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    IMAGE SENSOR AND ELECTRONIC DEVICE HAVING THE SAME
    1.
    发明申请
    IMAGE SENSOR AND ELECTRONIC DEVICE HAVING THE SAME 有权
    图像传感器和具有该图像传感器的电子设备

    公开(公告)号：US20160351605A1

    公开(公告)日：2016-12-01

    申请号：US14818740

    申请日：2015-08-05

    Applicant: SK hynix Inc.

    Inventor： Yun-Hui YANG

    IPC: H01L27/146 ,  G01J1/44

    CPC classification number: H01L27/14607 ,  G01J1/0209 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/44 ,  G01J3/0208 ,  G01J3/0259 ,  G01J3/0262 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627

    Abstract: An image sensor includes a substrate including photoelectric conversion elements for a plurality of unit pixels, which are two-dimensionally arranged in a pixel array; a light transmission member on the substrate; a grid structure in the light transmission member and having multiple layers; and a light collection member on the light transmission member, wherein the grid structure is tilted for respective chief ray angles of the plurality of unit pixels according to locations of the plurality of unit pixels in the pixel array.

    Abstract translation: 图像传感器包括：基板，包括用于多个单位像素的光电转换元件，二维排列成像素阵列; 在所述基板上的透光构件; 在透光构件中具有多个层的栅格结构; 以及在所述光透射部件上的光收集部件，其中，根据所述像素阵列中的所述多个单位像素的位置，所述栅格结构针对所述多个单位像素的各自的主光线角度倾斜。

    IMAGE SENSOR HAVING TEST PATTERN AND OFFSET CORRECTION METHOD THEREOF
    3.
    发明申请
    IMAGE SENSOR HAVING TEST PATTERN AND OFFSET CORRECTION METHOD THEREOF 有权

    公开(公告)号：US20180035107A1

    公开(公告)日：2018-02-01

    申请号：US15454531

    申请日：2017-03-09

    Applicant: SK hynix Inc.

    Inventor： Yun-Hui YANG ,  Donghyun WOO ,  Jong-Chae KIM

    IPC: H04N17/00

    CPC classification number: H04N17/002 ,  H01L27/14603 ,  H01L27/14616 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14641

    Abstract: An image sensor includes a substrate including an active pixel and a test pattern, wherein the test pattern is located adjacent to the active pixel, wherein the active pixel comprises a first photodiode, a floating diffusion, a first channel provided between the first photodiode and the floating diffusion, and a first transfer gate electrode provided over the first channel, wherein the test pattern comprises a first test photodiode, a test floating diffusion, a second channel provided between the first test photodiode and the test floating diffusion, a first test transfer gate electrode provided over the second channel, and a first contact plug connected to the first test photodiode, and wherein the first test photodiode, the test floating diffusion, the second channel, and the first test transfer gate have substantially the same alignment errors as the first photodiode, the floating diffusion, the first channel, and the first transfer gate electrode, respectively.

    IMAGE SENSOR
    5.
    发明申请
    IMAGE SENSOR 审中-公开

    公开(公告)号：US20170287959A1

    公开(公告)日：2017-10-05

    申请号：US15215770

    申请日：2016-07-21

    Applicant: SK hynix Inc.

    Inventor： Pyong-Su KWAG ,  Yun-Hui YANG ,  Young-Jun KWON

    IPC: H01L27/146 ,  H04N5/378

    CPC classification number: H01L27/14616 ,  H01L27/14614 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14638 ,  H01L27/14645 ,  H01L27/14689 ,  H04N5/378

    Abstract: An image sensor may include: a photoelectric conversion element including a second conductive layer formed over a first conductive layer; an insulating layer and a third conductive layer which are sequentially formed over the second conductive layer; an opening exposing the second conductive layer through the third conductive layer and the insulating layer; a channel layer formed along the surface of the opening, and including first and second channel layers which are coupled to each other while having different conductivity types; and a transfer gate formed over the channel layer to fill the opening, and partially formed over the third conductive layer.

    IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
    6.
    发明申请
    IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME 审中-公开

    公开(公告)号：US20190088700A1

    公开(公告)日：2019-03-21

    申请号：US15972703

    申请日：2018-05-07

    Applicant: SK hynix Inc.

    Inventor： Yun-Hui YANG

    IPC: H01L27/146

    CPC classification number: H01L27/14623 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14689

    Abstract: This technology relates to an image sensor. The image sensor includes a substrate including a photoelectric transformation element, the substrate includes a first surface and a second surface faced to the first surface; first and second shielding layers overlapped to photoelectric transformation element and formed over the first and second surfaces, respectively; and a third shielding layer surrounding the photoelectric transformation element and contacted to the first and second shielding layers by penetrating the substrate.

    IMAGE SENSING DEVICE AND METHOD FOR DRIVING THE SAME
    7.
    发明申请
    IMAGE SENSING DEVICE AND METHOD FOR DRIVING THE SAME 有权

    公开(公告)号：US20170208282A1

    公开(公告)日：2017-07-20

    申请号：US15152339

    申请日：2016-05-11

    Applicant: SK hynix Inc.

    Inventor： Pyong-Su KWAG ,  Sung-Kun PARK ,  Yun-Hui YANG

    IPC: H04N5/376

    CPC classification number: H04N5/3765 ,  H04N5/3597

    Abstract: An image sensing device includes: a floating diffusion node; an initialization block suitable for initializing the floating diffusion node with a first voltage, based on an initialization control signal; a boosting block suitable for boosting the floating diffusion node with a second voltage, based on a boost control signal; a photodiode suitable for generating a photocharge based on incident light; a transmission block suitable for transmitting the photocharge to the floating diffusion node based on a transmission control signal; and a selection block suitable for generating a pixel signal corresponding to a voltage loaded on the floating diffusion node based on a selection control signal.

    STACKED IMAGE SENSOR HAVING AN AIR GAP
    8.
    发明申请
    STACKED IMAGE SENSOR HAVING AN AIR GAP 审中-公开

    公开(公告)号：US20180069037A1

    公开(公告)日：2018-03-08

    申请号：US15464631

    申请日：2017-03-21

    Applicant: SK hynix Inc.

    Inventor： Yun-Hui YANG ,  Seon-Man HWANG

    IPC: H01L27/146

    CPC classification number: H01L27/1463 ,  H01L27/14612 ,  H01L27/14643

    Abstract: A stacked image sensor includes: a lower device including a lower inter-layer dielectric layer over an upper surface of a lower substrate, and a lower capping layer over the lower inter-layer dielectric layer; an upper device stacked over the lower device, including photodiodes in an upper substrate, an upper inter-layer dielectric layer below a lower surface of the upper substrate, and an upper capping layer below the upper inter-layer dielectric layer; and an air gap formed between the lower inter-layer dielectric layer and the upper inter-layer dielectric layer.

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