公开(公告)号：US11011475B2

公开(公告)日：2021-05-18

申请号：US16564008

申请日：2019-09-09

Applicant: KABUSHIKI KAISHA TOSHIBA ,  SHIBAURA MECHATRONICS CORPORATION

Inventor： Akira Kikitsu ,  Yoshinari Kurosaki ,  Kenichiro Yamada ,  Shigeki Matsunaka

IPC: H01L23/552 ,  H01L43/02

Abstract: According to one embodiment, an electromagnetic wave attenuator includes a multilayer member, and a magnetic member. The multilayer member includes a plurality of magnetic layers and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction from the multilayer member toward the magnetic member. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A thickness along the first direction of the magnetic member is not less than ½ of a thickness along the first direction of the multilayer member.

公开(公告)号：US11710707B2

公开(公告)日：2023-07-25

申请号：US17205098

申请日：2021-03-18

Applicant: Shibaura Mechatronics Corporation

Inventor： Hisashi Nishigaki ,  Atsushi Fujita ,  Shohei Tanabe ,  Yoshinao Kamo ,  Shigeki Matsunaka

IPC: H05K9/00 ,  H01L23/552 ,  H01F10/26 ,  H01F10/30 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01F10/265 ,  H01F10/30 ,  H01L24/32 ,  H05K9/0088 ,  H01L2224/32225 ,  H01L2924/3025

Abstract: According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

公开(公告)号：US11011474B2

公开(公告)日：2021-05-18

申请号：US16562652

申请日：2019-09-06

Applicant: KABUSHIKI KAISHA TOSHIBA ,  SHIBAURA MECHATRONICS CORPORATION

Inventor： Akira Kikitsu ,  Yoshinari Kurosaki ,  Kenichiro Yamada ,  Shigeki Matsunaka

IPC: H01L23/552 ,  H01F10/30 ,  H01F10/14 ,  H01F10/16

Abstract: According to one embodiment, an electromagnetic wave attenuator includes a plurality of magnetic layers, and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A first thickness along the first direction of the one of the plurality of magnetic layers is not less than ½ times a second thickness along the first direction of the one of the plurality of nonmagnetic layers.

公开(公告)号：US20200243457A1

公开(公告)日：2020-07-30

申请号：US16564008

申请日：2019-09-09

Applicant: KABUSHIKI KAISHA TOSHIBA ,  SHIBAURA MECHATRONICS CORPORATION

Inventor： Akira KIKITSU ,  Yoshinari Kurosaki ,  Kenichiro Yamada ,  Shigeki Matsunaka

IPC: H01L23/552 ,  H01L43/02

Abstract: According to one embodiment, an electromagnetic wave attenuator includes a multilayer member, and a magnetic member. The multilayer member includes a plurality of magnetic layers and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction from the multilayer member toward the magnetic member. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A thickness along the first direction of the magnetic member is not less than ½ of a thickness along the first direction of the multilayer member.

公开(公告)号：US10244670B2

公开(公告)日：2019-03-26

申请号：US15730361

申请日：2017-10-11

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Akihiko Ito ,  Yoshinao Kamo ,  Shigeki Matsunaka ,  Atsushi Fujita

IPC: H05K9/00 ,  H01L21/56 ,  H01L21/67 ,  H01L23/552 ,  H01L21/683 ,  H01L21/687

Abstract: An electronic component, an electronic component manufacturing apparatus, and an electronic component manufacturing method are provided which enable an electromagnetic wave shielding film formed on a package to achieve an excellent shielding characteristic. An electronic component 10 includes an electromagnetic wave shielding film 13 formed on the top face of a package sealing elements. The thickness of the electromagnetic wave shielding film 13 on the top face of the package 12 is 0.5 to 9 μm, and the relationship between the average height Rc of the roughness curvature factor of the top face of the package 12 and the thickness Te of the electromagnetic wave shielding film 13 is Rc≤2Te.

公开(公告)号：US12224250B2

公开(公告)日：2025-02-11

申请号：US18328892

申请日：2023-06-05

Applicant: Shibaura Mechatronics Corporation

Inventor： Hisashi Nishigaki ,  Atsushi Fujita ,  Shohei Tanabe ,  Yoshinao Kamo ,  Shigeki Matsunaka

IPC: H05K9/00 ,  C23C14/34 ,  H01F10/26 ,  H01F10/30 ,  H01L23/00 ,  H01L23/552

Abstract: According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

公开(公告)号：US11049818B2

公开(公告)日：2021-06-29

申请号：US16564008

申请日：2019-09-09

Applicant: KABUSHIKI KAISHA TOSHIBA ,  SHIBAURA MECHATRONICS CORPORATION

Inventor： Akira Kikitsu ,  Yoshinari Kurosaki ,  Kenichiro Yamada ,  Shigeki Matsunaka

IPC: H01L23/552 ,  H01L43/02

Abstract: According to one embodiment, an electromagnetic wave attenuator includes a multilayer member, and a magnetic member. The multilayer member includes a plurality of magnetic layers and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction from the multilayer member toward the magnetic member. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A thickness along the first direction of the magnetic member is not less than ½ of a thickness along the first direction of the multilayer member.