CHARGE-BALANCE POWER DEVICE, AND PROCESS FOR MANUFACTURING THE CHARGE-BALANCE POWER DEVICE

    公开(公告)号:US20240429273A1

    公开(公告)日:2024-12-26

    申请号:US18825974

    申请日:2024-09-05

    Abstract: A charge-balance power device includes a semiconductor body having a first conductivity type. A trench gate extends in the semiconductor body from a first surface toward a second surface. A body region has a second conductivity type that is opposite the first conductivity type, and the body region faces the first surface of the semiconductor body and extends on a first side and a second side of the trench gate. Source regions having the first conductivity type extend in the body region and face the first surface of the semiconductor body. A drain terminal extends on the second surface of the semiconductor body. The device further comprises a first and a second columnar region having the second conductivity, which extend in the semiconductor body adjacent to the first and second sides of the trench gate, and the first and second columnar regions are spaced apart from the body region and from the drain terminal.

    NDIR DETECTOR DEVICE FOR DETECTING GASES HAVING AN INFRARED ABSORPTION SPECTRUM

    公开(公告)号:US20210215600A1

    公开(公告)日:2021-07-15

    申请号:US17217662

    申请日:2021-03-30

    Abstract: The device is formed in a casing including a support, a spacer body, and a mirror element fixed together. A light-emitting element and a light-receiving element are arranged on a bearing surface of the support and face a reflecting surface of the mirror element. The light-emitting element is configured to generate infrared radiation, and the light-receiving element is configured to receive light radiation reflected by the reflecting surface. The spacer body has an emission opening housing the light-emitting element and a reception opening housing the light-receiving element; the reception opening comprises a radiation-limitation portion configured to enable entry of reflected light radiation having an angle, with respect to a normal to the bearing surface, of less than a preset value.

    INTEGRATED CIRCUITS WITH BACKSIDE METALIZATION AND PRODUCTION METHOD THEREOF

    公开(公告)号:US20170301548A1

    公开(公告)日:2017-10-19

    申请号:US15640203

    申请日:2017-06-30

    Abstract: An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer.

    SENSOR OF VOLATILE SUBSTANCES WITH INTEGRATED HEATER AND PROCESS FOR MANUFACTURING A SENSOR OF VOLATILE SUBSTANCES
    6.
    发明申请
    SENSOR OF VOLATILE SUBSTANCES WITH INTEGRATED HEATER AND PROCESS FOR MANUFACTURING A SENSOR OF VOLATILE SUBSTANCES 有权
    具有集成加热器的挥发性物质的传感器和制造挥发性物质传感器的方法

    公开(公告)号:US20150219582A1

    公开(公告)日:2015-08-06

    申请号:US14611062

    申请日:2015-01-30

    CPC classification number: G01N27/225 G01N27/22 G01N27/223 G01N27/227

    Abstract: A sensor of volatile substances including: a sensitive layer, of a sensitive material that is permeable to a volatile substance and has an electrical permittivity depending upon a concentration of the volatile substance absorbed; a first electrode structure and a second electrode structure capacitively coupled together and arranged so that a capacitance between the first electrode structure and the second electrode structure is affected by the electrical permittivity of the sensitive material; and a supply device, configured to supply a heating current through one between the first electrode structure and the second electrode structure in a first operating condition, so as to heat the sensitive layer.

    Abstract translation: 一种挥发性物质的传感器,包括:敏感层,敏感材料,其可渗透挥发性物质,并且具有取决于所吸收挥发性物质浓度的介电常数; 第一电极结构和第二电极结构,电容耦合在一起并且布置成使得第一电极结构和第二电极结构之间的电容受到敏感材料的电介电常数的影响; 以及供给装置,被配置为在第一操作条件下,通过第一电极结构和第二电极结构之间的加热电流供应加热电流,以加热敏感层。

    MINIATURIZED OPTICAL PARTICLE DETECTOR

    公开(公告)号:US20210333195A1

    公开(公告)日:2021-10-28

    申请号:US17367160

    申请日:2021-07-02

    Abstract: A particle detector formed by a body defining a chamber and housing a light source and a photodetector. A reflecting surface is formed by a first reflecting region and a second reflecting region that have a respective curved shape. The curved shapes are chosen from among portions of ellipsoidal, paraboloidal, and spherical surfaces. The first reflecting region faces the light source and the second reflecting region faces the photodetector. The first reflecting region has an own first focus, and the second reflecting region has an own first focus. The first focus of the first reflecting region is arranged in an active volume of the body, designed for detecting particles, and the photodetector is arranged on the first focus of the second reflecting region.

    CHARGE-BALANCE POWER DEVICE, AND PROCESS FOR MANUFACTURING THE CHARGE-BALANCE POWER DEVICE

    公开(公告)号:US20210036104A1

    公开(公告)日:2021-02-04

    申请号:US16945220

    申请日:2020-07-31

    Abstract: A charge-balance power device includes a semiconductor body having a first conductivity type. A trench gate extends in the semiconductor body from a first surface toward a second surface. A body region has a second conductivity type that is opposite the first conductivity type, and the body region faces the first surface of the semiconductor body and extends on a first side and a second side of the trench gate. Source regions having the first conductivity type extend in the body region and face the first surface of the semiconductor body. A drain terminal extends on the second surface of the semiconductor body. The device further comprises a first and a second columnar region having the second conductivity, which extend in the semiconductor body adjacent to the first and second sides of the trench gate, and the first and second columnar regions are spaced apart from the body region and from the drain terminal.

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