公开(公告)号：US08963303B2

公开(公告)日：2015-02-24

申请号：US14182156

申请日：2014-02-17

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Criscione ,  Gaetano Pignataro

IPC: H01L23/495 ,  H01L23/10 ,  H01L27/02 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L27/0251 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/371 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface. The first and second transistors are electrically connected in series by having the first conduction terminals of the first and second transistors be electrically connected. The device includes a common package enclosing the first and second chips, the common package having an insulating body with a mounting surface. A heat sink is also enclosed within the insulating body, the heat sink making electrical contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together through the heat sink.

Abstract translation: 一种器件包括集成在第一和第二芯片中的第一和第二晶体管。 每个芯片具有相对的后表面和前表面，并且还具有前表面上的第一导电端子和控制端子以及后表面上的第二导电端子。 第一和第二晶体管通过使第一和第二晶体管的第一导电端子电连接而串联电连接。 该装置包括封装第一和第二芯片的公共封装，公共封装具有带有安装表面的绝缘体。 散热器也封装在绝缘体内，散热片与相应前表面上的第一和第二芯片的第一导电端子电接触，使得第一导电端子通过散热器电连接在一起。

公开(公告)号：US20140239413A1

公开(公告)日：2014-08-28

申请号：US14182156

申请日：2014-02-17

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Criscione ,  Gaetano Pignataro

IPC: H01L27/02

CPC classification number: H01L27/0251 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/371 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface. The first and second transistors are electrically connected in series by having the first conduction terminals of the first and second transistors be electrically connected. The device includes a common package enclosing the first and second chips, the common package having an insulating body with a mounting surface. A heat sink is also enclosed within the insulating body, the heat sink making electrical contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together through the heat sink.

Abstract translation: 一种器件包括集成在第一和第二芯片中的第一和第二晶体管。 每个芯片具有相对的后表面和前表面，并且还具有前表面上的第一导电端子和控制端子以及后表面上的第二导电端子。 第一和第二晶体管通过使第一和第二晶体管的第一导电端子电连接而串联电连接。 该装置包括封装第一和第二芯片的公共封装，公共封装具有带有安装表面的绝缘体。 散热器也封装在绝缘体内，散热片与相应前表面上的第一和第二芯片的第一导电端子电接触，使得第一导电端子通过散热器电连接在一起。

公开(公告)号：US09202766B2

公开(公告)日：2015-12-01

申请号：US13871861

申请日：2013-04-26

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/34 ,  H01L25/07 ,  H01L23/433 ,  H01L23/492 ,  H01L23/495

CPC classification number: H01L23/34 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/074 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.

Abstract translation: 功率器件包括半导体材料芯片和另外的半导体材料芯片，其中至少一个功率晶体管被集成在其中; 每个芯片包括在第一表面上的第一导电端子，以及在与第一表面相对的第二表面上的第二导电端子和控制端子，以及嵌入所述芯片和所述另外的芯片的绝缘体。 在根据本公开的一个或多个实施例的解决方案中，所述芯片的第一表面面向所述另外的芯片的第二表面，并且功率器件还包括布置在所述芯片和所述另外的芯片之间的第一散热器， 与所述芯片的第一导电端子和所述另外芯片的第二导电端子耦合，所述另外芯片的控制端子与第一散热器电绝缘。

公开(公告)号：US08890313B2

公开(公告)日：2014-11-18

申请号：US13871857

申请日：2013-04-26

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/24 ,  H01L23/495 ,  H01L23/367 ,  H01L23/433

CPC classification number: H01L23/3677 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes a first chip and a second chip, where each chip has a first conduction terminal on a first surface and a second conduction terminal on a second surface. An insulating body surrounds the first and second chip, a first heat-sink coupled with the first conduction terminals of the first and second chip, and a second heat-sink coupled with the second conduction terminals of the first and second chip. A portion of the first heat-sink and/or the second heat-sink being exposed from the insulating body. The electronic device includes a first conductive lead and a second conductive lead exposed from the insulating body for through-hole mounting of the electronic device on an electronic board, the first conductive lead being coupled with the first heat-sink and the second conductive lead being coupled with the second heat-sink.

Abstract translation: 电子设备包括第一芯片和第二芯片，其中每个芯片在第一表面上具有第一导电端子，在第二表面上具有第二导电端子。 绝缘体围绕第一和第二芯片，与第一和第二芯片的第一导电端子耦合的第一散热器和与第一和第二芯片的第二导电端子耦合的第二散热器。 第一散热器和/或第二散热器的一部分从绝缘体露出。 电子设备包括从绝缘体暴露的第一导电引线和第二导电引线，用于将电子器件通孔安装在电子板上，第一导电引线与第一散热器耦合，第二导电引线为 加上第二个散热器。

公开(公告)号：US20130285230A1

公开(公告)日：2013-10-31

申请号：US13871861

申请日：2013-04-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/074 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink.

Abstract translation: 功率器件包括半导体材料芯片和另外的半导体材料芯片，其中至少一个功率晶体管被集成在其中; 每个芯片包括在第一表面上的第一导电端子，以及在与第一表面相对的第二表面上的第二导电端子和控制端子，以及嵌入所述芯片和所述另外的芯片的绝缘体。 在根据本公开的一个或多个实施例的解决方案中，所述芯片的第一表面面向所述另外的芯片的第二表面，并且功率器件还包括布置在所述芯片和所述另外的芯片之间的第一散热器， 与所述芯片的第一导电端子和所述另外芯片的第二导电端子耦合，所述另外芯片的控制端子与第一散热器电绝缘。

公开(公告)号：US20130285229A1

公开(公告)日：2013-10-31

申请号：US13871857

申请日：2013-04-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristiano Gianluca Stella ,  Gaetano Pignataro ,  Maurizio Maria Ferrara

IPC: H01L23/367

CPC classification number: H01L23/3677 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device includes a first chip and a second chip, where each chip has a first conduction terminal on a first surface and a second conduction terminal on a second surface. An insulating body surrounds the first and second chip, a first heat-sink coupled with the first conduction terminals of the first and second chip, and a second heat-sink coupled with the second conduction terminals of the first and second chip. A portion of the first heat-sink and/or the second heat-sink being exposed from the insulating body. The electronic device includes a first conductive lead and a second conductive lead exposed from the insulating body for through-hole mounting of the electronic device on an electronic board, the first conductive lead being coupled with the first heat-sink and the second conductive lead being coupled with the second heat-sink.

Abstract translation: 电子设备包括第一芯片和第二芯片，其中每个芯片在第一表面上具有第一导电端子，在第二表面上具有第二导电端子。 绝缘体围绕第一和第二芯片，与第一和第二芯片的第一导电端子耦合的第一散热器和与第一和第二芯片的第二导电端子耦合的第二散热器。 第一散热器和/或第二散热器的一部分从绝缘体露出。 电子设备包括从绝缘体暴露的第一导电引线和第二导电引线，用于电子器件在电子板上的通孔安装，第一导电引线与第一散热器和第二导电引线相连接 加上第二个散热器。