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公开(公告)号:US09961451B2
公开(公告)日:2018-05-01
申请号:US14858997
申请日:2015-09-18
Applicant: STMicroelectronics S.r.l.
Inventor: Germano Nicollini , Silvia Adorno , Andrea Barbieri , Federica Barbieri , Sebastiano Conti , Edoardo Marino , Sergio Pernici
CPC classification number: H04R19/005 , H04R19/02 , H04R19/04 , H04R2201/003 , H04R2499/11 , H04R2499/15
Abstract: A MEMS acoustic transducer has: a detection structure, which generates an electrical detection quantity as a function of a detected acoustic signal; and an electronic interface circuit, which is operatively coupled to the detection structure and generates an electrical output quantity as a function of the electrical detection quantity. The detection structure has a first micromechanical structure of a capacitive type and a second micromechanical structure of a capacitive type, each including a membrane that faces and is capacitively coupled to a rigid electrode and defines a respective first detection capacitor and second detection capacitor; the electronic interface circuit defines an electrical connection in series of the first detection capacitor and second detection capacitor between a biasing line and a reference line, and further has a first single-output amplifier and a second single-output amplifier, which are coupled to a respective one of the first detection capacitor and the second detection capacitor and have a respective first output terminal and second output terminal, between which the electrical output quantity is present.
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公开(公告)号:US11872591B2
公开(公告)日:2024-01-16
申请号:US17118443
申请日:2020-12-10
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Silvia Adorno , Roberto Carminati
CPC classification number: B06B1/0292 , B06B1/06 , B06B1/0666 , G10K9/122
Abstract: A micro-machined ultrasonic transducer is proposed. The micro-machined ultrasonic transducer includes a membrane element for transmitting/receiving ultrasonic waves, during the transmission/reception of ultrasonic waves the membrane element oscillating, about an equilibrium position, at a respective resonance frequency. The equilibrium position of the membrane element is variable according to a biasing electric signal applied to the membrane element. The micro-machined ultrasonic transducer further comprises a cap structure extending above the membrane element; the cap structure identifies, between it and the membrane element, a cavity whose volume is variable according to the equilibrium position of the membrane element. The cap structure comprises an opening for inputting/outputting the ultrasonic waves into/from the cavity. The cap structure and the membrane element act as tunable Helmholtz resonator, whereby the resonance frequency is variable according to the volume of the cavity.
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公开(公告)号:US11051113B2
公开(公告)日:2021-06-29
申请号:US16813477
申请日:2020-03-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Fabrizio Cerini , Silvia Adorno , Federico Vercesi
IPC: H04R17/02 , B81B3/00 , B81C1/00 , H01L41/113
Abstract: A piezoelectric MEMS transducer formed in a body of semiconductor material, which has a central axis and a peripheral area and comprises a plurality of beams, transverse to the central axis and having a first end, coupled to the peripheral area of the body, and a second end, facing the central axis; a membrane, transverse to the central axis and arranged underneath the plurality of beams; and a pillar, parallel to the central axis and rigid with the second end of the beams and to the membrane. The MEMS transducer further comprises a plurality of piezoelectric sensing elements arranged on the plurality of beams.
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公开(公告)号:US11350218B2
公开(公告)日:2022-05-31
申请号:US16882343
申请日:2020-05-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Fabrizio Cerini , Silvia Adorno
IPC: H04R17/02 , H01L41/113 , B81B3/00 , B81C1/00 , H01L41/09
Abstract: A piezoelectric microelectromechanical acoustic transducer, having a semiconductor substrate with a frame portion and a through cavity defined internally by the frame portion; an active membrane, suspended above the through cavity and anchored, at a peripheral portion thereof, to the frame portion of the substrate by an anchorage structure, a plurality of piezoelectric sensing elements carried by a front surface of the active membrane so as to detect mechanical stresses of the active membrane; a passive membrane, suspended above the through cavity, underneath the active membrane, interposed between the through cavity and a rear surface of the active membrane; and a pillar element, which fixedly couples, and is centrally interposed between, the active membrane and the passive membrane. A ventilation hole passes through the entire active membrane, the passive membrane and the pillar element to set the through cavity in fluidic communication with the front surface of the active membrane.
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公开(公告)号:US09769554B2
公开(公告)日:2017-09-19
申请号:US14943848
申请日:2015-11-17
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor: Roberto Brioschi , Silvia Adorno , Kenneth Fonk
CPC classification number: H04R1/086 , B81B7/0058 , B81B7/0061 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81C1/00309 , B81C2203/0785 , H01L2224/48137 , H01L2224/48227 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006
Abstract: A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.
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公开(公告)号:US11418888B2
公开(公告)日:2022-08-16
申请号:US16749579
申请日:2020-01-22
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Fabrizio Cerini , Enri Duqi , Silvia Adorno , Lorenzo Baldo
Abstract: An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.
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公开(公告)号:US11317219B2
公开(公告)日:2022-04-26
申请号:US16693003
申请日:2019-11-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Matteo Perletti , Federico Vercesi , Silvia Adorno , Giorgio Allegato
Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
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公开(公告)号:US20160173992A1
公开(公告)日:2016-06-16
申请号:US14858997
申请日:2015-09-18
Applicant: STMicroelectronics S.r.l.
Inventor: Germano Nicollini , Silvia Adorno , Andrea Barbieri , Federica Barbieri , Sebastiano Conti , Edoardo Marino , Sergio Pernici
CPC classification number: H04R19/005 , H04R19/02 , H04R19/04 , H04R2201/003 , H04R2499/11 , H04R2499/15
Abstract: A MEMS acoustic transducer has: a detection structure, which generates an electrical detection quantity as a function of a detected acoustic signal; and an electronic interface circuit, which is operatively coupled to the detection structure and generates an electrical output quantity as a function of the electrical detection quantity. The detection structure has a first micromechanical structure of a capacitive type and a second micromechanical structure of a capacitive type, each including a membrane that faces and is capacitively coupled to a rigid electrode and defines a respective first detection capacitor and second detection capacitor; the electronic interface circuit defines an electrical connection in series of the first detection capacitor and second detection capacitor between a biasing line and a reference line, and further has a first single-output amplifier and a second single-output amplifier, which are coupled to a respective one of the first detection capacitor and the second detection capacitor and have a respective first output terminal and second output terminal, between which the electrical output quantity is present.
Abstract translation: MEMS声换能器具有:检测结构,其产生作为检测到的声信号的函数的电检测量; 以及电子接口电路,其可操作地耦合到所述检测结构并且产生作为所述电检测量的函数的电输出量。 该检测结构具有电容型的第一微机械结构和电容式的第二微机械结构,每个微机械结构均包括面对电容耦合到刚性电极并且限定相应的第一检测电容器和第二检测电容器的膜; 电子接口电路在偏置线和参考线之间限定了第一检测电容器和第二检测电容器串联的电连接,并且还具有第一单输出放大器和第二单输出放大器,其耦合到 第一检测电容器和第二检测电容器中的一个,并且具有各自的第一输出端子和第二输出端子,其间存在电输出量。
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公开(公告)号:US12068362B2
公开(公告)日:2024-08-20
申请号:US17494475
申请日:2021-10-05
Applicant: STMicroelectronics S.r.l.
Inventor: Fabrizio Cerini , Silvia Adorno , Dario Paci , Marco Salina
IPC: H01L23/522 , H01L23/528 , H01L23/538 , H01L49/02
CPC classification number: H01L28/86 , H01L23/5223
Abstract: An electrode structure includes a pad of conductive material, and a conductive strip having a first end physically and electrically coupled to the pad. The pad includes an annular element internally defining a through opening. The first end of the conductive strip is physically and electrically coupled to the annular element by a transition region so that, when the conductive strip undergoes expansion by the thermal effect, a stress spreads from the conductive strip to the annular element by the transition region.
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公开(公告)号:US10555091B2
公开(公告)日:2020-02-04
申请号:US16128288
申请日:2018-09-11
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Matteo Perletti , Federico Vercesi , Silvia Adorno , Giorgio Allegato
Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
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