公开(公告)号：US20180163295A1

公开(公告)日：2018-06-14

申请号：US15838982

申请日：2017-12-12

Applicant: Shibaura Mechatronics Corporation

Inventor： Akihiko ITO ,  Yoshinao KAMO ,  Shigeki MATSUNAKA ,  Atsushi FUJITA

IPC: C23C14/34 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  C23C14/50 ,  C23C16/458 ,  H01J37/32 ,  H01J37/34

CPC classification number: C23C14/3464 ,  C23C14/022 ,  C23C14/185 ,  C23C14/34 ,  C23C14/505 ,  C23C14/541 ,  C23C16/458 ,  H01J37/32 ,  H01J37/32715 ,  H01J37/34 ,  H01J37/3429 ,  H01L21/561 ,  H01L21/563 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68778 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2221/68313

Abstract: A film formation apparatus includes a carrying unit circulating and carrying an electronic component in a chamber, a film formation processing unit forming a film on the electronic component, a tray carried by the carrying unit, and including a mount surface, and a mount member which is mounted on the mount surface, and on which the electronic component is placed. The mount member includes a holding sheet having an adhesive surface, and a non-adhesive surface, and a sticking sheet having a first sticking surface with adhesiveness sticking to the non-adhesive surface, and a second sticking surface with adhesiveness sticking to the mount surface of the tray. The adhesive surface includes a pasting region for pasting the electronic components. The first sticking surface sticks across an entire region of the non-adhesive surface corresponding to at least the pasting region.

公开(公告)号：US20180110162A1

公开(公告)日：2018-04-19

申请号：US15730361

申请日：2017-10-11

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Akihiko ITO ,  Yoshinao KAMO ,  Shigeki MATSUNAKA ,  Atsushi FUJITA

IPC: H05K9/00 ,  H01L21/56

CPC classification number: H05K9/0084 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/68764 ,  H01L21/68771 ,  H01L23/552 ,  H05K9/0024

Abstract: An electronic component, an electronic component manufacturing apparatus, and an electronic component manufacturing method are provided which enable an electromagnetic wave shielding film formed on a package to achieve an excellent shielding characteristic. An electronic component 10 includes an electromagnetic wave shielding film 13 formed on the top face of a package sealing elements. The thickness of the electromagnetic wave shielding film 13 on the top face of the package 12 is 0.5 to 9 μm, and the relationship between the average height Rc of the roughness curvature factor of the top face of the package 12 and the thickness Te of the electromagnetic wave shielding film 13 is Rc≤2Te.