公开(公告)号：US3554793A

公开(公告)日：1971-01-12

申请号：US3554793D

申请日：1968-02-20

Applicant: SIEMENS AG

Inventor： KRIEGER FRIEDRICH

IPC: B23K1/20 ,  H01R12/00 ,  H05K3/34 ,  B41M3/08 ,  H05K3/02

CPC classification number: H05K3/3468 ,  B23K1/20 ,  B23K2201/42 ,  H05K2201/1028 ,  H05K2203/044 ,  H05K2203/0723 ,  H05K2203/1105

Abstract: SOLDERING MATERIAL IS SPRAYED OVER AN ELECTRICAL CIRCUIT PATTERN POSITIONED ON AN INSULATING CARRIER. THE SOLDER IS IN THE LIQUID STATE, BUT IS BELOW THE TEMPERATURE AT WHICH THE SOLDER FORMS AN ALLOY WITH THE METAL CIRCUIT PATTERN. THE LAYER OF SOLDER IS THEN HEATED TO ITS ALLOYING TEMPERATURE CAUSING THE SOLDER TO CNTRACT, BY SURFACE TENSION, ONTO THE METAL CIRCUIT PATTERN FORMING AN ALLOY THEREWITH AND LEAVING THE INSULATING CARRIER SUBSTANTIALLY FREE OF SOLDER, WHICH COULD CAUSE A SHORT CIRCUIT.

公开(公告)号：US3887760A

公开(公告)日：1975-06-03

申请号：US43911674

申请日：1974-02-04

Applicant: SIEMENS AG

Inventor： KRIEGER FRIEDRICH ,  STEIN CHRISTIAN

IPC: H01L21/60 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3468 ,  H01L23/538 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/014 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/017 ,  H05K2201/09727 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2203/044 ,  Y02P70/611

Abstract: A layer circuit arranged to receive semiconductor modules by soldering, the circuit having at least one conductor path extending therealong with a solder platform at one end of the conductor path. A layer is positioned transversely across the conductor path beyond the solder platform but extends across the conductor path less than the width of the path. This layer is incapable of tinning so that it separates the solder platform at the end of the conductor path from the remainder of the path by a relatively narrow constriction.

Abstract translation: 布置成通过焊接来接收半导体模块的层电路，所述电路具有至少一个导体路径，在导体路径的一端具有与焊料平台一起延伸的导体路径。 一个层横向穿过导体路径定位超过焊接平台，但延伸穿过导体路径小于路径的宽度。 该层不能镀锡，使得其在导体路径末端的焊料平台与路径的其余部分相隔较窄的收缩部分。