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公开(公告)号：US09892994B2
公开(公告)日：2018-02-13
申请号：US14946502
申请日：2015-11-19
CPC分类号： H01L23/3733 , B29C65/4855 , B29C65/4865 , B29C65/54 , H01L21/561 , H01L21/565 , H01L21/78 , H01L23/373 , H01L23/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L24/97 , H01L2224/29082 , H01L2224/29099 , H01L2224/29193 , H01L2224/292 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32221 , H01L2224/32245 , H01L2224/83855 , H01L2224/83862 , H01L2224/94 , H01L2924/13055 , H01L2924/13091 , Y10T428/30 , H01L2924/00 , H01L2224/27 , H01L2924/014
摘要： An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.
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公开(公告)号：US12046655B2
公开(公告)日：2024-07-23
申请号：US17161059
申请日：2021-01-28
IPC分类号： H01L29/45 , H01L21/285 , H01L29/10 , H01L29/66 , H01L29/78
CPC分类号： H01L29/45 , H01L21/28518 , H01L29/1095 , H01L29/66734 , H01L29/7813
摘要： A vertical conduction electronic power device includes a body delimited by a first and a second surface and having an epitaxial layer of semiconductor material, and a substrate. The epitaxial layer is delimited by the first surface of the body and the substrate is delimited by the second surface of the body. The epitaxial layer houses at least a first and a second conduction region having a first type of doping and a plurality of insulated-gate regions, which extend within the epitaxial layer. The substrate has at least one silicide region, which extends starting from the second surface of the body towards the epitaxial layer.
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公开(公告)号：US20170125173A1
公开(公告)日：2017-05-04
申请号：US15164702
申请日：2016-05-25
CPC分类号： H01G11/18 , H01G11/08 , H01G11/14 , H01G11/22 , H01G11/52 , H01G11/78 , H01G11/82 , Y02E60/13
摘要： A supercapacitor including: a shell; a chamber in the shell; a first electrode and a second electrode on respective walls of the chamber; and a separator arranged between the first electrode and the second electrode through the chamber. The separator includes a first perforated membrane and a second perforated membrane, which is movable with respect to the first membrane between a first position, in which the first membrane and the second membrane are separate and a second position, in which the first membrane and the second membrane are in contact and coupled for rendering the separator impermeable.
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4.发明申请GRAPHENE BASED FILLER MATERIAL OF SUPERIOR THERMAL CONDUCTIVITY FOR CHIP ATTACHMENT IN MICROSTRUCTURE DEVICES 审中-公开基于石墨的填充材料在微结构器件中芯片连接的超导热导率公开(公告)号：US20140287239A1
公开(公告)日：2014-09-25
申请号：US14215597
申请日：2014-03-17
IPC分类号： H01L23/373 , B29C65/48 , B29C65/54
CPC分类号： H01L23/3733 , B29C65/4855 , B29C65/4865 , B29C65/54 , H01L21/561 , H01L21/565 , H01L21/78 , H01L23/373 , H01L23/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L24/97 , H01L2224/29082 , H01L2224/29099 , H01L2224/29193 , H01L2224/292 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32221 , H01L2224/32245 , H01L2224/83855 , H01L2224/83862 , H01L2224/94 , H01L2924/13055 , H01L2924/13091 , Y10T428/30 , H01L2924/00 , H01L2224/27 , H01L2924/014
摘要： An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.
摘要翻译： 微结构器件中的集成电路芯片附件通过使用其中掺入石墨烯薄片的基于粘合剂的材料来实现。 这导致优异的导热性。 控制石墨烯薄片的空间取向，例如通过将极性分子粘附到石墨烯薄片上并将薄片暴露于外部力场，使得石墨烯薄片在集成电路芯片的下方具有期望的取向，并且与集成电路芯片 以上集成电路芯片。
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公开(公告)号：US10128057B2
公开(公告)日：2018-11-13
申请号：US15164702
申请日：2016-05-25
摘要： A supercapacitor including: a shell; a chamber in the shell; a first electrode and a second electrode on respective walls of the chamber; and a separator arranged between the first electrode and the second electrode through the chamber. The separator includes a first perforated membrane and a second perforated membrane, which is movable with respect to the first membrane between a first position, in which the first membrane and the second membrane are separate and a second position, in which the first membrane and the second membrane are in contact and coupled for rendering the separator impermeable.
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6.发明申请GRAPHENE BASED FILLER MATERIAL OF SUPERIOR THERMAL CONDUCTIVITY FOR CHIP ATTACHMENT IN MICROSTRUCTURE DEVICES 审中-公开基于石墨的填充材料在微结构器件中芯片连接的超导热导率公开(公告)号：US20160079144A1
公开(公告)日：2016-03-17
申请号：US14946502
申请日：2015-11-19
IPC分类号： H01L23/373 , H01L23/42 , H01L23/00 , H01L21/56 , H01L21/78
CPC分类号： H01L23/3733 , B29C65/4855 , B29C65/4865 , B29C65/54 , H01L21/561 , H01L21/565 , H01L21/78 , H01L23/373 , H01L23/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L24/97 , H01L2224/29082 , H01L2224/29099 , H01L2224/29193 , H01L2224/292 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32221 , H01L2224/32245 , H01L2224/83855 , H01L2224/83862 , H01L2224/94 , H01L2924/13055 , H01L2924/13091 , Y10T428/30 , H01L2924/00 , H01L2224/27 , H01L2924/014
摘要： An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.
摘要翻译： 微结构器件中的集成电路芯片附件通过使用其中掺入石墨烯薄片的基于粘合剂的材料来实现。 这导致优异的导热性。 控制石墨烯薄片的空间取向，例如通过将极性分子粘附到石墨烯薄片上并将薄片暴露于外部力场，使得石墨烯薄片在集成电路芯片的下方具有期望的取向，并且与集成电路芯片 以上集成电路芯片。
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