公开(公告)号：US20180033651A1

公开(公告)日：2018-02-01

申请号：US15661480

申请日：2017-07-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke HAYASHI ,  Kunihiro MIYAZAKI

IPC: H01L21/67 ,  F16K37/00 ,  H01L21/687

CPC classification number: H01L21/6708 ,  F16K37/005 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/68764

Abstract: According to one embodiment, a processing liquid generator capable of improving the reliability of the concentration of generated processing liquid is provided.A processing liquid generator that generates processing liquid having undergone concentration adjustment includes a processing liquid adjuster (11a), which adjusts the concentration of the processing liquid, a first processing liquid path P1, through which the processing liquid flows to the processing liquid adjuster (11a), a second processing liquid path P2, through which the processing liquid flows to the processing liquid adjuster 11a, a first concentration meter 201a, which measures the concentration of the processing liquid flowing through the first processing liquid path P1, the measured concentration being the concentration of a component involved in the concentration adjustment in the processing liquid adjuster (11a), a second concentration meter 201b, which measures the concentration of the processing liquid flowing through the second processing liquid path P2, the measured concentration being the concentration of a component that is involved in the concentration adjustment and should be measured with the first concentration meter 201a in terms of concentration, a first valve mechanism 120a/130a, which opens and closes the first processing liquid path P1, and a second valve mechanism 120b/130b, which opens and closes the second processing liquid path P2.

公开(公告)号：US20170259308A1

公开(公告)日：2017-09-14

申请号：US15608554

申请日：2017-05-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun MATSUSHITA ,  Yuji NAGASHIMA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI

IPC: B08B3/08 ,  H01L21/67 ,  B08B3/02

CPC classification number: B08B3/08 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

公开(公告)号：US20150090297A1

公开(公告)日：2015-04-02

申请号：US14495314

申请日：2014-09-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun MATSUSHITA ,  Yuji NAGASHIMA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI

IPC: B08B3/08 ,  B08B3/02 ,  H01L21/67

CPC classification number: B08B3/08 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

Abstract translation: 基板处理装置10具有除水单元110，当溶剂供给单元58向基板W的表面供给挥发性溶剂时，除水单元110向基板W的表面供给除水剂，以促进 用挥发性溶剂代替基材W表面上的清洗水。

公开(公告)号：US20160093486A1

公开(公告)日：2016-03-31

申请号：US14867458

申请日：2015-09-28

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kunihiro MIYAZAKI ,  Kenji MINAMI ,  Yuji NAGASHIMA ,  Konosuke HAYASHI

IPC: H01L21/02 ,  B08B3/08

CPC classification number: H01L21/6708 ,  G03F7/423 ,  H01L21/31133

Abstract: According to one embodiment, a substrate processing apparatus includes a first liquid supplier, a second liquid supplier, and a controller. The first liquid supplier supplies a substrate with a sulfuric acid solution having a first temperature equal to or higher than the boiling point of hydrogen peroxide water. The second liquid supplier supplies a surface to be treated of the substrate with a mixture of sulfuric acid solution and hydrogen peroxide water having a second temperature lower than the first temperature. The controller controls the first liquid supplier to supply the sulfuric acid solution so as to heat the substrate to the boiling point of hydrogen peroxide water or higher. When the temperature of the substrate becomes equal to or higher than the second temperature, the controller controls the first liquid supplier to stop supplying the sulfuric acid solution and controls the second liquid supplier to supply the mixture.

Abstract translation: 根据一个实施例，基板处理装置包括第一液体供应器，第二液体供应器和控制器。 第一液体供应器向基材供应具有等于或高于过氧化氢水沸点的第一温度的硫酸溶液。 第二液体供应器用第二温度低于第一温度的硫酸溶液和过氧化氢水的混合物供应待处理的表面。 控制器控制第一液体供应商供应硫酸溶液，以将基底加热至过氧化氢水的沸点或更高。 当基板的温度变得等于或高于第二温度时，控制器控制第一液体供应商停止供应硫酸溶液并控制第二液体供应器供应混合物。

公开(公告)号：US20160025409A1

公开(公告)日：2016-01-28

申请号：US14773055

申请日：2014-02-28

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kunihiro MIYAZAKI ,  Konosuke HAYASHI ,  Takashi OOTAGAKI ,  Yuji NAGASHIMA

IPC: F26B3/30 ,  F26B7/00 ,  F26B11/18 ,  F26B5/00

CPC classification number: F26B3/30 ,  F26B3/28 ,  F26B5/005 ,  F26B7/00 ,  F26B11/18 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/67115

Abstract: According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.

Abstract translation: 根据一个实施例，一种基板处理装置（1）包括：配置成支撑基板W的台（4），配置成将挥发性溶剂供应到工作台（4）上的基板W的表面的溶剂供应单元（8） ）和被配置为向已经供给了挥发性溶剂的基板W发光的照射器（10），并且用作加热基板W的加热器，使得在基板W的表面上形成气体层 使挥发性溶剂成为液体球。 因此，可以成功地干燥基板以及抑制图案塌陷。

公开(公告)号：US20150090296A1

公开(公告)日：2015-04-02

申请号：US14495118

申请日：2014-09-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yuji NAGASHIMA ,  Jun MATSUSHITA ,  Konosuke HAYASHI ,  Kunihiro MIYAZAKI ,  Masaaki FURUYA ,  Hidehito AZUMANO ,  Toyoyasu TAUCHI

IPC: B08B3/10

CPC classification number: B08B3/10 ,  H01L21/67028

Abstract: A substrate processing device 100 includes a solvent replacing unit (organic solvent supply unit 15 and solvent supply unit 34) replacing a cleaning liquid with a volatile solvent of a low concentration, and thereafter further performing replacement with a volatile solvent of a high concentration.

Abstract translation: 基板处理装置100包括用低浓度的挥发性溶剂代替清洗液的溶剂置换单元（有机溶剂供给单元15和溶剂供给单元34），然后进一步用高浓度的挥发性溶剂进行置换。

公开(公告)号：US20140041694A1

公开(公告)日：2014-02-13

申请号：US13961216

申请日：2013-08-07

Applicant: Shibaura Mechatronics Corporation

Inventor： Kunihiro MIYAZAKI ,  Konosuke Hayashi

IPC: H01L21/67

CPC classification number: H01L21/6704 ,  B08B3/02 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/31133 ,  H01L21/67017 ,  H01L21/67051

Abstract: An cleaning solution producing apparatus according to an embodiment includes: a mixing unit configured to produce a liquid mixture by mixing a hydrogen peroxide solution into an acidic or alkaline liquid, and to raise the pressure of the produced liquid mixture by use of an oxygen gas produced through the decomposition of the hydrogen peroxide solution, or by use of vapor produced by heat of the reaction; and a bubble producing unit configured to produce multiple fine bubbles in the liquid mixture by releasing the pressure of the liquid mixture which is raised by the mixing unit.

Abstract translation: 根据一个实施方案的清洗溶液生产设备包括：混合单元，其被配置为通过将过氧化氢溶液混合到酸性或碱性液体中来产生液体混合物，并通过使用产生的氧气提高所产生的液体混合物的压力 通过过氧化氢溶液的分解，或通过使用由反应热产生的蒸气; 以及气泡产生单元，其被配置为通过释放由所述混合单元升高的液体混合物的压力而在所述液体混合物中产生多个细小气泡。