公开(公告)号：US20150090297A1

公开(公告)日：2015-04-02

申请号：US14495314

申请日：2014-09-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun MATSUSHITA ,  Yuji NAGASHIMA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI

IPC: B08B3/08 ,  B08B3/02 ,  H01L21/67

CPC classification number: B08B3/08 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

Abstract translation: 基板处理装置10具有除水单元110，当溶剂供给单元58向基板W的表面供给挥发性溶剂时，除水单元110向基板W的表面供给除水剂，以促进 用挥发性溶剂代替基材W表面上的清洗水。

公开(公告)号：US20170259308A1

公开(公告)日：2017-09-14

申请号：US15608554

申请日：2017-05-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun MATSUSHITA ,  Yuji NAGASHIMA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI

IPC: B08B3/08 ,  H01L21/67 ,  B08B3/02

CPC classification number: B08B3/08 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

公开(公告)号：US20160322241A1

公开(公告)日：2016-11-03

申请号：US15141946

申请日：2016-04-29

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun MATSUSHITA ,  Takashi MIYAMOTO ,  Konosuke HAYASHI ,  Osamu YAMAZAKI

IPC: H01L21/67 ,  F26B3/30 ,  H01L21/687

CPC classification number: F26B3/30 ,  F26B5/08 ,  H01L21/67115

Abstract: The substrate processing unit 1 comprises the rotating table 31 configured to hold substrate W, the processing chamber 37 which accommodates the rotating table 31, a lamp 61 is provided above the processing chamber 37 and configured to heat the surface of substrate W, the lamp chamber 60 which accommodates that lamp 61, a transmission window 62 disposed below the lamp chamber 60, and a plurality of nozzle 64 which supply cooling fluid G to the transmission window 62. Then the substrate processing unit 1 can suppress generating of a water mark or pattern collapse, and can perform good substrate processing.

Abstract translation: 基板处理单元1包括被配置为保持基板W的旋转台31，容纳旋转台31的处理室37，在处理室37的上方设置有灯61，其构造为加热基板W的表面，灯室 60，其容纳该灯61，设置在灯室60下方的透射窗62以及将冷却流体G供给到透射窗62的多个喷嘴64.然后，基板处理单元1可以抑制水印或图案的产生 崩溃，并可以执行良好的基板处理。

公开(公告)号：US20150090296A1

公开(公告)日：2015-04-02

申请号：US14495118

申请日：2014-09-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yuji NAGASHIMA ,  Jun MATSUSHITA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI ,  Masaaki FURUYA ,  Hidehito AZUMANO ,  Toyoyasu TAUCHI

IPC: B08B3/10

CPC classification number: B08B3/10 ,  H01L21/67028

Abstract: A substrate processing device 100 includes a solvent replacing unit (organic solvent supply unit 15 and solvent supply unit 34) replacing a cleaning liquid with a volatile solvent of a low concentration, and thereafter further performing replacement with a volatile solvent of a high concentration.

Abstract translation: 基板处理装置100包括用低浓度的挥发性溶剂代替清洗液的溶剂置换单元（有机溶剂供给单元15和溶剂供给单元34），然后进一步用高浓度的挥发性溶剂进行置换。