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公开(公告)号：US20150093906A1
公开(公告)日：2015-04-02
申请号：US14490939
申请日：2014-09-19
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Nobuo KOBAYASHI , Koichi HAMADA , Yoshiaki KUROKAWA , Masaaki FURUYA , Hideki MORI , Yasushi WATANABE , Yoshinori HAYASHI
CPC classification number: H01L21/31111 , H01L21/67017 , H01L21/6708
Abstract: A substrate treatment apparatus which can more efficiently regenerate phosphoric acid which is able to be returned to etching treatment along with such etching treatment as much as possible without using a large facility, that is a substrate treatment apparatus which treats a silicon substrate W on which a nitride film is formed by a liquid etchant which contains phosphoric acid, which comprises an etching treatment unit (the spin treatment unit 30) which gives a suitable quantity of liquid, etchant to each substrate which is fed one at a time so as to etch the substrate and remove the nitride film, a phosphoric acid regenerating unit (the spin treatment unit 30) which mixes liquid etchant used for treatment of one substrate and a suitable quantity of liquid hydrofluoric acid for the amount of the used liquid etchant under a predetermined temperature environment to regenerate the phosphoric acid, and a phosphoric acid recovery unit (the pump 38, phosphoric acid recovery tank 50, and pump 52) which returns the phosphoric acid which was obtained by the phosphoric acid regenerating unit to the liquid etchant to be used at the etching treatment unit.
Abstract translation: 一种能够更有效地再生磷酸的基板处理装置，其可以在不使用大的设备的情况下尽可能多地进行蚀刻处理而返回到蚀刻处理，也就是基板处理装置，其处理硅基板W， 氮化物膜由含有磷酸的液体蚀刻剂形成，该液体蚀刻剂包括蚀刻处理单元（旋转处理单元30），该蚀刻处理单元（旋转处理单元30）向每个衬底提供适当量的液体，蚀刻剂，每个衬底一次一个地蚀刻， 基板并去除氮化物膜，将磷酸再生单元（旋转处理单元30）在预定温度环境下将用于处理一个基板的液体蚀刻剂和适量的液体氢氟酸混合使用液体蚀刻剂的量 再生磷酸，磷酸回收装置（泵38，磷酸回收槽50，pu mp 52），其将由磷酸再生单元获得的磷酸返回到在蚀刻处理单元处使用的液体蚀刻剂。
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公开(公告)号：US20150059642A1
公开(公告)日：2015-03-05
申请号：US14472923
申请日：2014-08-29
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki FURUYA
CPC classification number: H01L21/67028 , G03F7/162 , G03F7/3021 , H01L21/67051 , H01L21/6715 , H01L21/68785
Abstract: A spin treatment apparatus according to an embodiment includes: an annular liquid receiver surrounding a rotating substrate at a distance from an outer periphery of the substrate and configured to receive liquid flying from the rotating substrate and accommodate the liquid; an annular cup body surrounding the liquid receiver at a distance from an outer periphery of the liquid receiver and forming an annular outer exhaust flow channel for generating an airflow along an upper surface to an outer peripheral surface of the liquid receiver; and an annular partitioning member provided inside the annular liquid receiver and forming an annular inner exhaust flow channel for generating an airflow along an inner peripheral surface to a lower surface of the liquid receiver.
Abstract translation: 根据实施例的旋转处理装置包括：围绕旋转基板的环形液体接收器，与基板的外周距离一定距离，并且构造成接收从旋转基板飞出并容纳液体的液体; 围绕所述液体接收器的环形杯体，所述环形杯体与所述液体接收器的外周距离一定距离，并且形成用于沿着所述液体接收器的外表面的上表面产生气流的环形外排气流动通道; 以及环形分隔构件，其设置在所述环形液体接收器内部并形成环形内部排气流动通道，用于沿着所述液体接收器的内周表面到下表面产生气流。
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公开(公告)号：US20230081295A1
公开(公告)日：2023-03-16
申请号：US17942786
申请日：2022-09-12
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki FURUYA , Hiroaki KOBAYASHI , Hideki MORI
Abstract: A supply device includes a collect tank which collects a process liquid from a substrate processing device and heats the collected liquid, and a supply tank connected to the collect tank and which supplies, to the substrate processing device, the process liquid heated in the collect tank. The collect tank includes a collect container that stores the process liquid, a first dividing plate that divides the collect container into a first region where the process liquid is introduced from the substrate processing device, and a second region that introduces the process liquid to the supply tank, piping that feeds, to the second region, the process liquid introduced in the first region, a first heater provided on a path through the piping and which heats the process liquid, and feed piping that feeds, to the supply tank, the process liquid in the second region and heated by the first heater.
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公开(公告)号：US20140261566A1
公开(公告)日：2014-09-18
申请号：US14212899
申请日：2014-03-14
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Konosuke HAYASHI , Masaaki FURUYA , Takashi OOTAGAKI , Yuji NAGASHIMA , Atsushi KINASE , Masahiro ABE
IPC: B08B3/10
CPC classification number: B08B3/10 , H01L21/67028 , H01L21/67034
Abstract: A substrate processing device 10 includes a suction drying unit 65 drying a surface of a substrate W by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate W by a heating operation of a heating unit 64.
Abstract translation: 基板处理装置10包括吸引干燥单元65，其通过加热单元64的加热操作吸收和去除形成在基板W的表面上的挥发性溶剂的液滴来干燥基板W的表面。
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公开(公告)号：US20230077617A1
公开(公告)日：2023-03-16
申请号：US17942520
申请日：2022-09-12
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki FURUYA , Hiroaki KOBAYASHI , Hideki MORI
IPC: H01L21/67
Abstract: According to one embodiment, provided is a supply tank a supply device, and a supply system that stabilizes the liquid temperature of a process liquid to be supplied to a substrate processing device. A supply tank that supplies a process liquid to a substrate processing device includes a container that stores the process liquid, a first dividing plate that divides the container into a first region where the process liquid is introduced, and a second region that supplies the process liquid to the substrate processing device, first piping that feeds, to the second region, the process liquid introduced in the first region, and a first heater which is provided on a path through the first piping, and which heats the process liquid.
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Patent Agency Ranking
公开(公告)号：US20200025643A1
公开(公告)日：2020-01-23
申请号：US16587737
申请日：2019-09-30
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masataka YOKOI , Nobuo KOBAYASHI , Masaaki FURUYA , Atsushi KINASE
Abstract: According to one of embodiments, a gas leak detecting device of a heater pipe and a gas leak detecting method of a heater pipe which are able to reliably detect a leak of gas from a heater pipe in which a fine hole is formed are provided. There is provided a gas leak detecting device of a heater pipe 10 which is provided with an inside pipe 10a housing a heater element and an outside pipe 10b sealed surrounding this inside pipe and which is adjusted through piping 30 by a pressure adjustment mechanism 20 in gas pressure in a space between the outside pipe 10b and the inside pipe 10a to a predetermined pressure value, comprising a gas flow resistance part 21 (213) provided at the piping 30 and locally resistant to flow of gas, a pressure detection unit 23 detecting gas pressure of a space between the outside pipe 10b and the inside pipe 10a between the gas flow resistance part 21 and the heater pipe 10 in the piping 30, and a leak judging means 50 for judging whether gas is leaking from the heater pipe 10 based on a detected pressure value obtained by the pressure detection unit 23.
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7.发明申请公开(公告)号：US20170287767A1
公开(公告)日：2017-10-05
申请号：US15472671
申请日：2017-03-29
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki FURUYA
IPC: H01L21/687 , H01L21/677 , H01L21/67
Abstract: According to one embodiment, a substrate transfer apparatus includes: a first gripping plate; a first claw that is supported by the first gripping plate, and has an abutment surface abutting on the outer peripheral surface of a substrate located above and below a surface of the first gripping plate; a second gripping plate arranged as overlapping with the first gripping plate; a second claw that is supported by the second gripping plate, and has an abutment surface abutting on the outer peripheral surface of the substrate located above and below the surface of the first gripping plate; and a gripping part configured to move the first gripping plate and the second gripping plate relative to each other such that the first claw and the second claw move close to and away from each other in a direction intersecting the outer peripheral surface of the substrate.
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公开(公告)号：US20150083038A1
公开(公告)日：2015-03-26
申请号：US14491065
申请日：2014-09-19
Applicant: Shibaura Mechatronics Corporation
Inventor： Masaaki FURUYA
CPC classification number: G03F7/162 , G03F7/3021 , G03F7/42 , H01L21/68728
Abstract: A spin treatment apparatus according to an embodiment performs a treatment while rotating a substrate and includes: at least three clamp pins configured to contact an outer peripheral surface of the substrate and clamp the substrate; rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator parallel with a rotation axis of the substrate; magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator; rotation magnets provided for the respective magnet gears and positioned to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and a movement mechanism configured to move the rotation magnets along the rotation axes of the pin rotators.
Abstract translation: 根据实施例的旋转处理装置在旋转基板的同时执行处理，并且包括：至少三个夹持销，其构造成接触基板的外周表面并夹持基板; 为相应的夹紧销提供的可旋转的针式转子，并且每个构造成将相应的夹紧销保持在与转子的旋转轴线偏置的位置，该位置与衬底的旋转轴线平行; 磁轮齿轮围绕其外周表面设置用于相应的销转子，并且每个具有围绕销转子的旋转轴线螺旋形成的磁极部分; 设置在各磁铁上的旋转磁铁，定位成吸引并被相应磁齿轮的磁极部吸引; 以及移动机构，其构造成沿着所述销转子的旋转轴线移动所述旋转磁体。
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9.发明公开公开(公告)号：US20230307263A1
公开(公告)日：2023-09-28
申请号：US18125310
申请日：2023-03-23
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki FURUYA , Hiroaki KOBAYASHI , Hideki MORI
IPC: H01L21/67
CPC classification number: H01L21/6708 , H01L21/67248 , H01L21/67253
Abstract: According to one embodiment, a processing liquid supply device includes: a tank that stores the processing liquid; a supply path that supplies the processing liquid to the processing device; a heater that heats the processing liquid; a thermometer that measures a temperature of the processing liquid; a densitometer that measures a concentration of the processing liquid; and a controller including an inspecting unit that inspects the densitometer. The inspecting unit includes: a temperature setting device that sets a boiling point temperature at which a predetermined concentration is reached as a predetermined temperature; a heating controller that heats the processing liquid by the heater so as to reach a target temperature within a predetermined range; and a determination device that determines whether or not the concentration of the processing liquid is a target concentration within a predetermined range based on the predetermined concentration.
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10.发明公开公开(公告)号：US20230286013A1
公开(公告)日：2023-09-14
申请号：US18119401
申请日：2023-03-09
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Masaaki FURUYA , Hiroaki KOBAYASHI , Hideki MORI
IPC: B05C11/10
CPC classification number: B05C11/1007 , B05C11/1036 , B05C11/1042 , B05C11/1047
Abstract: According to one embodiment, a processing liquid supply device includes a plurality of tanks, a supply path that supplies a processing liquid to a processing device, a heating unit that heats the processing liquid, a dilution unit that dilutes the processing liquid, a new-liquid supply unit that supplies a new liquid, a common flow path through which the processing liquid of the plurality of tanks passes, a switching unit that switches between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path, a densitometer provided in the common flow path, and a control device that controls at least one of the heating unit, the dilution unit, and the new-liquid supply unit so that the concentration reaches a target value set in advance.
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