公开(公告)号：US11334513B2

公开(公告)日：2022-05-17

申请号：US16819681

申请日：2020-03-16

Applicant: STMicroelectronics SA

Inventor： Pierre Busson

IPC: G06F13/40 ,  G06F13/42 ,  H02J50/10 ,  H02J50/80 ,  H04B5/00 ,  H02J7/02 ,  G06F1/16 ,  H04B1/40

Abstract: In an embodiment, a method includes receiving in parallel first data and second data; and delivering in series the first and second data, where the first data comprises electric power delivery configuration data. In some embodiments, delivering in series the first and second data includes delivering the first and second data wirelessly.

公开(公告)号：US20200293481A1

公开(公告)日：2020-09-17

申请号：US16819681

申请日：2020-03-16

Applicant: STMicroelectronics SA

Inventor： Pierre Busson

IPC: G06F13/40 ,  H02J50/10 ,  H02J50/80 ,  H04B5/00 ,  G06F13/42

Abstract: In an embodiment, a method includes receiving in parallel first data and second data; and delivering in series the first and second data, where the first data comprises electric power delivery configuration data. In some embodiments, delivering in series the first and second data includes delivering the first and second data wirelessly.

公开(公告)号：US10181654B2

公开(公告)日：2019-01-15

申请号：US14869811

申请日：2015-09-29

Applicant: STMICROELECTRONICS SA

Inventor： Jean-Francois Carpentier ,  Sébastien Pruvost ,  Patrice Garcia ,  Pierre Busson ,  Pierre Dautriche

IPC: H01Q21/00 ,  H01Q23/00 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01Q19/00 ,  H01Q19/10 ,  H01Q19/185 ,  H01L23/31 ,  H01L23/552

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

公开(公告)号：US20160020524A1

公开(公告)日：2016-01-21

申请号：US14869811

申请日：2015-09-29

Applicant: STMICROELECTRONICS SA

Inventor： Jean-Francois Carpentier ,  Sébastien Pruvost ,  Patrice Garcia ,  Pierre Busson ,  Pierre Dautriche

IPC: H01Q19/185 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01Q19/10 ,  H01Q19/00

CPC classification number: H01Q21/0087 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/13 ,  H01L2223/6677 ,  H01L2224/1319 ,  H01L2224/13582 ,  H01L2224/16225 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01Q19/005 ,  H01Q19/10 ,  H01Q19/185 ,  H01Q21/0025 ,  H01Q21/0093 ,  H01Q23/00 ,  H01L2924/00

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Abstract translation: 一种毫米波收发器，包括形成插入件的板，其具有支撑互连网络的上表面，并且其下表面旨在通过凸块组装在印刷电路板上; 组装在所述插入件的上表面上的集成电路芯片; 由形成在插入件的上表面上的轨道制成的天线; 以及在每个天线前面的印刷电路板的上表面上的反射器，考虑到插入材料的介电常数，每个天线和反射板之间的有效距离在波长的四分之一左右 。