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公开(公告)号：US20150189748A1
公开(公告)日：2015-07-02
申请号：US14413532
申请日：2013-05-30
发明人： Shusaku Iida , Takayuki Murai , Hirohiko Hirao
IPC分类号： H05K1/09 , C07F1/08 , C22C9/00 , B05D3/02 , B05D1/02 , C23C30/00 , B05D1/00 , B05D1/30 , B05D1/28 , B05D1/42 , B05D7/00 , B05D7/14 , H05K3/38 , B05D1/18
CPC分类号： H05K1/09 , B05D1/005 , B05D1/02 , B05D1/18 , B05D1/28 , B05D1/30 , B05D1/305 , B05D1/42 , B05D3/0254 , B05D7/00 , B05D7/14 , C07F1/08 , C22C9/00 , C23C18/08 , C23C30/00 , C23C30/005 , H05K3/388 , Y10T428/24917
摘要： The present invention is a copper film-forming agent containing a copper complex composed of a copper formate and a 5-membered or 6-membered nitrogen-containing heterocyclic compound having from 1 to 3 nitrogen atoms, in which the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in a substituent is from 1 to 5, and an element other than a carbon atom in the compound is not bonded to a hydrogen atom.
摘要翻译： 本发明是一种含有铜络合物的铜成膜剂，其中所述铜络合物由甲酸铜和含有1至3个氮原子的5元或6元含氮杂环化合物组成，其中含氮杂环化合物具有 一个或两个环结构，取代基中所含的碳原子总数为1至5，并且化合物中除碳原子之外的元素不与氢原子键合。
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公开(公告)号：US11472823B2
公开(公告)日：2022-10-18
申请号：US17183725
申请日：2021-02-24
发明人： Noriaki Yamaji , Takayuki Murai , Miya Tanioka , Shusaku Iida , Masato Katsumura , Takahito Imamine , Masahiko Tsujino , Tomoya Mae , Hirohiko Hirao
摘要： The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.)
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公开(公告)号：US11680076B2
公开(公告)日：2023-06-20
申请号：US16500988
申请日：2018-04-05
发明人： Takayuki Murai , Miya Tanioka , Shusaku Iida , Masato Katsumura , Noriaki Yamaji , Takahito Imamine , Masahiko Tsujino , Hirohiko Hirao
IPC分类号： C07F7/18 , C09J5/02 , C09J9/02 , C09J11/06 , H01L21/02 , H01L23/29 , H01L23/31 , H01L23/00 , H05K1/03 , H05K3/46
CPC分类号： C07F7/1804 , C07F7/1892 , C09J5/02 , C09J9/02 , C09J11/06 , H01L21/02118 , H01L23/293 , H01L23/3157 , H01L24/19 , H05K1/0346 , H05K3/4676 , H05K2203/0789 , H05K2203/0793
摘要： The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.
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公开(公告)号：US11014946B2
公开(公告)日：2021-05-25
申请号：US16648454
申请日：2018-07-31
发明人： Noriaki Yamaji , Takayuki Murai , Miya Tanioka , Shusaku Iida , Masato Katsumura , Takahito Imamine , Masahiko Tsujino , Tomoya Mae , Hirohiko Hirao
摘要： The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.)
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公开(公告)号：US10975108B2
公开(公告)日：2021-04-13
申请号：US16648454
申请日：2018-07-31
发明人： Noriaki Yamaji , Takayuki Murai , Miya Tanioka , Shusaku Iida , Masato Katsumura , Takahito Imamine , Masahiko Tsujino , Tomoya Mae , Hirohiko Hirao
摘要： The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.)
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公开(公告)号：US10405422B2
公开(公告)日：2019-09-03
申请号：US14413532
申请日：2013-05-30
发明人： Shusaku Iida , Takayuki Murai , Hirohiko Hirao
IPC分类号： B05D5/12 , H05K1/09 , C23C18/08 , B05D1/00 , B05D1/02 , B05D1/18 , B05D1/28 , B05D1/30 , B05D1/42 , B05D3/02 , B05D7/00 , B05D7/14 , C07F1/08 , C22C9/00 , C23C30/00 , H05K3/38
摘要： The present invention is a copper film-forming agent containing a copper complex composed of a copper formate and a 5-membered or 6-membered nitrogen-containing heterocyclic compound having from 1 to 3 nitrogen atoms, in which the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in a substituent is from 1 to 5, and an element other than a carbon atom in the compound is not bonded to a hydrogen atom.
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