Abstract:
A stacked semiconductor device including a plurality of semiconductor chips that are stacked and transfer signals through a plurality of through-electrodes, wherein at least one of the semiconductor chips comprises a first clock generation circuit suitable for generating first and second test clocks by dividing or buffering an external clock according to an operating information signal for indicating a high-speed test operation and a low-speed test operation; a first latch circuit suitable for latching a test control signal according to the first and second test clocks to generate first and second latched signals; and an input signal control circuit suitable for generating first and second internal control signals by re-latching the second latched signal according to the first test clock, and re-latching the first latched signal according to the second test clock.
Abstract:
A memory includes: first to Nth areas refreshed based on first to Nth refresh control signals, respectively; a control signal generation circuit suitable for generating the second to Nth refresh control signals by sequentially delaying the first refresh control signal, and generating the first refresh control signal by delaying the Nth refresh control signal; an address counter suitable for changing a refresh address, corresponding to each round for activations of the first to Nth refresh control signals, based on the Nth refresh control signal; and a refresh stop circuit suitable for stopping a refresh operation when the round is repeated by a predetermined number.
Abstract:
A memory may include a plurality of word lines, a target address generation unit suitable for generating one or more target addresses by using a stored address, a refresh control section suitable for activating a refresh signal in response to a refresh command that is periodically inputted and periodically activating the refresh signal in a self-refresh mode, a target refresh control section suitable for activating a target refresh signal when the refresh signal is activated M times, wherein the M is a natural number, and deactivating the target refresh signal in the self-refresh mode and a row control section suitable for sequentially refreshing the plurality of word lines in response to the refresh signal and refreshing a word line corresponding to the target address in response to the refresh signal when the target refresh signal is activated.
Abstract:
A stacked semiconductor device includes semiconductor chips, each including a signal transfer circuit respectively transferring a command, an address, and a chip select signal to first to third through electrodes, and respectively transferring a test address and a chip ID to the second and third through electrodes according to a test control signal; a command reception circuit transferring a test command or a signal transferred from the first through electrode to an internal circuit when a signal transferred from the third through electrode is identical to the chip ID coincide with each other; and a test control circuit activating the test control signal according to deactivation of a test control signal of an upper chip, and generating the test command and the test address according to the test control signal.
Abstract:
An operating method of a memory device including a plurality of memory cells may include: measuring data retention times of at least a portion of the plurality of memory cells; and optimizing a refresh operation on the plurality of memory cells using the measurement result.
Abstract:
A delay circuit may include a fine timing measurement unit suitable for measuring fine timing information on whether an input signal corresponds to the timing of any one of an even cycle or an odd cycle based on a clock, a coarse delay unit suitable for delaying the input signal whose fine timing has been measured by the fine timing measurement unit in synchronization with a frequency divided clock and outputting a delayed signal, and a fine timing application unit suitable for applying the fine timing information to the delayed signal of the coarse delay unit.
Abstract:
A semiconductor memory device includes a clock signal generation unit suitable for dividing an external clock signal to generate a first internal clock signal corresponding to odd number periods of the external clock signal and a second internal clock corresponding to even number periods, a first input unit suitable for receiving an external command signal and an external address signal in response to the first internal clock signal, a second input unit suitable for receiving the external command signal and the external address signal in response to the second internal clock signal, and an operation control unit suitable for enabling one of the first input unit and the second input unit and disabling the other of the first input unit and the second input unit, during a gear-down mode.
Abstract:
A refresh control circuit includes an internal chip information unit configured to provide internal chip information related to a retention characteristic of a memory cell, a mode information modification unit configured to output modified mode information based on the internal chip information, wherein the modified mode information represent a number of memory banks for refresh operation, and a selection signal activation unit configured to activate one or more of selection signals for selecting corresponding one or more of the memory banks in response to the modified mode information.
Abstract:
A memory device includes a plurality of memory blocks configured to be refreshed in response to respective refresh signals; a command decoder configured to decode an external input command to generate an internal refresh command; a refresh control unit configured to activate a first number of refresh signals corresponding to the first number of memory blocks when the internal refresh command is activated and a first mode is set, and to activate a second number of refresh signals corresponding to the second number of memory blocks when the internal refresh command is activated and a second mode is set, the second number being smaller than the first number; and an address counter configured to change the row address transferred to the memory blocks when a predetermined one of the refresh signals is activated.
Abstract:
A memory device may include a temperature sensor suitable for generating temperature information and a smart refresh circuit suitable for activating a smart refresh signal when an internal refresh signal is activated a set number of times, and controlling the set number based on the temperature information.