SUBSTRATE PROCESSING APPARATUS
    4.
    发明公开

    公开(公告)号:US20230271231A1

    公开(公告)日:2023-08-31

    申请号:US18114377

    申请日:2023-02-27

    CPC classification number: B08B7/0092 B08B7/0014

    Abstract: According to one embodiment, a substrate processing apparatus includes: a stage rotatable around a central axis; a plurality of holders provided on the stage to hold a substrate; a cooler capable of supplying a cooling gas to a space between the stage and the substrate; and a liquid supply capable of supplying a liquid to a surface of the substrate on an opposite side to the stage. When holding the substrate, each of the plurality of holders moves toward the central axis along a surface of the stage so as to surround a peripheral edge of the substrate and the space between the stage and the substrate.

    SUBSTRATE TREATMENT DEVICE
    5.
    发明申请

    公开(公告)号:US20210323036A1

    公开(公告)日:2021-10-21

    申请号:US17230152

    申请日:2021-04-14

    Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

    SUBSTRATE TREATMENT APPARATUS AND PROCESSING METHOD OF SUBSTRATE

    公开(公告)号:US20250108411A1

    公开(公告)日:2025-04-03

    申请号:US18895864

    申请日:2024-09-25

    Abstract: According to one embodiment a substrate treatment apparatus removes foreign matter from a surface of a substrate by forming a frozen film at the surface of the substrate, incorporating, into the frozen film, the foreign matter adhered to the surface of the substrate, and thawing the frozen film including the foreign matter. A liquid supply part that supplies a liquid to the frozen film including the foreign matter, a vibrating part that faces the frozen film, and a controller that controls the vibrating part are included. The controller controls the vibrating part to transmit a vibration to a liquid film, which includes the liquid supplied to the frozen film and a liquid generated by the thawing of the frozen film, and to reduce an energy of the vibration transmitted to the liquid film or stop the vibration according to a position of an upper surface of the frozen film under the liquid film.

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