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公开(公告)号：US20240096653A1
公开(公告)日：2024-03-21
申请号：US18469619
申请日：2023-09-19
Applicant: SHIBAURA MECHATRONICS CORPORATION , KIOXIA CORPORATION
Inventor： Kensuke DEMURA , Satoshi NAKAMURA , Masaya KAMIYA , Minami NAKAMURA , Kosuke TAKAI , Mana TANABE , Kaori UMEZAWA
IPC: H01L21/67 , H01L21/02 , H01L21/687
CPC classification number: H01L21/67051 , H01L21/02052 , H01L21/67023 , H01L21/67109 , H01L21/68764
Abstract: According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.
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公开(公告)号：US20250108411A1
公开(公告)日：2025-04-03
申请号：US18895864
申请日：2024-09-25
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Satoshi NAKAMURA , Kensuke DEMURA , Masaya KAMIYA
Abstract: According to one embodiment a substrate treatment apparatus removes foreign matter from a surface of a substrate by forming a frozen film at the surface of the substrate, incorporating, into the frozen film, the foreign matter adhered to the surface of the substrate, and thawing the frozen film including the foreign matter. A liquid supply part that supplies a liquid to the frozen film including the foreign matter, a vibrating part that faces the frozen film, and a controller that controls the vibrating part are included. The controller controls the vibrating part to transmit a vibration to a liquid film, which includes the liquid supplied to the frozen film and a liquid generated by the thawing of the frozen film, and to reduce an energy of the vibration transmitted to the liquid film or stop the vibration according to a position of an upper surface of the frozen film under the liquid film.
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公开(公告)号：US20180117795A1
公开(公告)日：2018-05-03
申请号：US15860044
申请日：2018-01-02
Inventor： Kensuke DEMURA , Satoshi Nakamura , Daisuke Matsushima , Masayuki Hatano , Hiroyuki Kashiwagi
Abstract: According to one embodiment, an imprint template manufacturing apparatus includes: a supply head that supplies a liquid-repellent material in liquid form to a template having a convex portion where a concavo-convex pattern is formed on a stage; a moving mechanism that moves the stage and the supply head relatively in a direction along the stage; a controller that controls the supply head and the moving mechanism such that the supply head applies the liquid-repellent material to at least a side surface of the convex portion so as to avoid the concavo-convex pattern; and a cleaning unit that supplies a liquid to the template coated with the liquid-repellent material. The liquid-repellent material contains a liquid-repellent component and a non-liquid-repellent component that react with the surface of the template, and a volatile solvent that dissolves the liquid-repellent component. The liquid is a fluorine-based volatile solvent that dissolves the non-liquid-repellent component.
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公开(公告)号：US20220310417A1
公开(公告)日：2022-09-29
申请号：US17704135
申请日：2022-03-25
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Minami NAKAMURA , Kensuke DEMURA
IPC: H01L21/67 , H01L21/687
Abstract: A substrate treatment device includes a placement platform rotating a substrate, a cooling part supplying a cooling gas to a space between the placement platform and the substrate, a liquid supplier supplying a liquid to a surface of the substrate opposite to the placement platform side, a detector that is above the surface of the substrate and detects a freezing start of the liquid, and a controller controlling the substrate rotation, the cooling gas supply, and the liquid supply. The controller controls at least one of the substrate rotation, the cooling gas flow rate, or the liquid supply rate, and causes the liquid on the substrate surface to reach a supercooled state; and when determining based on a signal from the detector that the freezing of the supercooled liquid has started, the controller starts thawing the frozen liquid after a prescribed interval has elapsed from the freezing start of the liquid.
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公开(公告)号：US20220080468A1
公开(公告)日：2022-03-17
申请号：US17469876
申请日：2021-09-09
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Kensuke DEMURA , Daisuke MATSUSHIMA , Masaya KAMIYA
IPC: B08B3/10 , H01L21/687 , B08B7/00 , B08B3/04 , B08B13/00
Abstract: A substrate processing apparatus according to an embodiment of the present disclosure includes a stage having a substantially disc-shaped form and including a hole in a center thereof; a roller that contacts a side surface of the stage and rotates the stage; a first liquid nozzle that supplies a first liquid to a first surface of the substrate; a first driver that moves a position of the first liquid nozzle; a second liquid nozzle that supplies a second liquid from the hole of the stage to a second surface of the substrate; a second driver that moves a position of the second liquid nozzle; a cooling nozzle that supplies a cooling gas from the hole of the stage to the second surface; a third driver that moves a position of the cooling nozzle; and a controller that controls the first driver, the second driver, and the third driver.
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Patent Agency Ranking
公开(公告)号：US20230271231A1
公开(公告)日：2023-08-31
申请号：US18114377
申请日：2023-02-27
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Kensuke DEMURA , Satoshi NAKAMURA , Masaya KAMIYA , Minami NAKAMURA
IPC: B08B7/00
CPC classification number: B08B7/0092 , B08B7/0014
Abstract: According to one embodiment, a substrate processing apparatus includes: a stage rotatable around a central axis; a plurality of holders provided on the stage to hold a substrate; a cooler capable of supplying a cooling gas to a space between the stage and the substrate; and a liquid supply capable of supplying a liquid to a surface of the substrate on an opposite side to the stage. When holding the substrate, each of the plurality of holders moves toward the central axis along a surface of the stage so as to surround a peripheral edge of the substrate and the space between the stage and the substrate.
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公开(公告)号：US20210323036A1
公开(公告)日：2021-10-21
申请号：US17230152
申请日：2021-04-14
Applicant: Shibaura Mechatronics Corporation
Inventor： Daisuke MATSUSHIMA , Kensuke DEMURA , Satoshi NAKAMURA , Masaya KAMIYA , Minami NAKAMURA
Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.
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公开(公告)号：US20210265159A1
公开(公告)日：2021-08-26
申请号：US17181264
申请日：2021-02-22
Applicant: Shibaura Mechatronics Corporation
Inventor： Kensuke DEMURA , Daisuke MATSUSHIMA , Masaya KAMIYA
Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.
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公开(公告)号：US20180016673A1
公开(公告)日：2018-01-18
申请号：US15715966
申请日：2017-09-26
Inventor： Satoshi NAKAMURA , Kensuke DEMURA , Daisuke MATSUSHIMA , Masayuki HATANO , Hiroyuki KASHIWAGI , Chen KANG , Ganachev Ivan PETROV
CPC classification number: C23C14/042 , B29C33/3842 , B29C59/022 , C23C14/246 , G03F7/0002
Abstract: According to one embodiment, an imprint template manufacturing apparatus includes a support unit, a vaporization unit, and an adhesion preventing plate. The support unit supports a template that includes a base having a main surface, and a convex portion provided on the main surface and having an end surface. A concavo-convex pattern to be pressed against a liquid material to be transferred is formed on the end surface. The support unit supports the template with the convex portion facing downward. The vaporization unit is located below the template on the support unit and configured to vaporize a liquid-repellent material. The adhesion preventing plate is located below the template on the support unit and configured to allow the liquid-repellent material vaporized to adhere to the side surface of the convex portion of the template and to prevent it from adhering to the concavo-convex pattern.
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公开(公告)号：US20220068671A1
公开(公告)日：2022-03-03
申请号：US17460566
申请日：2021-08-30
Applicant: SHIBAURA MECHATRONICS CORPORATION
Inventor： Kensuke DEMURA , Daisuke MATSUSHIMA , Masaya KAMIYA
IPC: H01L21/67 , H01L21/687
Abstract: A substrate processing apparatus according to an embodiment of the present disclosure includes: a stage; a plurality of holders configured to hold a substrate; a liquid supply configured to supply a liquid to a surface of the substrate opposite to the stage; a cooler configured to supply a cooling gas to a space between the stage and the substrate; a mover configured to change a distance between the stage and the substrate; and a controller configured to control the cooler and the mover. The controller performs a cooling process that at least includes a supercooling process and a freezing process (solid-liquid phase), and a thawing process after the cooling process. In the cooling process, the controller controls the mover to set the distance to a first distance, and in the thawing process, the controller controls the mover to set the distance to a second distance longer than the first distance.
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