公开(公告)号：US20040238923A1

公开(公告)日：2004-12-02

申请号：US10797971

申请日：2004-03-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Te-Haw Lee ,  Kaun-I Cheng ,  Yueh-Chiung Chang ,  Shih-Yao Liu ,  Kun-Ming Huang

IPC: H01L023/495

CPC classification number: H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A surface-mount-enhanced lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein a dam bar structure between any two neighboring lead frames of a lead frame module plate is formed with an indentation and at least a solder metal layer is applied on the bottom surface of the lead frame and the indentation. A singulation process is performed along the indentation to separate the lead frame module plate mounted with semiconductor chips and package body into a plurality of packages. Therefore, the indentation and the solder metal layer applied thereon can provide solder paste improved wettability and increased solder surface, while the semiconductor package with the lead frame is mounted on an external device via a surface-mount-technology, so as to prevent problems of signal transmission owing to separation of solder joint from solder open.

Abstract translation: 提出了一种表面贴装增强引线框架和一种用于制造具有引线框架的半导体封装件的方法，其中引线框架模块板的任何两个相邻引线框架之间的阻挡坝结构形成有凹陷，并且至少形成焊料 金属层被施加在引线框架的底面和压痕上。 沿着压痕执行单个处理以将安装有半导体芯片和封装体的引线框模块板分离成多个封装。 因此，通过表面安装技术将引线框架的半导体封装安装在外部装置上，因此，施加在其上的凹陷和焊料金属层可以提供焊膏改善的润湿性和增加的焊接表面，以防止 由于焊点与焊料的分离而引起的信号传输。

公开(公告)号：US20030124834A1

公开(公告)日：2003-07-03

申请号：US10075043

申请日：2002-02-12

Applicant: Siliconware Precision Industries Co., Ltd.,

Inventor： David Tseng ,  Chien-Ping Huang ,  Kun-Ming Huang

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H01L22/20 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A method and a system of wire bonding for use in semiconductor package fabrication are proposed. When one wire-bonded substrate unit of a substrate mounted with chips is introduced into a testing region, a next adjacent substrate unit is simultaneously formed with bonding wires in a wire-bonding region. In the testing region, the wire-bonded substrate unit is tested for wire bonding quality. If no wire opening or short occurs, the wire-bonded substrate unit is readily used for subsequent package fabrication. If wire opening or short is detected, a controlling module associated with the testing region generates a control signal to the wire-bonding region for interrupting a wire-bonding process, whereby causes of wire opening or short are overcome, and defective bonding wires are reworked. Therefore, inferiors or malfunction is timely detected, making overall fabrication process more time-effectively implemented; and inferiors are reworked for later usage, thereby significantly reducing fabrication costs.

Abstract translation: 提出了一种用于半导体封装制造的引线接合方法和系统。 当安装有芯片的基板的一个引线键合衬底单元被引入到测试区域中时，下一个相邻的衬底单元在引线接合区域中同时形成有接合线。 在测试区域中，对引线键合衬底单元进行线焊接质量测试。 如果没有发生导线开路或短路，则线接合基板单元容易用于随后的封装制造。 如果检测到电线断路或短路，则与测试区域相关联的控制模块产生对引线接合区域的控制信号，用于中断引线接合工艺，从而克服导线开路或短路的原因，并且对焊接线进行重新加工 。 因此，及时检测到下级或故障，使整体制作过程更加时间有效地实现; 并且为了稍后的使用而改造下层，从而显着降低制造成本。