公开(公告)号：US10083903B1

公开(公告)日：2018-09-25

申请号：US15201575

申请日：2016-07-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

IPC: H01L23/52 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.