Semiconductor integrated circuit system and method for driving the same
    2.
    发明授权
    Semiconductor integrated circuit system and method for driving the same 有权
    半导体集成电路系统及其驱动方法

    公开(公告)号:US08879313B2

    公开(公告)日:2014-11-04

    申请号:US14297243

    申请日:2014-06-05

    Applicant: SK Hynix Inc.

    Abstract: A semiconductor integrated circuit system includes a phase-change line including a first phase-change area constituting a first memory cell and a second phase-change area constituting a second memory cell, a write current providing unit configured to phase-change a selected one of the first and second phase-change areas, and a phase-change compensation unit configured to restore the other of the first and second phase-change areas by compensating for a dummy phase-change caused in the other phase-change area due to a phase-change of the selected phase-change area.

    Abstract translation: 一种半导体集成电路系统包括:相变线,包括构成第一存储单元的第一相变区和构成第二存储单元的第二相变区;写入电流提供单元,被配置为对 第一相变区和第二相变区,以及相变补偿单元,被配置为通过补偿由于相位而在另一个相变区域中引起的虚拟相位变化来恢复第一和第二相变区域中的另一个 - 所选择的相变区域的更换。

    Method for manufacturing semiconductor device

    公开(公告)号:US10797239B2

    公开(公告)日:2020-10-06

    申请号:US16413491

    申请日:2019-05-15

    Applicant: SK hynix Inc.

    Abstract: A method for forming a semiconductor device is disclosed. The method for forming the semiconductor device includes forming a first sacrificial film over a target layer to be etched, forming a first partition mask over the first sacrificial film, forming a first sacrificial film pattern by etching the first sacrificial film using the first partition mask, forming a first spacer at a sidewall of the first sacrificial film pattern, and forming a first spacer pattern by removing the first sacrificial film pattern. The first partition mask includes a plurality of first line-shaped space patterns extending in a first direction. A width of at least one space pattern located at both edges from among the plurality of first space patterns is smaller than a width of each of other space patterns.

    Method for manufacturing semiconductor device

    公开(公告)号:US11183635B2

    公开(公告)日:2021-11-23

    申请号:US17010194

    申请日:2020-09-02

    Applicant: SK hynix Inc.

    Abstract: A method for forming a semiconductor device is disclosed. The method for forming the semiconductor device includes forming a first sacrificial film over a target layer to be etched, forming a first partition mask over the first sacrificial film, forming a first sacrificial film pattern by etching the first sacrificial film using the first partition mask, forming a first spacer at a sidewall of the first sacrificial film pattern, and forming a first spacer pattern by removing the first sacrificial film pattern. The first partition mask includes a plurality of first line-shaped space patterns extending in a first direction. A width of at least one space pattern located at both edges from among the plurality of first space patterns is smaller than a width of each of other space patterns.

    ELECTRONIC DEVICE
    7.
    发明申请

    公开(公告)号:US20210184101A1

    公开(公告)日:2021-06-17

    申请号:US16991645

    申请日:2020-08-12

    Applicant: SK hynix Inc.

    Abstract: An electronic device may include a semiconductor memory, and the semiconductor memory may include a multilayer synthetic anti-ferromagnetic (Multi SAF) structure including a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer interposed between the first ferromagnetic layer and the second ferromagnetic layer, wherein the spacer layer may include n non-magnetic layers and n−1 magnetic layers that are disposed such that each of the n non-magnetic layers and each of the n−1 magnetic layers are alternately stacked, wherein n indicates an odd number equal to or greater than 3, wherein the n−1 magnetic layers and n non-magnetic layers may be configured to effectuate an antiferromagnetic exchange coupling with at least one of the first ferromagnetic layer and the second ferromagnetic layer.

    Switching device, and resistive random access memory including the same as a selection device

    公开(公告)号:US10217797B2

    公开(公告)日:2019-02-26

    申请号:US15789712

    申请日:2017-10-20

    Applicant: SK hynix Inc.

    Abstract: A switching device includes a first electrode, a switching layer having a non-memory characteristic, and a second electrode that are disposed over a substrate. The switching layer includes an oxide of a first atom or a nitride of the first atom, and a second atom is doped in the oxide or the nitride. The second atom forms a trap site trapping a conductive carrier in the switching layer when a voltage having an absolute value that is smaller than an absolute value of a predetermined threshold voltage is applied between the first and the second electrodes. The second atom forms a moving path through which the conductive carrier moves between the first electrode and the second electrode when a voltage having an absolute value that is greater than an absolute value of a predetermined threshold voltage is applied between the first and the second electrodes.

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