公开(公告)号：US20210276055A1

公开(公告)日：2021-09-09

申请号：US17181227

申请日：2021-02-22

Applicant: Shibaura Mechatronics Corporation

Inventor： Minami NAKAMURA ,  Daisuke MATSUSHIMA ,  Kensuke DEMURA

IPC: B08B7/00 ,  G03F7/20 ,  B08B7/04 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand side, a detector configured to detect a state of the liquid on the surface of the substrate, and a controller controlling at least one of a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, obtains a temperature of the liquid in the supercooled state at a start of freezing, and is configured to calculate a removal ratio of a contamination.

公开(公告)号：US20230271231A1

公开(公告)日：2023-08-31

申请号：US18114377

申请日：2023-02-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA

IPC: B08B7/00

CPC classification number: B08B7/0092 ,  B08B7/0014

Abstract: According to one embodiment, a substrate processing apparatus includes: a stage rotatable around a central axis; a plurality of holders provided on the stage to hold a substrate; a cooler capable of supplying a cooling gas to a space between the stage and the substrate; and a liquid supply capable of supplying a liquid to a surface of the substrate on an opposite side to the stage. When holding the substrate, each of the plurality of holders moves toward the central axis along a surface of the stage so as to surround a peripheral edge of the substrate and the space between the stage and the substrate.

公开(公告)号：US20210323036A1

公开(公告)日：2021-10-21

申请号：US17230152

申请日：2021-04-14

Applicant: Shibaura Mechatronics Corporation

Inventor： Daisuke MATSUSHIMA ,  Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA

IPC: B08B7/00 ,  B08B3/10 ,  B08B3/08 ,  B08B3/04 ,  F25C1/12

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

公开(公告)号：US20240096653A1

公开(公告)日：2024-03-21

申请号：US18469619

申请日：2023-09-19

Applicant: SHIBAURA MECHATRONICS CORPORATION ,  KIOXIA CORPORATION

Inventor： Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA ,  Kosuke TAKAI ,  Mana TANABE ,  Kaori UMEZAWA

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/67023 ,  H01L21/67109 ,  H01L21/68764

Abstract: According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.

公开(公告)号：US20220310417A1

公开(公告)日：2022-09-29

申请号：US17704135

申请日：2022-03-25

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Minami NAKAMURA ,  Kensuke DEMURA

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate treatment device includes a placement platform rotating a substrate, a cooling part supplying a cooling gas to a space between the placement platform and the substrate, a liquid supplier supplying a liquid to a surface of the substrate opposite to the placement platform side, a detector that is above the surface of the substrate and detects a freezing start of the liquid, and a controller controlling the substrate rotation, the cooling gas supply, and the liquid supply. The controller controls at least one of the substrate rotation, the cooling gas flow rate, or the liquid supply rate, and causes the liquid on the substrate surface to reach a supercooled state; and when determining based on a signal from the detector that the freezing of the supercooled liquid has started, the controller starts thawing the frozen liquid after a prescribed interval has elapsed from the freezing start of the liquid.