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公开(公告)号:US20210261790A1
公开(公告)日:2021-08-26
申请号:US17306586
申请日:2021-05-03
Applicant: SILCOTEK CORP.
Inventor: Geoffrey K. WHITE , Nikolis Austin SNYDER , Nicholas Peter DESKEVICH , Gary A. BARONE , David A. SMITH , Lucas D. PATTERSON , Martin E. HIGGINS
IPC: C09D5/08 , C23C16/34 , C23C16/40 , C23C16/32 , C23C16/54 , C23C16/46 , C09D1/00 , C09D183/04 , C09D183/16
Abstract: A coated system for containing or conveying a hydrogen-containing fluid including a hydrogen susceptible metallic substrate and a coating on the hydrogen susceptible metallic substrate. The hydrogen-containing fluid is in contact with the coating and the coating reduces or eliminates the effect of hydrogen on the hydrogen susceptible metallic substrate. A coating process for coating a hydrogen susceptible metallic substrate is also disclosed.
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公开(公告)号:US20230074641A1
公开(公告)日:2023-03-09
申请号:US17795081
申请日:2021-01-22
Applicant: SILCOTEK CORP.
Inventor: Jesse BISCHOF , Martin E. HIGGINS , Thomas WINTER
Abstract: Pharmaceutical manufacturing processes and products are disclosed. A pharmaceutical manufacturing process includes flowing a liquid through a pathway. The liquid contacts a non-polymeric coating on a substrate within the pathway. The substrate is a metal or metallic substrate. A pharmaceutical product is produced by flowing a liquid through a pathway. The liquid contacts a non-polymeric coating on a substrate within the pathway. The substrate is a metal or metallic substrate.
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公开(公告)号:US20230383126A1
公开(公告)日:2023-11-30
申请号:US18331647
申请日:2023-06-08
Applicant: SILCOTEK CORP.
Inventor: David A. SMITH , James B. MATTZELA , Paul H. SILVIS , Gary A. BARONE , Martin E. HIGGINS
CPC classification number: C09D5/00 , C23C16/30 , C23C16/56 , C23C16/401 , Y10T428/31612 , C23C16/0272 , C23C16/18 , Y10T428/265 , Y10T428/31663 , C23C30/00
Abstract: Amorphous coatings and coated articles having amorphous coatings are disclosed. The amorphous coating comprises a first layer and a second layer, the first layer being proximal to a metal substate compared to the second layer, the second layer being distal from the metal substrate compared to the first layer. The first layer and the second layer comprise carbon, hydrogen, and silicon. The first layer further comprises oxygen.
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