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公开(公告)号：US20220290019A1
公开(公告)日：2022-09-15
申请号：US17636471
申请日：2020-08-04
发明人： Hidenori KOSHIKAWA
IPC分类号： C09J171/00 , C08G65/00 , C09J183/04 , C09J11/04 , C09J11/06 , C09J11/08 , C08K3/16
摘要： This curable fluoropolyether adhesive composition contains specific amounts of (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule, and having a perfluoropolyether structure in the main chain thereof, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluoro oxyalkyl group, a perfluoro alkylene group, or perfluoro oxyalkylene group, and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom. (C) sodium fluoride. (D) a platinum-group metal catalyst, and (E) an organopolysiloxane having, per molecule, a SiH group, a perfluoroalkyl group or a perfluoro oxyalkyl group, and an epoxy group and/or a trialkoxysilyl group. A cured product of the composition has good light transmission properties and good adhesion properties, and excellent rubber strength.
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公开(公告)号：US20240316910A1
公开(公告)日：2024-09-26
申请号：US18579081
申请日：2022-07-04
发明人： Hidenori KOSHIKAWA , Akihiro ENDO
CPC分类号： B32B27/08 , B32B27/36 , B32B33/00 , B32B37/24 , B32B37/26 , B32B2037/243 , B32B2037/268 , B32B2038/0076 , B32B2250/02 , B32B2255/10 , B32B2255/26 , B32B2264/1023 , B32B2264/302 , B32B2264/303 , B32B2305/30 , B32B2307/206 , B32B2307/302 , B32B2307/536 , B32B2307/7376
摘要： The present invention provides: a thermally conductive sheet product wherein both surfaces of a fluorine rubber-based thermally conductive sheet are protected from foreign substances and the like, and excellent setting workability is achieved between a heat generation member and a heat dissipation member; and a method for producing this thermally conductive sheet product.
A thermally conductive sheet product which is obtained by bonding electrically insulating films to both surfaces of a thermally conductive sheet that is formed of a cured product of a thermally conductive fluorine-containing curable composition containing
(A) a linear polyfluoro compound which comprises two or more alkenyl groups in each molecule, while having a perfluoro polyether structure in the main chain,
(B) a fluorine-containing organohydrogen siloxane which comprises a perfluoroalkyl group or a perfluorooxyalkyl group in each molecule, or alternatively comprises a perfluoroalkylene group or a perfluorooxyalkylene group, while additionally containing two or more groups (SiH groups), wherein a hydrogen atom is directly bonded to a silicon atom, in each molecule, and which does not comprise an alkoxy group that is directly bonded to a silicon atom in the molecule.
(C) a platinum group metal-based catalyst and
(D) a specific amount of a thermally conductive filler.-
3.发明申请公开(公告)号：US20180371300A1
公开(公告)日：2018-12-27
申请号：US15967669
申请日：2018-05-01
发明人： Hidenori KOSHIKAWA
IPC分类号： C09J171/02 , C09J5/06 , C08G65/00 , C08J3/24
摘要： Provided are a heat-curable fluoropolyether-based adhesive composition capable of being cured and adhering to various kinds of base materials made of, for example, a metal, ceramic and/or plastic in a short period of time; and an electric/electronic component employing the same. The composition is a heat-curable fluoropolyether-based adhesive composition having, as an adhesion imparting agent, an alicyclic epoxy group-containing and fluorine-containing organohydrogensiloxane having in one molecule: a monovalent perfluoroalkyl or perfluorooxyalkyl group(s), or a divalent perfluoroalkylene or perfluorooxyalkylene group(s); and at least one silicon atom-bonded hydrogen atom (SiH group).
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4.发明申请CURABLE COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR APPARATUS USING THE SAME 有权用于封装光学半导体的固化组合物和使用其的光学半导体装置公开(公告)号：US20130320392A1
公开(公告)日：2013-12-05
申请号：US13894849
申请日：2013-05-15
发明人： Hidenori KOSHIKAWA , Mikio SHIONO
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , C08G65/007 , C08G65/336 , C08G77/12 , C08G77/20 , C08G77/24 , C08L71/02 , C08L83/04 , C09J183/04 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3. The present invention provides a curable composition for encapsulating an optical semiconductor which gives a cured product excellent in impact resistance and adhesiveness, and an optical semiconductor apparatus in which an optical semiconductor device is encapsulated by a cured product obtained by curing the curable composition for encapsulating an optical semiconductor.
摘要翻译： 用于封装光学半导体的可固化组合物包括直链多氟化合物，具有SiH基和含氟有机基团的环状有机硅氧烷和/或具有SiH基和含氟有机基团的有机氢硅氧烷， 铂族金属催化剂，具有SiH基的环状有机硅氧烷，含氟有机基团和环氧基，以及具有一价不饱和烃基和含氟有机基团的环状有机聚硅氧烷和获得的固化物的硬度 通过由HS K6253-3调节的A型硬度计固化为30至80。 本发明提供了一种用于封装光学半导体的可固化组合物，其提供了耐冲击性和粘合性优异的固化产物，以及光学半导体装置，其中光学半导体装置被通过固化固化组合物而被固化， 光学半导体。
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公开(公告)号：US20210403709A1
公开(公告)日：2021-12-30
申请号：US17293421
申请日：2019-10-24
发明人： Hidenori KOSHIKAWA
IPC分类号： C08L71/00
摘要： Provided are: a curable fluoropolyether-based rubber composition from which a cured product having good light transmissivity and excellent rubber strength is produced; and an optical component having a cured product layer of said composition.
The curable fluoropolyether-based rubber composition contains: (A) a linear polyfluoro compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure in a main chain; (B) a fluorine-containing organohydrogen siloxane which has at least two hydrogen atoms directly bonded to a silicon atom (SiH group) and has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group or a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group in one molecule; (C) sodium fluoride; and (D) a platinum group metal-based catalyst in an amount of 0.1-2,000 ppm in terms of the mass of a platinum group metal atom with respect to component (A).-
6.发明申请公开(公告)号：US20170121583A1
公开(公告)日：2017-05-04
申请号：US15332476
申请日：2016-10-24
发明人： Hidenori KOSHIKAWA , Akihiro ENDO
CPC分类号： C09K5/08 , C08K3/22 , C08K7/18 , C08K2003/2227 , C08K2201/001 , C08K2201/005 , C08L71/00 , C08L83/04 , C09C3/12 , C09K5/14
摘要： A heat-conductive fluorinated curable composition is provided comprising (A) an alkenyl-containing linear polyfluoro compound, (B) a fluorinated organohydrogensiloxane having a fluorinated organic group and SiH groups, (C) a platinum catalyst, (D) a heat-conductive filler, and (E) a fluorinated organosilicon compound having a fluorinated organic group and an alkoxy group. The composition allows for heavy loading of the heat-conductive filler and cures into a cured product having improved oil resistance and thermal conductivity.
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7.发明公开公开(公告)号：US20230374355A1
公开(公告)日：2023-11-23
申请号：US18030623
申请日：2021-10-04
IPC分类号： C09J171/02 , C09J11/06 , H01L23/29 , H01M8/02 , B41M7/00
CPC分类号： C09J171/02 , C09J11/06 , H01L23/293 , H01M8/02 , B41M7/0027
摘要： This perfluoropolyether-based adhesive composition contains:
(A) a linear perfluoropolyether compound containing two or more alkenyl groups in one molecule and having a number average molecular weight of 2,000 or more and a weight loss ratio of 1% or less when heated at 150° C. for 1 hour;
(B) a fluorine-containing organohydrogenpolysiloxane compound which contains at least one fluorine-containing organic group, and does not contain an epoxy group and a trialkoxysilyl group, and which has a number average molecular weight of 1,000-4,000 and a weight loss ratio of 20% or less when heated at 150° C. for 1 hour;
(C) a platinum group metal compound; and
(D) an organohydrogenpolysiloxane compound which contains at least one of each of an epoxy group and/or a trialkoxysilyl group bonded to a silicon atom via a carbon atom or a carbon atom and a hydrogen atom, and which has a number average molecular weight of 700 or more,
wherein the perfluoropolyether-based adhesive composition is used to provide a cured product of a fluorine-containing elastomer which has decreased contamination of peripheral parts caused by an outgas generated during heat-curing.-
公开(公告)号：US20230112091A1
公开(公告)日：2023-04-13
申请号：US17802439
申请日：2021-02-15
发明人： Hidenori KOSHIKAWA
IPC分类号： C09J171/02 , C09J183/08 , C08G65/22 , C08G77/12 , C08G77/24 , C08G77/08 , C08G77/14 , C08K5/54
摘要： A curable fluoropolyether adhesive composition which comprises, each in a specific amount, (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule and having a perfluoropolyether structure in the main chain, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluorooxyalkyl group, a perfluoroalkylene group or a perfluorooxyalkylene group and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom, (C) a platinum-group metal catalyst, and (D) a cyclic organopolysiloxane having, per molecule, an SiH group and an epoxy group and/or a trialkoxysilyl group bonded to a silicon atom via a divalent hydrocarbon group optionally containing an oxygen atom, and not having fluorine in molecule, and a cured product of which having a thickness of 2 mm shows a transmittance to light with a wavelength of 500 nm of 80% or higher. This curable fluoropolyether adhesive composition is capable of providing a cured product having good light transmittance and high adhesiveness to glass materials.
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