公开(公告)号：US20140001647A1

公开(公告)日：2014-01-02

申请号：US13921894

申请日：2013-06-19

Applicant: STMicroelectronics S.r.l.

Inventor： Agatino Minotti ,  Maurizio Maria Ferrara

IPC: H01L21/56 ,  H01L23/498 ,  H01L21/78

CPC classification number: H01L21/56 ,  H01L21/02107 ,  H01L21/02109 ,  H01L21/02225 ,  H01L21/02318 ,  H01L21/78 ,  H01L23/142 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for making a set of electronic devices is proposed. The method comprises the steps of providing a support comprising a base plate of electrically conductive material, fixing a set of chips of semiconductor material onto respective portions of the base plate, each chip having a first main surface with at least one first conduction terminal and a second main surface opposite the first main surface with at least one second conduction terminal electrically connected to the base plate, fixing an insulating tape of electrically insulating material comprising a plurality of through-holes to the main surface of each chip, the insulating tape protruding from the chips over a further portion of the base plate being not covered by the chips, and forming at least one first electrical contact to each first terminal of the chips through a first set of the through-holes exposing at least in part said first terminal, and at least one second electrical contact to the base plate through a second set of the through-holes exposing at least in part the further portion of the base plate.

Abstract translation: 提出了一种制造一组电子设备的方法。 该方法包括以下步骤：提供包括导电材料的基板的支撑件，将一组半导体材料的芯片固定到基板的相应部分上，每个芯片具有带有至少一个第一导电端子的第一主表面和 与第一主表面相对的第二主表面，具有与基板电连接的至少一个第二导电端子，将包括多个通孔的电绝缘材料的绝缘带固定到每个芯片的主表面，绝缘带从 基板的另一部分上的芯片不被芯片覆盖，并且通过至少部分地暴露于所述第一端子的第一组通孔形成至少一个第一电触点到芯片的每个第一端子， 以及通过第二组通孔至少部分地暴露于所述基板的至少一个第二电接触 她的底板部分。

公开(公告)号：US10964627B2

公开(公告)日：2021-03-30

申请号：US16696698

申请日：2019-11-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Maurizio Maria Ferrara ,  Fabio Vito Coppone

IPC: H01L21/44 ,  H01L21/48 ,  H01L23/495 ,  H01L23/34 ,  H01L23/00

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.

公开(公告)号：US10535587B2

公开(公告)日：2020-01-14

申请号：US14961586

申请日：2015-12-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Maurizio Maria Ferrara ,  Fabio Vito Coppone

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/00

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heat-sink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heat-sink element. The heat-sink element is formed by a heat-sink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heat-sink die towards the body and rest on the body.

公开(公告)号：US09202766B2

公开(公告)日：2015-12-01

申请号：US13871861

申请日：2013-04-26

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/34 ,  H01L25/07 ,  H01L23/433 ,  H01L23/492 ,  H01L23/495

CPC classification number: H01L23/34 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/074 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.

Abstract translation: 功率器件包括半导体材料芯片和另外的半导体材料芯片，其中至少一个功率晶体管被集成在其中; 每个芯片包括在第一表面上的第一导电端子，以及在与第一表面相对的第二表面上的第二导电端子和控制端子，以及嵌入所述芯片和所述另外的芯片的绝缘体。 在根据本公开的一个或多个实施例的解决方案中，所述芯片的第一表面面向所述另外的芯片的第二表面，并且功率器件还包括布置在所述芯片和所述另外的芯片之间的第一散热器， 与所述芯片的第一导电端子和所述另外芯片的第二导电端子耦合，所述另外芯片的控制端子与第一散热器电绝缘。

公开(公告)号：US09362142B2

公开(公告)日：2016-06-07

申请号：US13921894

申请日：2013-06-19

Applicant: STMicroelectronics S.r.l.

Inventor： Agatino Minotti ,  Maurizio Maria Ferrara

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/14 ,  H01L23/538 ,  H01L21/78 ,  H01L23/498 ,  H01L21/02

CPC classification number: H01L21/56 ,  H01L21/02107 ,  H01L21/02109 ,  H01L21/02225 ,  H01L21/02318 ,  H01L21/78 ,  H01L23/142 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for making a set of electronic devices is proposed. The method comprises the steps of providing a support comprising a base plate of electrically conductive material, fixing a set of chips of semiconductor material onto respective portions of the base plate, each chip having a first main surface with at least one first conduction terminal and a second main surface opposite the first main surface with at least one second conduction terminal electrically connected to the base plate, fixing an insulating tape of electrically insulating material comprising a plurality of through-holes to the main surface of each chip, the insulating tape protruding from the chips over a further portion of the base plate being not covered by the chips, and forming at least one first electrical contact to each first terminal of the chips through a first set of the through-holes exposing at least in part said first terminal, and at least one second electrical contact to the base plate through a second set of the through-holes exposing at least in part the further portion of the base plate.

Abstract translation: 提出了一种制造一组电子设备的方法。 该方法包括以下步骤：提供包括导电材料的基板的支撑件，将一组半导体材料的芯片固定到基板的相应部分上，每个芯片具有带有至少一个第一导电端子的第一主表面和 与第一主表面相对的第二主表面，具有与基板电连接的至少一个第二导电端子，将包括多个通孔的电绝缘材料的绝缘带固定到每个芯片的主表面，绝缘带从 基板的另一部分上的芯片不被芯片覆盖，并且通过至少部分地暴露于所述第一端子的第一组通孔形成至少一个第一电触点到芯片的每个第一端子， 以及通过第二组通孔至少部分地暴露于所述基板的至少一个第二电接触 她的底板部分。

公开(公告)号：US08890313B2

公开(公告)日：2014-11-18

申请号：US13871857

申请日：2013-04-26

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/24 ,  H01L23/495 ,  H01L23/367 ,  H01L23/433

CPC classification number: H01L23/3677 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes a first chip and a second chip, where each chip has a first conduction terminal on a first surface and a second conduction terminal on a second surface. An insulating body surrounds the first and second chip, a first heat-sink coupled with the first conduction terminals of the first and second chip, and a second heat-sink coupled with the second conduction terminals of the first and second chip. A portion of the first heat-sink and/or the second heat-sink being exposed from the insulating body. The electronic device includes a first conductive lead and a second conductive lead exposed from the insulating body for through-hole mounting of the electronic device on an electronic board, the first conductive lead being coupled with the first heat-sink and the second conductive lead being coupled with the second heat-sink.

Abstract translation: 电子设备包括第一芯片和第二芯片，其中每个芯片在第一表面上具有第一导电端子，在第二表面上具有第二导电端子。 绝缘体围绕第一和第二芯片，与第一和第二芯片的第一导电端子耦合的第一散热器和与第一和第二芯片的第二导电端子耦合的第二散热器。 第一散热器和/或第二散热器的一部分从绝缘体露出。 电子设备包括从绝缘体暴露的第一导电引线和第二导电引线，用于将电子器件通孔安装在电子板上，第一导电引线与第一散热器耦合，第二导电引线为 加上第二个散热器。

公开(公告)号：US20130285230A1

公开(公告)日：2013-10-31

申请号：US13871861

申请日：2013-04-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/074 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.

Abstract translation: 功率器件包括半导体材料芯片和另外的半导体材料芯片，其中至少一个功率晶体管被集成在其中; 每个芯片包括在第一表面上的第一导电端子，以及在与第一表面相对的第二表面上的第二导电端子和控制端子，以及嵌入所述芯片和所述另外的芯片的绝缘体。 在根据本公开的一个或多个实施例的解决方案中，所述芯片的第一表面面向所述另外的芯片的第二表面，并且功率器件还包括布置在所述芯片和所述另外的芯片之间的第一散热器， 与所述芯片的第一导电端子和所述另外芯片的第二导电端子耦合，所述另外芯片的控制端子与第一散热器电绝缘。

公开(公告)号：US20130285229A1

公开(公告)日：2013-10-31

申请号：US13871857

申请日：2013-04-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/367

CPC classification number: H01L23/3677 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes a first chip and a second chip, where each chip has a first conduction terminal on a first surface and a second conduction terminal on a second surface. An insulating body surrounds the first and second chip, a first heat-sink coupled with the first conduction terminals of the first and second chip, and a second heat-sink coupled with the second conduction terminals of the first and second chip. A portion of the first heat-sink and/or the second heat-sink being exposed from the insulating body. The electronic device includes a first conductive lead and a second conductive lead exposed from the insulating body for through-hole mounting of the electronic device on an electronic board, the first conductive lead being coupled with the first heat-sink and the second conductive lead being coupled with the second heat-sink.

Abstract translation: 电子设备包括第一芯片和第二芯片，其中每个芯片在第一表面上具有第一导电端子，在第二表面上具有第二导电端子。 绝缘体围绕第一和第二芯片，与第一和第二芯片的第一导电端子耦合的第一散热器和与第一和第二芯片的第二导电端子耦合的第二散热器。 第一散热器和/或第二散热器的一部分从绝缘体露出。 电子设备包括从绝缘体暴露的第一导电引线和第二导电引线，用于电子器件在电子板上的通孔安装，第一导电引线与第一散热器和第二导电引线相连接 加上第二个散热器。