (C), and (D). A prepreg and a laminate which are prepared using the halogen-free resin composition have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.
摘要翻译： 公开了一种无卤树脂组合物。 无卤树脂组合物包含：（A）10-60重量份二环戊二烯苯并恶嗪树脂，（B）环氧树脂，（C）活性酯固化剂和（D）含磷阻燃剂 （A），（B），（C）和（D）的总有机固体物质总量的100重量份。 使用无卤素树脂组合物制备的预浸料和层压体具有低介电常数，低介电损耗因子，低吸水率，高尺寸稳定性，高耐热性和良好的阻燃性，加工性和耐化学性。
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公开(公告)号：US20160237278A1
公开(公告)日：2016-08-18
申请号：US15022154
申请日：2014-03-21
发明人： Hu YANG , Yueshan HE
CPC分类号： C08L79/02 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/285 , B32B2264/102 , B32B2307/306 , B32B2307/3065 , C08G14/06 , C08J5/24 , C08J2371/12 , C08J2379/02 , C08J2425/10 , C08J2471/12 , C08K5/14 , C08K7/18 , C08L25/10 , C08L61/34 , C08L71/126 , C08L2201/02 , C08L2201/22 , C08L2205/03 , H05K1/0373 , H05K3/022 , H05K2201/012
摘要： Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.
摘要翻译： 公开了一种无卤树脂组合物，以及通过使用它们制备的预浸料和层压材料。 无卤树脂组合物按重量份含有以下成分：（A）40-80重量份烯丙基改性苯并恶嗪树脂; （B）10-20重量份烃树脂; （C）10-40重量份烯丙基改性聚苯醚树脂; （D）0.01-3重量份引发剂; （E）10-100重量份填料; 和（F）0-80重量份的磷酸阻燃剂。 通过使用无卤素树脂组合物制备的预浸料和层压体具有较低的介电常数和较低的介电损耗角正切值，较高的剥离强度，较高的玻璃化转变温度，优异的耐热性和良好的阻燃效果。
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3.发明申请公开(公告)号：US20180112133A1
公开(公告)日：2018-04-26
申请号：US15475471
申请日：2017-03-31
发明人： Yongzhen WANG , Yueshan HE , Zhongqiang YANG , Yongjing XU
CPC分类号： C09K21/12 , B32B15/092 , B32B27/20 , B32B37/06 , B32B2305/076 , B32B2307/3065 , B32B2383/00 , C07F9/659 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08K3/22 , C08K3/36 , C08K5/5399 , C08K5/5406 , C08K5/5442 , C08K2003/2206 , C08K2003/2227 , C08L27/02 , C08L2201/02 , D06M15/673 , C08L63/00
摘要： The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.
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4.发明申请PHENOXYCYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF 审中-公开酚羟基磷酸酯活性酯，无卤素树脂组合物及其用途公开(公告)号：US20160244471A1
公开(公告)日：2016-08-25
申请号：US15027369
申请日：2014-06-13
发明人： Yueshan HE
IPC分类号： C07F9/6581 , C08L79/02 , C08L75/00 , H05K1/03 , C08L63/08 , C08J5/24 , C08J5/04 , C09K21/14 , C08G59/30 , C08L71/00
CPC分类号： C07F9/65812 , C07F9/65815 , C08G59/304 , C08J5/043 , C08J5/24 , C08J2363/00 , C08J2363/08 , C08J2371/00 , C08J2375/00 , C08J2379/00 , C08J2379/02 , C08J2435/06 , C08J2463/08 , C08K5/5399 , C08L63/08 , C08L71/00 , C08L75/00 , C08L79/02 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , C09K21/12 , C09K21/14 , H05K1/0373 , H05K2201/012 , H05K2201/0145 , H05K2201/0209
摘要： The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol. % of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.
摘要翻译： 本发明公开了一种苯氧基环三磷腈活性酯，一种无卤树脂组合物及其应用。 苯氧基环三磷腈活性酯包含至少65mol。 ％具有以下结构式的物质。 无卤素树脂组合物包含5-50重量份苯氧基环三磷腈活性酯，15-85重量份热固性树脂，1-35重量份固化剂，0-5重量份固化剂 促进剂和0-100重量份的无机填料。 本发明公开了将苯氧基环三磷腈活性酯引入热固性树脂中，使活性酯与环氧树脂等热固性树脂反应而不产生羟基，不仅满足无卤素和阻燃性的要求，而且改善了电 性能（降低和稳定Dk和Df），从而使高频和高速基板材料的非卤化成为可能。
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公开(公告)号：US20150307703A1
公开(公告)日：2015-10-29
申请号：US14652065
申请日：2013-02-07
发明人： Yueshan HE , Shiguo SU
CPC分类号： C08L63/00 , B32B15/092 , B32B15/16 , B32B27/20 , B32B2260/025 , B32B2260/046 , B32B2264/102 , B32B2264/104 , B32B2307/306 , B32B2457/08 , C08G59/50 , C08G59/621 , C08J5/24 , C08J2361/06 , C08J2363/00 , C08K5/357 , C08K5/5399 , C08L61/06 , C08L71/00 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209 , C08L79/04 , C08L85/02
摘要： The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.
摘要翻译： 本发明涉及无卤阻燃树脂组合物，根据重量份，树脂组合物包含：（A）具有二氢苯并恶嗪环的苯氧基磷腈化合物（A1）和化合物（A2）的混合物，该混合物包含45 -90重量份，苯氧基磷腈化合物（A1）和具有二氢苯并恶嗪环的化合物（A2）的重量比为1:25-1:2; （B）环氧当量为500-2000的环氧树脂，环氧树脂包含10-45重量份; （C）含有10-25重量份的酚醛树脂; 和（D）包含0.5-10重量份的胺固化剂。 使用无卤阻燃树脂组合物制备的印刷电路用预浸料，层压板和覆金属层压板具有玻璃化转变温度（Tg）高，耐热性高，介电损耗因数低，吸水率低等优点 以及低CTE
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